Laser processing method and object to be processed
    41.
    发明授权
    Laser processing method and object to be processed 有权
    激光加工方法和待处理对象

    公开(公告)号:US07592237B2

    公开(公告)日:2009-09-22

    申请号:US10594892

    申请日:2005-03-02

    摘要: A laser processing method is provided, which, when cutting a substrate formed with a laminate part including a plurality of functional devices into a plurality of chips, each chip including at least one of the functional devices, can cut the laminate part with a high precision together with the substrate.In this laser processing method, modified regions differing from each other in terms of easiness to cause the substrate 4 to fracture are formed along respective lines to cut 5a to 5d. Therefore, when an expandable tape is attached to the rear face of a substrate 4 and expanded, an object to be processed 1 is cut stepwise into a plurality of chips. Such stepwise cutting allows uniform tensile stresses to act on respective parts extending along the lines to cut 5a to 5d, whereby interlayer insulating films on the lines to cut 5a to 5d are cut with a high precision together with the substrate 4.

    摘要翻译: 提供了一种激光加工方法,其将由具有多个功能元件的层叠部件形成的基板切割成多个芯片时,包括至少一个功能元件的芯片可以以高精度切割层叠部件 与基底一起。 在该激光加工方法中,沿着各条线形成切割5a〜5d,在容易引起基板4断裂的方面彼此不同的改质区域。 因此,当将可膨胀带附接到基板4的后表面并膨胀时,被处理物体1被逐步切割成多个芯片。 这种逐步切割允许均匀的拉伸应力作用于沿切割线5a至5d延伸的相应部分,由此切割的线5a至5d上的层间绝缘膜与基底4一起被高精度地切割。

    Illumination optical system, exposure apparatus, and exposure method
    43.
    发明申请
    Illumination optical system, exposure apparatus, and exposure method 失效
    照明光学系统,曝光装置和曝光方法

    公开(公告)号:US20080074632A1

    公开(公告)日:2008-03-27

    申请号:US11979517

    申请日:2007-11-05

    IPC分类号: G03B27/72

    摘要: An illumination optical system for, when installed in an exposure system, realizing a suitable illumination condition by varying the polarized state of the illumination light according to the pattern characteristics of the mask while suppressing the loss of the intensity of the light. The illumination optical system has a light source unit for supplying a linearly polarized light for illuminating surfaces to be illuminated therewith, and a polarized state changing device for changing the polarized state of the illuminating light from a predetermined polarized state to a nonpolarized state and vice versa. The polarized state changing device is arranged in the optical path between the light source unit and the surfaces to be illuminated. The polarized state changing device can be removed from the illumination optical path and has a depolarizer for selectively depolarizing the incident linearly polarized light.

    摘要翻译: 一种照明光学系统,当安装在曝光系统中时,通过根据掩模的图案特性改变照明光的偏振状态,同时抑制光的强度损失,实现合适的照明条件。 照明光学系统具有用于提供用于照射被照射的面的线偏振光的光源单元和用于将照明光的偏振状态从预定极化状态改变为非极化状态的偏振状态改变装置,反之亦然 。 偏光状态改变装置配置在光源单元与被照射面之间的光路中。 可以从照明光路去除偏振状态改变装置,并且具有去偏振器,用于选择性地使入射的线偏振光去极化。

    LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP
    44.
    发明申请
    LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP 有权
    激光束加工方法和半导体芯片

    公开(公告)号:US20090302428A1

    公开(公告)日:2009-12-10

    申请号:US12159338

    申请日:2006-12-26

    IPC分类号: H01L23/544 H01L21/302

    摘要: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

    摘要翻译: 在基板4上形成有会聚点P的基板4和形成在基板4的正面3上的多个功能元件15的被处理体1照射激光L,至少形成 一排分割改质区域72,位于分割改质区域72与基材4前表面3之间的至少一排质量改质区域71,以及至少一行位于 分割改质区域72和基板4的背面21一行切割5.这里,沿着切割线的方向,使分割改质区域72的形成密度低于质量改质区域的形成密度 71和改造后HC区域73。

    METHOD FOR CUTTING WORKPIECE
    45.
    发明申请
    METHOD FOR CUTTING WORKPIECE 有权
    切割工件的方法

