Security apparatus for an electronic device
    41.
    发明申请
    Security apparatus for an electronic device 审中-公开
    电子设备安全装置

    公开(公告)号:US20090189765A1

    公开(公告)日:2009-07-30

    申请号:US12011722

    申请日:2008-01-29

    IPC分类号: G08B13/14 E05B65/00

    摘要: An apparatus is provided for deterring theft of an electronic device. The apparatus comprises of a retaining member comprising a locking mechanism attached at a first end of the retaining member and an anchoring mechanism at a second end of the retaining member; and a coupling connector protruding from the retaining member for coupling a data port of the electronic device

    摘要翻译: 提供了用于阻止电子设备被盗窃的装置。 该装置包括保持构件,该保持构件包括附接在保持构件的第一端处的锁定机构和在保持构件的第二端处的锚定机构; 以及从所述保持构件突出的耦合连接器,用于耦合所述电子设备的数据端口

    Computer device heat dissipation system
    42.
    发明授权
    Computer device heat dissipation system 有权
    计算机设备散热系统

    公开(公告)号:US07548428B2

    公开(公告)日:2009-06-16

    申请号:US11881538

    申请日:2007-07-27

    IPC分类号: H05K7/20

    CPC分类号: G06F1/203 Y10T29/4935

    摘要: A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to enable an airflow to pass therethrough.

    摘要翻译: 一种计算机设备散热系统,包括具有连接到热管的多个翅片的热交换器,所述多个翅片中的至少一个包括至少一个孔,以使气流能够通过。

    Electronic device with variably positionable imaging device
    44.
    发明申请
    Electronic device with variably positionable imaging device 审中-公开
    具有可变定位成像装置的电子装置

    公开(公告)号:US20080266401A1

    公开(公告)日:2008-10-30

    申请号:US11789671

    申请日:2007-04-24

    IPC分类号: H04N5/225

    CPC分类号: H04N5/2252

    摘要: An electronic device with a variably positionable imaging device comprises a housing having a recessed area for receiving the imaging device therein, the imaging device being disposed within a periphery of the housing when disposed in the recessed area, the imaging device removable from the recessed area and insertable in the recessed area with a lens of the imaging device disposed in each of at least two orientations.

    摘要翻译: 具有可变定位成像装置的电子装置包括具有用于在其中接收成像装置的凹陷区域的壳体,当设置在凹陷区域中时,成像装置设置在壳体的周边内,成像装置可从凹陷区域移除, 可插入到凹陷区域中,成像装置的透镜设置在至少两个取向中的每一个中。

    Push-button latching mechanism
    45.
    发明授权
    Push-button latching mechanism 有权
    按钮锁定机构

    公开(公告)号:US07405927B2

    公开(公告)日:2008-07-29

    申请号:US10938791

    申请日:2004-09-10

    申请人: Jeffrey A. Lev

    发明人: Jeffrey A. Lev

    IPC分类号: H05K7/00 E05C5/00

    摘要: A latching mechanism comprising a hook connected to a first component. The hook has a first position disposed within the first component and a second position extending from the first component. The latching mechanism further comprising a receptacle disposed within a second component and engaged with the hook. A magnet is disposed within the second component and moves the hook from the first position to the second position as the second component is disposed in close proximity to the first component. A push-button release mechanism is disposed within the first component and moves the hook from the second position so as to disengage said hook from said receptacle.

    摘要翻译: 一种闭锁机构,包括连接到第一部件的钩子。 钩具有设置在第一部件内的第一位置和从第一部件延伸的第二位置。 闩锁机构还包括设置在第二部件内并与钩接合的插座。 当第二部件靠近第一部件设置时,磁体设置在第二部件内并且将钩从第一位置移动到第二位置。 按钮释放机构设置在第一部件内并且将钩从第二位置移动,以使所述钩与所述容器脱离。

    Anti-rotation mechanism for an electronic device
    46.
    发明申请
    Anti-rotation mechanism for an electronic device 有权
    电子设备的防旋转机构

    公开(公告)号:US20080024964A1

    公开(公告)日:2008-01-31

    申请号:US11492436

    申请日:2006-07-25

    IPC分类号: G06F1/16

    CPC分类号: G06F1/1679 G06F1/162

    摘要: An electronic device comprises a display member pivotally and rotationally coupled to a base member and an anti-rotation mechanism configured to be magnetically responsive to prevent rotational movement of the display member relative to the base member based on a position of the display member relative to the base member.

