公开(公告)号：US06786632B2

公开(公告)日：2004-09-07

申请号：US10647944

申请日：2003-08-26

Applicant: Keiichi Tanaka ,  Toshimitsu Morooka

Inventor： Keiichi Tanaka ,  Toshimitsu Morooka

IPC: G01K1702

CPC classification number: G01K17/006 ,  G01J5/20 ,  G01K17/003 ,  Y10T29/49002

Abstract: It is an object to obtain a calorimeter characterized by excellent mechanical strength, and a manufacturing method thereof, when a plurality of calorimeters are arranged inside a single substrate. The calorimeter has an absorbent for converting energy of radioactive rays into heat and a resistor for converting heat into an electrical signal using superconductive transition are arranged on a membrane for determining thermal conductivity with the membrane being attached to a substrate, the substrate having a tri-layer structure comprising an etching layer, an etching stop layer and a support substrate, the membrane being arranged separated by the thickness of the etching stop layer and the etching layer.

公开(公告)号：US08769806B2

公开(公告)日：2014-07-08

申请号：US13200250

申请日：2011-09-21

Applicant: Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Toshimitsu Morooka

Inventor： Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Toshimitsu Morooka

IPC: H05B3/00

CPC classification number: H01C17/065 ,  B41J2/335 ,  B41J2/33585 ,  B41J2/3359

Abstract: In a method of manufacturing a thermal head, a groove portion is formed in one surface of at least one of a first substrate and a second substrate, and a width dimension of the groove portion is measured. The first and second substrates are bonded to each other in a stacked state so as to close an opening of the groove portion. A heating resistor is formed on a surface of the second substrate in a region opposed to the groove portion. A protective film for covering and protecting the heating resistor is formed on the surface of the second substrate. A thickness dimension of the protective film is set so as to increase with an increase in the measured width dimension of the groove portion and so as to decrease with an increase in a thickness dimension of the second substrate.

Abstract translation: 在制造热敏头的方法中，在第一基板和第二基板中的至少一个的一个表面上形成槽部，并且测量槽部的宽度尺寸。 第一和第二基板以堆叠状态彼此结合，以封闭槽部的开口。 在与槽部相对的区域中，在第二基板的表面上形成发热电阻体。 在第二基板的表面上形成用于覆盖和保护加热电阻器的保护膜。 保护膜的厚度尺寸设定为随着槽部的测量宽度尺寸的增加而增加，并且随着第二基板的厚度尺寸的增加而减小。

公开(公告)号：US08624946B2

公开(公告)日：2014-01-07

申请号：US13401891

申请日：2012-02-22

Applicant: Toshimitsu Morooka ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/335 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2/33585

Abstract: A thermal head has a support substrate including a concave portion formed in a front surface thereof. An upper substrate is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed within a region corresponding to the concave portion. A heating resistor is provided on a front surface of the upper substrate at a position straddling the convex portion. A pair of electrodes is provided on both sides of the heating resistor. At least one of the pair of electrodes has a thin portion and a thick portion. The thin portion is connected to the heating resistor at one of a side surface and a top surface of the convex portion in the region corresponding to the concave portion. The thick portion is connected to the heating resistor and is formed thicker than the thin portion.

Abstract translation: 热敏头具有包括形成在其前表面中的凹部的支撑基板。 上层基板以叠层状态接合到支撑基板的前表面，并且包括形成在与凹部对应的区域内的凸部。 在上部基板的前表面上设置有加热电阻器，该位置跨越凸部。 在加热电阻器的两侧设置一对电极。 该对电极中的至少一个具有薄的部分和较厚的部分。 在对应于凹部的区域中，薄部分与凸起部分的侧表面和顶表面中的一个处连接到加热电阻器。 厚部连接到加热电阻器，并且形成为比薄部分厚。

公开(公告)号：US08339431B2

公开(公告)日：2012-12-25

申请号：US12928261

申请日：2010-12-07

Applicant: Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji

Inventor： Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji

IPC: B41J2/335

CPC classification number: B41J2/33585 ,  B41J2/3358

Abstract: Provided is a thermal head including an intermediate layer between a support substrate and an upper substrate, which is capable of suppressing heat dissipation toward the support substrate while maintaining printing quality. Employed is a thermal head (1) including: an upper substrate (5); a support substrate (3) bonded in a stacked state on one surface side of the upper substrate (5); a heating resistor (7) provided on another surface side of the upper substrate (5); and an intermediate layer (6) including a concave portion that forms a cavity portion (4) in a region corresponding to the heating resistor (7), the intermediate layer (6) being provided between the upper substrate (5) and the support substrate (3), in which the intermediate layer (6) is formed of a plate-shaped glass material having a lower melting point than melting points of the upper substrate (5) and the support substrate (3).