    公开(公告)号:US20090107967A1

    公开(公告)日:2009-04-30

    申请号:US11994581

    申请日:2006-07-03

    IPC分类号: B23K31/10

    摘要: A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrate 4 is irradiated with laser light L from the multilayer part 16 side while locating a converging point P within the substrate 4, so as to form a first modified region 71 shifted from the center position CL in the thickness direction of the substrate 4 to the rear face 21 side of the substrate 4 and a second modified region 72 shifted from the center position CL in the thickness direction of the substrate 4 to the front face 3 side of the substrate 4 within the substrate 4 along a line to cut, and generate a fracture 24 from the second modified region 72 to the front face 3 of the substrate 4. Thereafter, while in a state where an expandable tape 23 attached to the rear face 21 of the substrate 4 is expanded, a stress is generated in an object to be processed 1 such as to open the fracture 24.

    摘要翻译: 提供了一种切割待处理物体的方法,其可以精确地切割被加工物,其包括基板和设置在基板的正面上的多层部件,同时沿着线路具有多个功能元件进入功能元件 即使在基材较厚时也能在短时间内切割。 基板4从多层部16侧照射激光L,同时将会聚点P定位在基板4内,以形成从基板4的厚度方向的中心位置CL移位的第一改质区域71到 基板4的背面21侧和第二改质区域72沿着切断线在基板4的基板4的基板4的基板4的前面3侧沿基板4的厚度方向从中心位置CL移位, 产生从第二改质区域72到基板4的正面3的断裂线24.此后,在将基板4的背面21上附着的可扩张带23膨胀的状态下,产生应力 待处理物体1如打开骨折24。

    Object display method and apparatus
    47.
    发明授权
    Object display method and apparatus 有权
    对象显示方法和装置

    公开(公告)号:US06468124B1

    公开(公告)日:2002-10-22

    申请号:US09354000

    申请日:1999-07-15

    IPC分类号: A63H3322

    CPC分类号: A63F9/0291

    摘要: An object display method and apparatus is disclosed which can easily display changeover of an entity, and an amusement apparatus is disclosed which can display a simulated burst having reality and punch. The method and apparatus first displays only one of the objects and hides other objects from the field of view. Then, the method and apparatus displays the previously hidden objects and at the same time hides the previously displayed object.

    摘要翻译: 公开了一种可以容易地显示实体的切换的物体显示方法和装置,并且公开了一种娱乐装置,其可以显示具有现实和冲击的模拟突发。 该方法和装置首先仅显示一个对象并从视野中隐藏其他对象。 然后,该方法和装置显示先前隐藏的对象,同时隐藏先前显示的对象。

    Microwave amplifying apparatus
    48.
    发明授权
    Microwave amplifying apparatus 失效
    微波放大装置

    公开(公告)号:US4716382A

    公开(公告)日:1987-12-29

    申请号:US922602

    申请日:1986-10-24

    CPC分类号: H01P5/1007 H01P5/04

    摘要: A microwave amplifying apparatus includes a waveguide which is shorted at one end and supplied with a TM mode or a TE mode signal, a pickup probe mounted on the waveguide for converting the signal into a TEM mode signal, and microstrip lines and field effect transistors, or amplifier elements, for amplifying the TEM mode signal. A matching device is arranged on the shorted waveguide adjacent to an incidence side with respect to the pickup probe while an input terminal of the first-stage amplifier element is directly interconnected to an output terminal of the pickup probe. The device is, therefore, free from a signal loss otherwise developed between the pickup probe and the initial-stage amplifier element. The matching device consists of three conductive rods which are spaced a quarter-wavelength distance from each other, and three lock nuts for fixing the conductive rods.

    摘要翻译: 微波放大装置包括在一端短路并提供TM模式或TE模式信号的波导,安装在波导上用于将信号转换为TEM模式信号的拾取探针,以及微带线和场效应晶体管, 或放大器元件,用于放大TEM模式信号。 匹配装置布置在相对于拾取探针的入射侧相邻的短路波导上,而第一级放大器元件的输入端直接互连到拾取探针的输出端。 因此,该装置没有在拾取探针和初始级放大器元件之间另外产生的信号损失。 匹配装置由三根相互间隔四分之一波长的导电棒组成,三根用于固定导电棒的锁紧螺母。