摘要:
An adaptable imaging assembly is provided. The adaptable imaging assembly includes a free-standing phosphor film configured to receive incident radiation and to emit corresponding optical signals. An electronic device is coupled to the free-standing phosphor film. The electronic device is configured to receive the optical signals from the free-standing phosphor film and to generate an imaging signal. A free-standing phosphor film is also provided and includes x-ray phosphor particles dispersed in a silicone binder. A method for inspecting a component is also provided and includes exposing the component and a free-standing phosphor film to radiation, generating corresponding optical signals with the free standing phosphor film, receiving the optical signals with an electronic device coupled to the free-standing phosphor film and generating an imaging signal using the electronic device.
摘要:
A method is provided for identifying detector elements in a solid state X-ray detector susceptible to causing line artifacts due to faulty detector elements that leak charge. A portion of the X-ray detector is covered by a radiation occluding material and the detector is exposed to a level of radiation sufficient to reach a predetermined threshold in the exposed portion of the detector. An image representative of the radiation is acquired and further analyzed to determine whether line artifacts exist. Data lines found to exhibit line artifacts are stored in the image processor.
摘要:
A method of improving a signal to noise ratio of an image data set of a cargo container is disclosed. The method includes transmitting a radiation beam toward the cargo container, detecting the transmitted radiation beam via a plurality of area radiation detectors, each area radiation detector comprising an active area defined by a matrix of pixels, thereby defining enhanced radiation data, processing the enhanced radiation data and reconstructing the image data set representative of contents of the cargo container, combining image attributes of the image data set to improve the signal to noise ratio, thereby defining an enhanced image data set, and displaying on a display the enhanced image data set comprising an improved signal to noise ratio.
摘要:
A photodetector for X-ray applications includes a photodiode at each pixel location that is gated to reduce leakage of charge from the photodiode. A gate layer may be disposed around the entire peripheral edge of the detector, and maintained at a common potential with a contact layer, or at a different potential. A passivation or dielectric layer separates the gate layer from the photodiode. Leakage around the edge of the diode that can result from extended exposure to radiation is reduced by the gate layer.
摘要:
Spatially patterned light-blocking layers for radiation imaging detectors are described. Embodiments comprise spatially patterned light-blocking layers for an amorphous silicon flat panel x-ray detector, wherein the spatially patterned light-blocking layer blocks light from a predetermined number of switching elements in the detector, wherein the predetermined number comprises less than all of the switching elements in the detector. These light-blocking layers may block light from each switching element in a predetermined arrangement of switching elements that are read out last, or in any other suitable pattern.
摘要:
An annular thin film transistor includes an annular source electrode disposed above the layer of the semiconductor material, a drain electrode disposed above the layer of the semiconductor material within the annular source electrode, and an active channel between the drain electrode and the annular source electrode, wherein a surface of the active channel comprises exposed semiconductor material. Further, a serpentine thin film transistor includes a serpentine source electrode disposed above the layer of the semiconductor material, a drain electrode disposed above the layer of semiconductor material and substantially within a recess formed by the serpentine source electrode, wherein the drain electrode is configured to substantially conform to the recess, and an active channel between the drain electrode and the serpentine source electrode, wherein the active channel has a substantially consistent length, and wherein a surface of the active channel comprises exposed semiconductor material.
摘要:
A photo-detector having a common electrode comprising a conductive material configured in a non-solid pattern in which there are gaps where there is no conductive material. In one embodiment, the distance (d) or (d′) between conductive portions of the common electrode is in a range from about 3 microns to about 5 microns. Alternatively, in one embodiment, the patterned common electrode covers between 20% to 70% of the surface of the respective photosensor element. A method for making the same is also provided.
摘要:
Storage capacitor design for a solid state imager. The imager includes several pixels disposed on a substrate in an imaging array pattern. Each pixel includes a photosensor coupled to a thin film switching transistor. Several scan lines are disposed at a first level with respect to the substrate along a first axis and several data lines are disposed at a second level along a second axis of the imaging array. Several data lines disposed at a second level with respect to the substrate along a second axis of the imaging array pattern. Each pixel comprises a storage capacitor coupled parallel to the photosensor, the storage capacitor comprising a storage capacitor electrode and a capacitor common electrode.
摘要:
A method for fabricating a radiation detector including at least one Thin Film Transistor (TFT) includes forming a low resistance data line strap unitary with a light block element on the TFT.
摘要:
A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager device includes the steps of forming a repair area on the device so as to expose the open-circuit defect in the damaged address line and then depositing a conductive material to form a second conductive component and to coincidentally form a repair shunt in the repair area so as to electrically bridge the defect. The step of forming the repair area includes the steps of ablating dielectric material disposed over the first conductive component in the repair area, and etching the repair area so as to remove dielectric material disposed over the defect in the address line in the repair area such that the surface of the address line conductive material is exposed but is not contaminated by the removal of the overlying dielectric material. A layer of photoresist is deposited over the imager device prior to forming the repair area, such that the photoresist layer is patterned during the ablating step and serves as a mask during the etch step.