Method of forming nitrogen implanted ultrathin gate oxide for dual gate CMOS devices
    41.
    发明授权
    Method of forming nitrogen implanted ultrathin gate oxide for dual gate CMOS devices 失效
    用于双栅极CMOS器件形成氮化物超薄栅极氧化物的方法

    公开(公告)号:US06184110B2

    公开(公告)日:2001-02-06

    申请号:US09071234

    申请日:1998-04-30

    Inventor: Yoshi Ono Yanjun Ma

    CPC classification number: H01L21/28185 H01L21/28202 H01L29/511 H01L29/518

    Abstract: A method of forming a nitrogen-implanted gate oxide in a semiconductor device includes preparing a silicon substrate; forming an oxide layer on the prepared substrate; and implanting N+ or N2+ ions into the oxide layer in a plasma immersion ion implantation apparatus.

    Abstract translation: 在半导体器件中形成氮注入栅极氧化物的方法包括制备硅衬底; 在所制备的基板上形成氧化物层; 以及在等离子体浸没离子注入装置中将N +或N2 +离子注入到氧化物层中。

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