Controller of electronic device, bus control device
    41.
    发明申请
    Controller of electronic device, bus control device 审中-公开
    电子设备控制器,总线控制装置

    公开(公告)号:US20070198886A1

    公开(公告)日:2007-08-23

    申请号:US11656965

    申请日:2007-01-24

    申请人: Takeshi Saito

    发明人: Takeshi Saito

    IPC分类号: H04L1/18

    摘要: Processing ability can be easily decreased in a processor connected by a bus to a device that is a bus master. A controller of an electronic device has a processor and a bus controller that is the bus master of the processor, the bus controller including a mode determining section that determines mode based on a state of the processor, and a performance controller that, for a prescribed mode, inserts a wait time in an acknowledgement signal to be output to the processor.

    摘要翻译: 在通过总线连接到处理器的处理器能够容易地减少到作为总线主机的设备。 电子设备的控制器具有作为处理器的总线主控器的处理器和总线控制器,总线控制器包括基于处理器的状态来确定模式的模式确定部分,以及针对规定的性能控制器 在确认信号中插入等待时间以输出到处理器。

    SOLID ELECTROLYTIC CAPACITOR, STACKED CAPACITOR USING THE SAME, AND FABRICATION METHOD THEREOF
    42.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR, STACKED CAPACITOR USING THE SAME, AND FABRICATION METHOD THEREOF 有权
    固体电解电容器,使用该固体电解电容器的堆叠电容器及其制造方法

    公开(公告)号:US20070159771A1

    公开(公告)日:2007-07-12

    申请号:US11686764

    申请日:2007-03-15

    IPC分类号: H01G9/04 H01G9/145

    摘要: On a surface-roughened aluminum foil, an aluminum oxide film as an anodic oxide film is formed. Then, a conductive polymer layer as a solid electrolyte is formed thereon and thereafter a first metal plating layer is directly formed on the conductive polymer layer, thereby forming a cathode portion. On the other hand, a second metal plating layer is formed on another portion of the surface-roughened aluminum foil, which is not subjected to anodic oxidation or which is subjected to anodic oxidation followed by polishing or formation of an anode deposition film, to thereby form an anode portion. Third metal plating layers are formed at the anode and the cathode portions to obtain a capacitor element. A plurality of capacitor elements are stacked and bonded together fusion after formation of the third metal plating layers. Alternatively the capacitor elements may be bonded together by conductive paste without the third metal layers.

    摘要翻译: 在表面粗糙化的铝箔上形成作为阳极氧化膜的氧化铝膜。 然后,在其上形成作为固体电解质的导电性聚合物层,然后在导电性聚合物层上直接形成第一金属镀层,形成阴极部。 另一方面,在不进行阳极氧化或进行阳极氧化,然后研磨或形成阳极沉积膜的表面粗糙化的铝箔的另一部分上形成第二金属镀层,由此 形成阳极部分。 在阳极和阴极部分形成第三金属镀层以获得电容器元件。 在形成第三金属镀层之后,多个电容器元件堆叠并结合在一起熔化。 或者,电容器元件可以通过导电膏而不具有第三金属层而结合在一起。

    Storage system and undo processing method
    43.
    发明申请
    Storage system and undo processing method 失效
    存储系统和撤销处理方法

    公开(公告)号:US20070112872A1

    公开(公告)日:2007-05-17

    申请号:US11337689

    申请日:2006-01-24

    申请人: Takeshi Saito

    发明人: Takeshi Saito

    IPC分类号: G06F17/30

    摘要: A storage system and an undo processing method that can facilitate undo processing for configuration change operations that have been performed for storage apparatuses by different administrators. A management server manages the history of configuration change operations it performs for storage apparatuses while a storage apparatus manages the history of configuration changes it makes in itself in accordance with the configuration change operations performed by the management server. When the storage apparatus receives a request to undo a configuration change operation from a management server, if the undo target configuration change operation or its relevant configuration change operations performed after the undo target configuration change operation have not involved a further relevant configuration change operation for another storage apparatus, the storage apparatus performs undo processing only for the configuration change made in accordance with the undo target configuration change operation, and if they have involved a further relevant configuration change operation for another storage apparatus, the storage apparatus makes a request to the management server that performed the further relevant configuration change operation to undo it.