Abstract translation: 提供一种热敏头，其包括在支撑基板和上基板之间的中间层，其能够在保持打印质量的同时抑制向支撑基板的散热。 使用的是热头（1），包括：上基板（5）; 在所述上基板（5）的一个表面侧以层叠状态接合的支撑基板（3）。 设置在上基板（5）的另一表面侧的发热电阻（7）; 以及包括在对应于所述加热电阻器（7）的区域中形成空腔部分（4）的凹部的中间层（6），所述中间层（6）设置在所述上​​基板（5）和所述支撑基板 （3），其中中间层（6）由具有比上基板（5）和支撑基板（3）的熔点低的熔点的板状玻璃材料形成。

公开(公告)号：US08334886B2

公开(公告)日：2012-12-18

申请号：US12804723

申请日：2010-07-28

Applicant: Norimitsu Sanbongi ,  Noriyoshi Shoji ,  Toshimitsu Morooka ,  Keitaro Koroishi

Inventor： Norimitsu Sanbongi ,  Noriyoshi Shoji ,  Toshimitsu Morooka ,  Keitaro Koroishi

IPC: B41J2/335

CPC classification number: B41J2/3355 ,  B41J2/3359

Abstract: A thermal head has a support substrate, an upper plate substrate having a back surface bonded to a top surface of the support substrate, and a heating resistor provided on the upper plate substrate. A concave portion is formed in a region of at least one of the top surface of the support substrate and the back surface of the upper plate substrate and opposes the heating resistor. A through portion is formed in the upper plate substrate and passes through the upper plate substrate from a top surface of the upper plate substrate to the top surface of the support substrate in a plate thickness direction. The upper plate substrate functions as a heat accumulating layer, and the concave portion functions as a heat insulating layer.

Abstract translation: 热敏头具有支撑基板，具有与支撑基板的顶面接合的背面的上板基板和设置在上板基板上的发热电阻。 在支撑基板的上表面和上板基板的背面中的至少一个的区域中形成有凹部，与该加热电阻相对。 在上板基板上形成贯通部，从上板基板的顶面到板厚方向的支承基板的上表面贯通上板基板。 上板基板用作蓄热层，凹部用作隔热层。

公开(公告)号：US08257599B2

公开(公告)日：2012-09-04

申请号：US12592866

申请日：2009-12-03

Applicant: Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Yoshinori Sato

Inventor： Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Yoshinori Sato

IPC: H01L21/302 ,  H01L21/461 ,  H01L21/31 ,  H01L21/469 ,  G01D15/00 ,  G11B5/127 ,  C03C15/00 ,  C03C25/68

CPC classification number: B41J2/33585 ,  B41J2/3359

Abstract: In a thermal head manufacturing method, at least one concave portion is formed on a surface of a first substrate, and a second substrate comprised of a first layer and a second layer that is denser and harder than the first layer is provided. The first and second substrates are bonded to one another so that the second layer of the second substrate covers the concave portion of the first substrate. The first layer of the second substrate is then etched until a surface of the second layer of the second substrate is exposed. At least one heating resistor is formed on the exposed surface of the second layer of the second substrate after the etching step so that the heating resistor is disposed over the concave portion of the first substrate.

Abstract translation: 在热头制造方法中，在第一基板的表面上形成至少一个凹部，并且设置由比第一层更致密且硬的第一层和第二层构成的第二基板。 第一和第二基板彼此接合，使得第二基板的第二层覆盖第一基板的凹部。 然后蚀刻第二衬底的第一层，直到第二衬底的第二层的表面露出。 在蚀刻步骤之后，在第二基板的第二层的暴露表面上形成至少一个加热电阻器，使得加热电阻器设置在第一基板的凹部上。

公开(公告)号：US08212849B2

公开(公告)日：2012-07-03

申请号：US12797980

申请日：2010-06-10

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/3359 ,  Y10T29/49083

Abstract: There are provided a method of manufacturing a thermal head having a hollow portion at a position opposing a heating resistor, the manufacturing method assuring a sufficient strength to an upper plate substrate of the thermal head. The manufacturing method includes: processing a top surface of the upper plate substrate bonded to a support substrate to thin the upper plate substrate to a thickness T; wherein the processing comprises processing the top surface of the upper plate substrate so that a roughness Ra of the top surface of the upper plate substrate satisfies the following expression: Ra≦loge(T2)/(3×106)+6.5×10−6.

