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    FLUID COOLING MODULE
    1.
    发明申请
    FLUID COOLING MODULE 审中-公开
    流体冷却模块

    公开(公告)号：US20130087313A1

    公开(公告)日：2013-04-11

    申请号：US13386971

    申请日：2010-06-29

    申请人： Timothy Michael Rau ,  Glenn C. Simon

    发明人： Timothy Michael Rau ,  Glenn C. Simon

    IPC分类号： F28F1/40 ,  B23P15/26

    CPC分类号： F28F1/40 ,  B23P15/26 ,  F28F1/405 ,  F28F13/12 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20772 ,  Y10T29/49377 ,  H01L2924/00

    摘要： A fluid cooling module includes tubing and a turbulence structure. The tubing is configured to contain a flowing fluid. The turbulence structure disposed inside the tubing and configured to increase fluid movement within the tubing as the flowing fluid flows over the turbulence structure to thereby generate turbulence in the flowing fluid.

    摘要翻译： 流体冷却模块包括管道和湍流结构。 管道被配置为容纳流动的流体。 所述湍流结构设置在所述管道内并且构造为当所述流动流体流过所述湍流结构时增加所述管道内的流体运动，从而在所述流动流体中产生湍流。

    Device for cooling an electronic component in a data center
    2.
    发明授权
    Device for cooling an electronic component in a data center 有权
    用于冷却数据中心的电子元件的装置

    公开(公告)号：US09326430B2

    公开(公告)日：2016-04-26

    申请号：US14350066

    申请日：2011-10-26

    申请人： Matt Neumann ,  Timothy Michael Rau

    发明人： Matt Neumann ,  Timothy Michael Rau

    IPC分类号： H05K7/20 ,  H01L23/473

    CPC分类号： H05K7/20781 ,  H05K7/20709 ,  H05K7/20736 ,  H05K7/20772

    摘要： A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.

    摘要翻译： 提供了一种用于冷却数据中心中的电子部件的装置。 该装置包括闭环，第一区域，第二区域和屏障。 闭环包括第一部分和第二部分。 液体围绕闭环流动。 第一区域被配置为将热量从数据中心中的电子部件散热到闭环的第一部分中的液体。 第二区域被配置为通过从数据中心的外部接收从第二部分移动的环境空气，从而从第二部分中消除的热量输出环境空气，从而从闭合回路的第二部分中的液体中除去热量 区域和数据中心。 挡板被配置为防止环境空气进入第一区域。