    摘要翻译: 一种存储系统和撤销处理方法,可以方便对由不同管理员对存储设备执行的配置更改操作的撤消处理。 管理服务器根据由管理服务器执行的配置改变操作管理其对存储装置执行的配置更改操作的历史,同时存储装置根据管理服务器进行的配置改变操作来管理其自身进行的配置更改的历史。 当存储装置从管理服务器接收到撤销配置更改操作的请求时,如果在撤销目标配置改变操作之后执行的撤销目标配置改变操作或其相关配置改变操作没有涉及另一个相关的配置改变操作 存储装置仅对根据撤销目标配置改变操作进行的配置更改执行撤销处理,并且如果它们涉及另一个存储装置的进一步的相关配置改变操作,则存储装置向管理请求 服务器执行进一步的相关配置更改操作来撤消它。

    Contents transmission/reception scheme with function for limiting recipients
    45.
    发明授权
    Contents transmission/reception scheme with function for limiting recipients 有权
    具有限制收件人功能的内容发送/接收方案

    公开(公告)号:US07188245B2

    公开(公告)日:2007-03-06

    申请号:US10729964

    申请日:2003-12-09

    IPC分类号: G06F3/00

    摘要: In a contents transmission/reception system, the transmission of the contents to the corresponding reception device is permitted only in the case where the device identification information searched out by the device identification information search unit and the device identification information registered by the device identification information registration unit coincide, so that it is possible to provide the contents only to the limited reception devices, and it is possible to prevent the illegal reception of the contents.

    摘要翻译: 在内容发送/接收系统中,只有在由设备识别信息搜索单元搜索到的设备识别信息和通过设备识别信息登记登记的设备识别信息的情况下才允许向相应的接收设备发送内容 单元重合,使得可以仅向有限的接收装置提供内容,并且可以防止非法接收内容。

    Led lighting source and led lighting apparatus
    48.
    发明申请
    Led lighting source and led lighting apparatus 审中-公开
    LED照明灯具和led照明灯具

    公开(公告)号:US20070023769A1

    公开(公告)日:2007-02-01

    申请号:US10569360

    申请日:2004-09-07

    IPC分类号: H01L33/00

    摘要: An LED lighting source preventing heat deterioration and improving luminous efficiency includes a mounting substrate having a wiring pattern on a first main surface thereof and a plurality of LED bare chips, each composed of a first semiconductor layer and a second semiconductor layer having respectively different conductivity, an active layer disposed therebetween, and a metal electrode on the first semiconductor layer and substantially equal in area thereto, and each LED bare chip being joined to the wiring pattern according to flip chip mounting of the metal electrode to form a junction between the wiring pattern and the metal electrode. Each junction is formed so that an area thereof is at least 20% of the area of the metal electrode. Thermal resistance from the active layers through to a second main surface of the mounting substrate, which is a back surface thereof, is set to 3.0 9C./W or lower.

    摘要翻译: 防止热劣化和提高发光效率的LED光源包括:具有在其第一主表面上的布线图案的安装基板和多个LED裸芯片,每个LED裸芯片由具有不同导电性的第一半导体层和第二半导体层组成, 设置在其间的有源层和在第一半导体层上的金属电极,并且其面积基本相等,并且每个LED裸芯片根据金属电极的倒装芯片安装而接合到布线图案,以在布线图案 和金属电极。 形成每个结的面积至少为金属电极面积的20%。 从作为其背面的安装基板的有源层贯穿到第二主表面的热阻被设定为3.09C./W以下。