CHASSIS APPARATUS PROTRUDING ELECTRONIC DEVICES
    41.
    发明申请
    CHASSIS APPARATUS PROTRUDING ELECTRONIC DEVICES 有权
    配套设备推出电子设备

    公开(公告)号:US20130293075A1

    公开(公告)日:2013-11-07

    申请号:US13460991

    申请日:2012-05-01

    IPC分类号: H05K7/20 H05K5/02

    CPC分类号: H05K7/20736

    摘要: An apparatus includes a chassis including at least one receiving buttress. The chassis defines an enclosure, and the at least one buttress protrudes a portion electronic devices outside the enclosure by preventing further insertion of the electronic devices into the enclosure.

    摘要翻译: 一种装置包括:底盘,包括至少一个接收支撑件。 所述底盘限定外壳,并且所述至少一个支撑件通过防止所述电子设备进一步插入到所述外壳中而突出所述外壳外的一部分电子设备。

    CHASSIS CARD CAGE
    42.
    发明申请
    CHASSIS CARD CAGE 审中-公开
    底盘卡

    公开(公告)号:US20130284682A1

    公开(公告)日:2013-10-31

    申请号:US13455944

    申请日:2012-04-25

    IPC分类号: H05K7/14 H05K7/00

    CPC分类号: H05K7/1425

    摘要: A chassis card cage includes a front panel, a backplane opposite the front panel, opposing sides extending between the front panel and the backplane, a series of module slots extending between opposing sides, each of the series of module slots configured to accommodate a card module, and a module slot divider including a first portion extending perpendicularly from the backplane and a second portion connectable to the first portion and extending from the second portion toward the front panel, wherein at least the second portion of the module slot divider has a divider height substantially equal to a height of a single module slot and is configured to divide one of the series of module slots into side-by-side module slots.

    摘要翻译: 机箱卡笼包括前面板,与前面板相对的背板,在前面板和背板之间延伸的相对侧,在相对侧之间延伸的一系列模块插槽,每个模块插槽中的每一个被配置为容纳卡模块 以及模块插槽分隔器,其包括从背板垂直延伸的第一部分和可连接到第一部分并从第二部分朝向前面板延伸的第二部分,其中模块插槽分隔器的至少第二部分具有分隔器高度 基本上等于单个模块插槽的高度,并且被配置为将所述一系列模块插槽中的一个分成并排模块插槽。

    FLUID COOLING MODULE
    44.
    发明申请
    FLUID COOLING MODULE 审中-公开
    流体冷却模块

    公开(公告)号:US20130087313A1

    公开(公告)日:2013-04-11

    申请号:US13386971

    申请日:2010-06-29

    IPC分类号: F28F1/40 B23P15/26

    摘要: A fluid cooling module includes tubing and a turbulence structure. The tubing is configured to contain a flowing fluid. The turbulence structure disposed inside the tubing and configured to increase fluid movement within the tubing as the flowing fluid flows over the turbulence structure to thereby generate turbulence in the flowing fluid.

    摘要翻译: 流体冷却模块包括管道和湍流结构。 管道被配置为容纳流动的流体。 所述湍流结构设置在所述管道内并且构造为当所述流动流体流过所述湍流结构时增加所述管道内的流体运动,从而在所述流动流体中产生湍流。

    PUSHBUTTON MEMBER FOR ELECTRONIC MODULE
    45.
    发明申请
    PUSHBUTTON MEMBER FOR ELECTRONIC MODULE 审中-公开
    电子模块的按钮会员

    公开(公告)号:US20120307460A1

    公开(公告)日:2012-12-06

    申请号:US13149772

    申请日:2011-05-31

    申请人: Glenn C. Simon

    发明人: Glenn C. Simon

    IPC分类号: H05K7/00

    CPC分类号: H05K7/1409 H05K7/1402

    摘要: An apparatus includes a pushbutton member; a receiving member movable by the pushbutton member; and a latching member affixed to an electronic module and latchable to the receiving member. When the latching member is latched, the electronic module is movable via the receiving member. Alternatively, an apparatus is provided including a pushbutton members and a receiving section having a protruding receiving member, and movable by the pushbutton members. The receiving member may receive a latching member affixed to an electronic module. When the latching member is latched, the electronic module is movable via the receiving member. Alternatively, an apparatus includes an electronic module; and a latching member affixed to the electronic module, the latching member to latch to a receiving member. When the latching member is latched to the receiving member, the electronic module is movable via the receiving member in a direction of movement of the receiving member.

    摘要翻译: 一种装置包括按钮构件; 由所述按钮构件移动的接收构件; 以及固定到电子模块并可锁定到接收构件的闩锁构件。 当闩锁构件被闩锁时,电子模块可以经由接收构件移动。 或者,提供一种装置,其包括按钮构件和具有突出接收构件的接收部分,并且可由按钮构件移动。 接收构件可以接收固定到电子模块的闩锁构件。 当闩锁构件被闩锁时,电子模块可以经由接收构件移动。 或者,装置包括电子模块; 以及固定到所述电子模块的闩锁构件,所述闩锁构件闩锁到接收构件。 当闩锁构件被闩锁到接收构件时,电子模块可以经由接收构件沿接收构件的移动方向移动。

    Thermal connector for cooling electronics
    46.
    发明授权
    Thermal connector for cooling electronics 有权
    用于冷却电子元件的热连接器

    公开(公告)号:US06882533B2

    公开(公告)日:2005-04-19

    申请号:US10023227

    申请日:2001-12-14

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20636

    摘要: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.

    摘要翻译: 一种模块化半导体芯片冷却系统,其具有容易打开的外壳,其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器,冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上,以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统,从各个模块中去除冷凝功能。