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公开(公告)号:US20210343610A1
公开(公告)日:2021-11-04
申请号:US17367762
申请日:2021-07-06
Applicant: AGC Inc.
Inventor: Yu HANAWA , Shigeki SAWAMURA , Shuhei NOMURA , Kazutaka ONO , Nobuhiko TAKESHITA , Keisuke HANASHIMA
Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 μm to 300 μm, and an inclination angle due to the warpage of 0.0004° to 0.12°.
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公开(公告)号:US20210032155A1
公开(公告)日:2021-02-04
申请号:US16941631
申请日:2020-07-29
Applicant: AGC Inc.
Inventor: Seiji INABA , Yasunari SAITO , Kiyoshi TAMAI , Kazutaka ONO , Yuha KOBAYASHI
Abstract: A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm3). The ratio calculation value is represented by the following expression: α=2·Σ{(Vi·Gi)/Mi·Xi}, where, in the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate. Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate.
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