公开(公告)号：US06657031B1

公开(公告)日：2003-12-02

申请号：US09919577

申请日：2001-07-31

Applicant: Lawrence N. Crane ,  Christopher K. Ober ,  Young Cheol Bae ,  Shuyan Yu ,  Jong-Wook Park

Inventor： Lawrence N. Crane ,  Christopher K. Ober ,  Young Cheol Bae ,  Shuyan Yu ,  Jong-Wook Park

IPC: C08F12400

CPC classification number: H01L24/98 ,  C08G59/18 ,  H01L21/56 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81052 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/3512

Abstract: This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract translation: 本发明涉及用于将半导体器件安装到电路板上的热固性树脂组合物，例如芯片尺寸或芯片尺寸封装（“CSP”），球栅阵列（“BGAs”），焊盘网阵列（“LGAs”）和 其中每个在载体基板上具有诸如大规模集成（“LSI”）的半导体芯片。 当经受适当条件时，本发明的组合物可重复使用。