摘要:
A simple, cost-effective method for forming a lithography mask with a directly imaged portion and an attenuated, phase shifted portion. In particular, the use of such a method for forming an outrigger-type phase shift mask. The mask is formed on a blank consisting of a transparent quartz substrate over which is an attenuating phase shift layer and an optically opaque layer, by a process that produces a pattern in an E-beam sensitive resist with two different E-beam energy depositions. The higher energy deposition is used to form the main pattern, while the lower energy deposition forms the pattern for the outrigger.
摘要:
A mask and method of forming a mask for forming a closely spaced array of contact holes and larger isolated holes in an integrated circuit wafer. The mask provides a binary mask section for the formation of the closely spaced array of contact holes where the depth of focus is not a problem thereby avoiding problems due to side lobe effect. The mask also provides a ring type attenuating phase shifting mask for the formation of isolated larger holes where improved depth of focus is required, thereby also avoiding the problems due to side lobe effect in this region.
摘要:
A electrical connection structure pattern according to the present invention includes a relatively dense first electrical connection structure area to a second electrical connection structure area. First, the electrical connection structure pattern is expensed to generate a first dummy pattern. The area of the first dummy pattern is larger than that of electrical connection structure pattern. Next, a second dummy pattern is generated by narrowing the line width of the first dummy pattern. A third dummy pattern is obtained by using CAD. The area of the third dummy pattern is smaller than that of the second dummy pattern, but larger than that of the electrical connection structure pattern. A fourth dummy pattern is generated by using CAD to remove the overlap area between the second dummy pattern and the third dummy pattern.
摘要:
The present invention discloses a novel method for interlayer corrections for photolithographic patterns that are reproduced on a wafer surface capable of correcting not only the optically-induced proximity effect but also the process-induced proximity effect. In the method, a conventional optical proximity correction is first performed on a photomask, the corrected photomask is then used to produce a pattern on a wafer surface. The various critical dimensions bias values at a multiplicity of locations are then measured and fed back to the computer aided design data file for the photomask for producing patterns that are corrected for both optically-induced and process-induced proximity effect on a wafer surface.
摘要:
An improved photoelectric sensor for an X-Y input device, the input device including vertical and horizontal slotted discs at ends of respective vertical and horizontal shafts, the discs being situated adjacent but not touching one another, is made up of a single photoelectric sensor and a single LED installed on opposite sides of the portions of the slotted discs that are adjacent each other, with the photosensor including four photoelectric sensor areas A, B, C, and D located on a single chip and having a width corresponding to the width of a slot or slotted wall of the slotted disc such that the rotation direction of the respective discs can be determined by whether the phase difference between signals generated by sensors A and B, and between signals generated by sensors C and D, is positive or negative.