公开(公告)号：US20060030079A1

公开(公告)日：2006-02-09

申请号：US11082899

申请日：2005-03-18

申请人： Yuan-Chang Huang ,  Tai-Hung Chen ,  Yao-Sheng Lin ,  Su-Tsai Lu

发明人： Yuan-Chang Huang ,  Tai-Hung Chen ,  Yao-Sheng Lin ,  Su-Tsai Lu

IPC分类号： H01L21/44

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a substrate with several chips whose surfaces have an optical sensitive area and bonding pads, and providing transparent layer whose surfaces have conductive circuits and scribe lines. Then the bonding pads bond to conductive circuits and a protection layer is formed on the chip to expose partly conductive circuits. Forming a conductive film on the protection layer and the conductive film contacts with the extending conductive circuits to form the wafer level package structure of optical-electronic device. At last, the transparent layer is diced according to scribe lines to form the individual package devices.

摘要翻译： 公开了一种光电子器件的晶片级封装结构及其制造方法。 光电子器件的晶片级封装结构通过采用其表面具有多个光敏区域并分成单个封装器件的衬底来提供。 制造步骤首先涉及提供具有表面具有光敏区域和接合焊盘的几个芯片的基板，并且提供其表面具有导电电路和划线的透明层。 然后，接合焊盘接合到导电电路，并且在芯片上形成保护层以暴露部分导电电路。 在保护层上形成导电膜，并且导电膜与延伸的导电电路接触以形成光电子器件的晶片级封装结构。 最后，根据划线对透明层进行切割，形成单独的封装装置。