    摘要翻译: 电子设备包括显示构件,其可枢转地并且可旋转地联接到基座构件和防旋转机构,所述防旋转机构构造成响应于磁性响应,以防止显示构件相对于基座构件相对于显示构件相对于基座构件的位置的旋转运动 基地会员

    Computer device cooling system
    47.
    发明授权
    Computer device cooling system 有权
    计算机设备冷却系统

    公开(公告)号:US07317614B2

    公开(公告)日:2008-01-08

    申请号:US11254369

    申请日:2005-10-19

    IPC分类号: G06F1/20

    CPC分类号: G06F1/203 G06F2200/201

    摘要: A computer device comprises at least two operational components disposed within a housing of the computer device. The computer device also comprises a cooling system thermally coupled to the at least two operational components, the cooling system configured to receive an airflow through at least one inlet and discharge the airflow through at least two outlets to dissipate thermal energy generated by the at least two operational components.

    摘要翻译: 计算机设备包括设置在计算机设备的壳体内的至少两个操作部件。 所述计算机设备还包括热耦合到所述至少两个操作部件的冷却系统,所述冷却系统被配置为接收通过至少一个入口的气流并且排出所述气流通过至少两个出口以消散所述至少两个所产生的热能 操作组件。

    Customizable portable computer system
    48.
    发明授权
    Customizable portable computer system 失效
    可定制的便携式计算机系统

    公开(公告)号:US07190573B2

    公开(公告)日:2007-03-13

    申请号:US10901340

    申请日:2004-07-28

    IPC分类号: G06F1/16

    CPC分类号: G06F1/1616 G06F1/1656

    摘要: A customizable portable computer system comprising a portable computer chassis. A door is detachably attached to the chassis so as to substantially cover an aperture through a wall of the chassis. The door is operable to support an electronic module. The portable computer system also comprises a cable having a first end that is coupled to the computer system and a second end that is accessible through the aperture and operable to couple to the electronic module.

    摘要翻译: 一种可定制的便携式计算机系统,包括便携式计算机机箱。 门可拆卸地附接到底盘,以便基本上覆盖通过底盘的壁的孔。 门可操作以支持电子模块。 便携式计算机系统还包括电缆,其具有耦合到计算机系统的第一端和可通过该孔径接近并且可操作以耦合到电子模块的第二端。

    System and method for mounting a component in a computer system

    公开(公告)号:US07145778B2

    公开(公告)日:2006-12-05

    申请号:US10964171

    申请日:2004-10-13

    IPC分类号: H05K7/00

    CPC分类号: G06F1/187 G06F1/184

    摘要: One embodiment is a system for mounting a component in a computer system comprising a bracket having a plurality of access ports that permit the component to be secured to the bracket, and having a plurality of mounting points that permit the bracket to be secured to the computer system; a cavity in the computer system formed to receive the bracket with the component and having a plurality of mounting posts, each of which corresponds with a respective mounting point of the plurality of the mounting points; and a cover that is formed to fit over the cavity and having a plurality of access points, each of which corresponds with a respective mounting point and a respective mounting post, wherein the plurality of access points permits each respective mounting point to be secured to the respective mounting post through the associated access point.

    Heat dissipation structure for electronic apparatus component
    50.
    发明授权
    Heat dissipation structure for electronic apparatus component 失效
    电子设备部件散热结构

    公开(公告)号:US06366460B1

    公开(公告)日:2002-04-02

    申请号:US09123092

    申请日:1998-07-27

    IPC分类号: G06F116

    CPC分类号: G06F1/203

    摘要: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side. The heat sink member is resiliently deflected into the die recess, and has its flat bottom side resiliently pressed against the thermal interface pad, by a spring plate portion of a clamping structure downwardly engaging the arcuate top side of the heat sink member. During operation of the microprocessor, die heat is transferred to the metal shield wall sequentially through the thermal pad, the heat sink member, and the heat pipe and then dissipated from the shield wall using fan-generated cooling air flowed along the shield wall.

    摘要翻译: 计算机微处理器具有在其顶侧壁中形成有凹部的壳体部分,并且在凹部内插入模具部分。 通过散热装置消除来自管芯的工作热量,该散热装置自动适应微处理器接合线厚度的变化,并且包括覆盖微处理器的金属板EMI屏蔽壁,并且具有固定到其底侧的热虹吸管的冷凝端部, 其中热管的蒸发端部覆盖在模具凹部上,并且朝向安装在模具的顶侧上的相变热垫弹性地偏转,并插入到壳体模具凹部中。 金属散热构件可旋转地安装在热管蒸发端部上,并且具有平坦的底侧和弧形顶侧。 散热构件弹性地偏转到模具凹部中,并且通过与散热构件的弧形顶侧向下接合的夹紧结构的弹簧板部分,使其平坦的底侧弹性地压靠在热界面垫上。 在微处理器的操作期间,模具热量依次通过热垫,散热构件和热管传递到金属屏蔽壁,然后使用沿着屏蔽壁流动的风扇产生的冷却空气从屏蔽壁消散。