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公开(公告)号:US20240153802A1
公开(公告)日:2024-05-09
申请号:US18141909
申请日:2023-05-01
Applicant: Applied Materials, Inc.
Inventor: Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Lakshmikanth Krishnamurthy SHIRAHATTI
IPC: H01L21/677 , H01L21/67 , H01L21/683 , H01L21/687
CPC classification number: H01L21/67709 , H01L21/67201 , H01L21/67742 , H01L21/6838 , H01L21/68742 , H01L21/68785
Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.
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公开(公告)号:US20240153799A1
公开(公告)日:2024-05-09
申请号:US18141914
申请日:2023-05-01
Applicant: Applied Materials, Inc.
Inventor: Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Lakshmikanth Krishnamurthy SHIRAHATTI
IPC: H01L21/677
CPC classification number: H01L21/67706 , H01L21/67709 , H01L21/6773
Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.
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43.
公开(公告)号:US20230282500A1
公开(公告)日:2023-09-07
申请号:US18317347
申请日:2023-05-15
Applicant: Applied Materials, Inc.
Inventor: Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Srinivasa Rao YEDLA
CPC classification number: H01L21/67248 , H01L22/12 , H01L21/6833
Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.
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公开(公告)号:US20230032146A1
公开(公告)日:2023-02-02
申请号:US17386489
申请日:2021-07-27
Applicant: Applied Materials, Inc.
Inventor: Kirankumar Neelasandra SAVANDAIAH , Srinivasa Rao YEDLA , Lakshmikanth Krishnamurthy SHIRAHATTI , Thomas BREZOCZKY
Abstract: The present disclosure generally provides for a system and method for measuring one or more characteristics of one or more substrates in a multi-station processing system using one or more metrology modules at a plurality of metrology stations. In one embodiment, a system controller is configured to cause the multi-station processing system to perform a method that includes processing a plurality of substrates at a plurality of processing stations, advancing one or more of the plurality of substrates to a respective metrology station, measuring one or more characteristics of the plurality of substrates at the respective metrology station, determining a processing performance metric based on the one or more characteristics, comparing the processing performance metric to a tolerance limit to determine if an out of tolerance condition has occurred, and adjusting one or more processing parameters when it is determined that an out of tolerance condition has occurred.
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公开(公告)号:US20220076971A1
公开(公告)日:2022-03-10
申请号:US17013339
申请日:2020-09-04
Applicant: Applied Materials, Inc.
Inventor: Kirankumar Neelasandra SAVANDAIAH , Nitin Bharadwaj SATYAVOLU , Kaushik VAIDYA , Bhaskar PRASAD , Srinivasa Rao YEDLA , Aju PHILIP , Thomas BREZOCZKY
IPC: H01L21/67 , H01L21/677 , H01L21/68
Abstract: Embodiments disclosed herein relate to an apparatus for aligning and securing a transferable substrate support. In one embodiment, a substrate support assembly includes a transferable substrate support. The transferable substrate support includes one or more first separable contact terminals disposed on a surface of the transferable substrate support. Each of the first separable contact terminals includes a detachable connection region and an electrical connection region, and the electrical connection region is coupled to an electrical element disposed within the transferable substrate support. The detachable connection region of each of the one or more first separable contact terminals is configured to detachably connect and disconnect with a corresponding pin of one or more pins of a supporting pedestal by repositioning the supporting pedestal relative to the transferable substrate support in a first direction.
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公开(公告)号:US20220028711A1
公开(公告)日:2022-01-27
申请号:US16940058
申请日:2020-07-27
Applicant: Applied Materials, Inc.
Inventor: Srinivasa Rao YEDLA , Kirankumar Neelasandra SAVANDAIAH , Thomas BREZOCZKY , Bhaskar PRASAD , Nitin Bharadwaj SATYAVOLU
Abstract: A shutter disc for use in a cluster tool assembly having a processing chamber and a transfer arm includes an inner disc and an outer disc configured to be disposed on the inner disc. The inner disc includes a plurality of locating features configured to mate with locating pins of a transfer arm of a cluster tool assembly and a plurality of centering features configured to mate with alignment elements of a substrate support disposed in the processing chamber of the cluster tool assembly.
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公开(公告)号:US20220013382A1
公开(公告)日:2022-01-13
申请号:US16924636
申请日:2020-07-09
Applicant: Applied Materials, Inc.
Inventor: Bhaskar PRASAD , Kirankumar Neelasandra SAVANDAIAH , Srinivasa Rao YEDLA , Nitin Bharadwaj SATYAVOLU , Thomas BREZOCZKY
IPC: H01L21/67 , B65G47/90 , H01L21/687
Abstract: A transfer apparatus for use in a multiple processing region system is disclosed that includes a carousel that includes a hub having a plurality of transfer arms extending therefrom. Each of the transfer arms include a first end coupled to the hub and a second end, the second end comprising a component supporting region, and a plurality of electrical interface connections distributed about the component supporting region.
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公开(公告)号:US20210375650A1
公开(公告)日:2021-12-02
申请号:US16889599
申请日:2020-06-01
Applicant: Applied Materials, Inc.
Inventor: Nitin Bharadwaj SATYAVOLU , Kirankumar Neelasandra SAVANDAIAH , Hari Prasath RAJENDRAN , Srinivasa Rao YEDLA , Lakshmikanth Krishnamurthy SHIRAHATTI , Thomas BREZOCZKY , Keith A. MILLER
IPC: H01L21/67 , H01L21/673 , H01L21/683
Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
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