SEMICONDUCTOR PROCESS EQUIPMENT
    41.
    发明公开

    公开(公告)号:US20240153802A1

    公开(公告)日:2024-05-09

    申请号:US18141909

    申请日:2023-05-01

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    SEMICONDUCTOR PROCESS EQUIPMENT
    42.
    发明公开

    公开(公告)号:US20240153799A1

    公开(公告)日:2024-05-09

    申请号:US18141914

    申请日:2023-05-01

    CPC classification number: H01L21/67706 H01L21/67709 H01L21/6773

    Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

    SIMULTANEOUS IN PROCESS METROLOGY FOR CLUSTER TOOL ARCHITECTURE

    公开(公告)号:US20230032146A1

    公开(公告)日:2023-02-02

    申请号:US17386489

    申请日:2021-07-27

    Abstract: The present disclosure generally provides for a system and method for measuring one or more characteristics of one or more substrates in a multi-station processing system using one or more metrology modules at a plurality of metrology stations. In one embodiment, a system controller is configured to cause the multi-station processing system to perform a method that includes processing a plurality of substrates at a plurality of processing stations, advancing one or more of the plurality of substrates to a respective metrology station, measuring one or more characteristics of the plurality of substrates at the respective metrology station, determining a processing performance metric based on the one or more characteristics, comparing the processing performance metric to a tolerance limit to determine if an out of tolerance condition has occurred, and adjusting one or more processing parameters when it is determined that an out of tolerance condition has occurred.

    SELF ALIGNING WAFER CARRIER PEDESTAL ELEMENT WITH POWER CONTACTS

    公开(公告)号:US20220076971A1

    公开(公告)日:2022-03-10

    申请号:US17013339

    申请日:2020-09-04

    Abstract: Embodiments disclosed herein relate to an apparatus for aligning and securing a transferable substrate support. In one embodiment, a substrate support assembly includes a transferable substrate support. The transferable substrate support includes one or more first separable contact terminals disposed on a surface of the transferable substrate support. Each of the first separable contact terminals includes a detachable connection region and an electrical connection region, and the electrical connection region is coupled to an electrical element disposed within the transferable substrate support. The detachable connection region of each of the one or more first separable contact terminals is configured to detachably connect and disconnect with a corresponding pin of one or more pins of a supporting pedestal by repositioning the supporting pedestal relative to the transferable substrate support in a first direction.

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