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公开(公告)号：US11499545B2
公开(公告)日：2022-11-15
申请号：US16517071
申请日：2019-07-19
Applicant: General Electric Company
Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.
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公开(公告)号：US20210123730A1
公开(公告)日：2021-04-29
申请号：US16665784
申请日：2019-10-28
Applicant: General Electric Company
Inventor： Marco Francesco Aimi , Joseph Alfred Iannotti
IPC: G01B17/02
Abstract: A measuring system is disclosed. The measuring system includes a surface acoustic wave (SAW) device including a piezoelectric substrate and a first and second electrode disposed on a surface of the piezoelectric substrate, and a measuring device communicatively coupled to the first electrode via a first probe and the second electrode via a second probe and configured to apply an electrical signal to the first and second electrode to generate an incident bulk acoustic wave within the piezoelectric substrate, detect at least a first reflected bulk acoustic wave and a second reflected bulk acoustic wave at the first and second electrode, and calculate a thickness between a first interface corresponding to the first reflected bulk acoustic wave and a second interface corresponding to the second reflected bulk acoustic wave based on a time elapsed between detecting the first and second reflected bulk acoustic waves.
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公开(公告)号：US20210104812A1
公开(公告)日：2021-04-08
申请号：US16713488
申请日：2019-12-13
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Joseph Alfred Iannotti , Stanton Earl Weaver , Glen Peter Koste
IPC: H01Q1/24 , H01Q21/06 , H01L23/66 , G02B6/42 , H01L23/538 , H01L25/16 , H01L23/15 , H01L23/498 , H01L33/62 , H01L21/48 , G02B6/43
Abstract: A wireless access point is disclosed. The wireless access point includes a substrate, an antenna structure disposed on the substrate and configured to transmit and receive wireless electromagnetic communication signals, and a fiber-optic interface disposed on the substrate and communicatively coupled to the antenna structure and a fiber-optic cable. The fiber-optic interface is configured to transmit and receive optical communication signals through the fiber-optic cable.
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公开(公告)号：US20210017979A1
公开(公告)日：2021-01-21
申请号：US16517071
申请日：2019-07-19
Applicant: General Electric Company
Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.
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公开(公告)号：US20190115659A1
公开(公告)日：2019-04-18
申请号：US15786696
申请日：2017-10-18
Applicant: General Electric Company
Inventor： Joseph Alfred Iannotti
Abstract: An RF transmission system includes an RF source that provides an RF input and one or more RF MEMS transmission devices coupled to the RF source to receive the RF input therefrom and generate output signals for transmission to an RF load. Each of the RF MEMS transmission devices comprises a substrate, a conducting line formed on the substrate to provide signal transmission paths between a signal input of the RF MEMS transmission device and a signal output of the RF MEMS transmission device, and a plurality of switching elements positioned along the conducting line and selectively controllable to define the signal transmission paths between the signal input and the signal output. Each of the RF source and the RF load has a first characteristic impedance and the one or more RF MEMS transmission devices have a second characteristic impedance that is greater than the first characteristic impedance.
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Patent Agency Ranking
公开(公告)号：US09829550B2
公开(公告)日：2017-11-28
申请号：US13728874
申请日：2012-12-27
Applicant: General Electric Company
IPC: G01R33/36
CPC classification number: G01R33/3635
Abstract: A system includes a multi-nuclear magnetic resonance (MR) receiving coil, wherein the receiving coil includes a frequency tuning component configured operate the receiving coil at either a first frequency or a second frequency. The receiving coil also includes an impedance matching component configured to maintain a substantially constant impedance of the receiving coil when the receiving coil is operated at either the first frequency or the second frequency. Furthermore, the receiving coil is configured to measure a first nucleus when operated at the first frequency, and wherein the receiving coil is configured to measure a second nucleus when operated at the second frequency.
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公开(公告)号：US20170155179A1
公开(公告)日：2017-06-01
申请号：US15429227
申请日：2017-02-10
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/15 , H01L21/52 , H01L21/54 , H01H55/00 , H01H59/00 , H01H61/01 , H01H57/00 , H01L21/48 , H01L21/56
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
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48.发明申请公开(公告)号：US20170062889A1
公开(公告)日：2017-03-02
申请号：US14839464
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
CPC classification number: H01P1/127 , B81B7/007 , H01H49/00 , H01H59/0009 , H01P11/00
Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
Abstract translation: 射频（RF）微机电系统（MEMS）封装包括第一安装衬底，形成在第一安装衬底的顶表面上的信号线，该信号线包括选择性地电耦合信号线的第一部分到 信号线的第二部分，以及耦合到第一安装基板的接地组件。 接地组件包括第二安装基板，形成在第二安装基板的底表面上的接地平面以及延伸穿过第二安装基板的厚度以接触接地平面的至少一个电互连，其中接地平面间隔开 除了信号线。
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公开(公告)号：US11965424B2
公开(公告)日：2024-04-23
申请号：US17844940
申请日：2022-06-21
Applicant: General Electric Company
Inventor： Arthur William Sibbach , Brandon Wayne Miller , Erich Alois Krammer , Douglas Scott Jacobs , Joseph Alfred Iannotti
CPC classification number: F01D21/02 , F02C9/28 , F02C9/46 , F02C9/50 , F05D2270/021 , F05D2270/304 , F05D2270/335
Abstract: A method for providing overspeed protection for a gas turbine engine having an engine shaft includes monitoring, via an overspeed protection system, a torque of the engine shaft. The method also includes determining, via the overspeed protection system, at least one additional condition of the engine shaft. Further, the method includes determining, via the overspeed protection system, an overspeed condition of the gas turbine engine when the torque of the engine shaft drops below a torque threshold and the at least one additional condition of the engine shaft is indicative of the gas turbine engine being in an operational state. Thus, the overspeed condition is indicative of an above normal rotational speed of the engine shaft. In addition, the method includes initiating a shutdown procedure for the gas turbine engine in response to the determined overspeed condition to reduce the rotational speed of the engine shaft.
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公开(公告)号：US11630086B2
公开(公告)日：2023-04-18
申请号：US17362407
申请日：2021-06-29
Applicant: General Electric Company
Abstract: A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.
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