Abstract translation: 提供了一种在与加热电阻器相对的位置处制造具有中空部分的热敏头的方法，该制造方法确保了对热敏头的上板基板具有足够的强度。 该制造方法包括：处理结合到支撑基板上的上板基板的上表面，将上板基板薄化成厚度T; 其特征在于，所述处理包括：对所述上板基板的上表面进行处理，使得所述上板基板的上表面的粗糙度Ra满足下式：Ra＆nlE; loge（T2）/（3×106）+6.5×10-6 。

公开(公告)号：US08189019B2

公开(公告)日：2012-05-29

申请号：US12613887

申请日：2009-11-06

Applicant: Keitaro Koroishi ,  Noriyoshi Shoji ,  Toshimitsu Morooka ,  Norimitsu Sanbongi ,  Yoshinori Sato

Inventor： Keitaro Koroishi ,  Noriyoshi Shoji ,  Toshimitsu Morooka ,  Norimitsu Sanbongi ,  Yoshinori Sato

IPC: B41J2/335

CPC classification number: B41J2/33525 ,  B41J2/33585

Abstract: To improve printing quality and reduce manufacturing cost, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity portion (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The adhesive layer (12) includes a first adhesive layer (12a) laminated on the surface of the supporting substrate (11) and a second adhesive layer (12b) laminated on a surface of the heat storage layer (13). The elastic material constituting the second adhesive layer (12b) is arranged so that the elastic material is in a bonded state with respect to at least a part of the surface of the heat storage layer (13) opposed to the cavity portion (19).

Abstract translation: 为了提高打印质量并降低制造成本，多个加热电阻器（14）通过经由粘合剂层（12）层叠在支撑基板（11）的表面上的储热层（13）上布置有空隙， 弹性材料。 在支撑基板（11）和蓄热层（13）之间的区域形成有空腔部分（19），该区域与多个加热电阻器（14）中的每一个的发热部分相对。 粘合剂层（12）包括层叠在支撑基板（11）的表面上的第一粘合层（12a）和层叠在蓄热层（13）的表面上的第二粘接层（12b）。 构成第二粘合层（12b）的弹性材料被布置成使得弹性材料相对于与空腔部分（19）相对的储热层（13）的表面的至少一部分处于接合状态。

公开(公告)号：US08169452B2

公开(公告)日：2012-05-01

申请号：US12586990

申请日：2009-09-30

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/33535 ,  B41J2/3355 ,  B41J2/33585 ,  B41J25/312

Abstract: A thermal head has a heat storage layer bonded onto a surface of the substrate, a heating resistor provided on the heat storage layer, and a pair of electrode portions connected to the heating resistor. The heating resistor has a heating portion which does not overlap the pair of electrode portions. A hollow portion is provided in a region of at least one of the surface of the substrate and a surface of the heat storage layer, the region being opposed to the heating resistor. A center line of the hollow portion is shifted with respect to a center line of a heating portion of the heating resistor.

Abstract translation: 热敏头具有结合到基板的表面上的储热层，设置在储热层上的加热电阻器和连接到加热电阻器的一对电极部分。 加热电阻器具有不与一对电极部分重叠的加热部分。 在基板的表面和蓄热层的表面中的至少一个的区域中设置有中空部，该区域与加热电阻体相对。 中空部分的中心线相对于加热电阻器的加热部分的中心线移动。

公开(公告)号：US20120069124A1

公开(公告)日：2012-03-22

申请号：US13200248

申请日：2011-09-21

Applicant: Noriyoshi Shoji ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Norimitsu Sanbongi

Inventor： Noriyoshi Shoji ,  Toshimitsu Morooka ,  Keitaro Koroishi ,  Norimitsu Sanbongi

IPC: B41J2/335 ,  B32B17/06

CPC classification number: B41J2/3357 ,  B41J2/33575 ,  B41J2/3359

Abstract: In order to secure printing quality, provided is a head unit (10) including: a thermal head (9), including a heating body (15) formed on one surface of a glass substrate made of a transparent glass material, the heating body being configured to generate heat when supplied with external power; and a support body (11) which is laminated onto the glass substrate in a stacked state, in which the glass substrate and the support body (11) include a plurality of lamination reference marks (21) and a plurality of head positioning reference marks (23), respectively, which are disposed so as to be mutually aligned in a direction along the one surface of the glass substrate.

Abstract translation: 为了确保打印质量，提供了一种头单元（10），包括：热敏头（9），其包括形成在由透明玻璃材料制成的玻璃基板的一个表面上的加热体（15），所述加热体为 配置为在外部供电时产生热量; 以及层叠在所述玻璃基板上的层叠状态的支撑体（11），所述玻璃基板和所述支撑体（11）具有多个层叠基准标记（21）和多个头部定位基准标记（ 23），其被设置为沿着沿着玻璃基板的一个表面的方向相互对准。