Silicon photoelectric conversion device, method of fabricating the same and method of processing the same
    41.
    发明授权
    Silicon photoelectric conversion device, method of fabricating the same and method of processing the same 有权
    硅光电转换装置及其制造方法及其加工方法

    公开(公告)号:US06433269B1

    公开(公告)日:2002-08-13

    申请号:US09691071

    申请日:2000-10-19

    IPC分类号: H01L310288

    摘要: A cyano process of introducing cyano ions (CN−) into an amorphous silicon layer is performed after the amorphous silicon layer has been formed over a substrate or after the layer has been exposed to light. For example, the substrate is immersed in an aqueous solution containing potassium cyanide (KCN) in a vessel. The cyano process eliminates factors (e.g., weak bonds, defects, and centers of recombination) of decrease in photoconductivity of the as-deposited amorphous silicon thin film, which are identifiable in the as-deposited film. As a result, the photoconductivity of the amorphous silicon layer is already higher than usual from the beginning and will hardly decrease even upon exposure to light.

    摘要翻译: 在将非晶硅层形成在衬底上之后或在该层已经暴露于光之后,进行将氰离子(CN-)引入到非晶硅层中的氰化工艺。 例如,将衬底浸入容器中含有氰化钾(KCN)的水溶液中。 氰化工艺消除了沉积的非晶硅薄膜的光电导率降低的因素(例如,弱键,缺陷和复合中心),其可以在沉积膜中被识别。 结果,非晶硅层的光电导率从一开始就已经高于通常,并且即使在暴露于光时也几乎不降低。

    Method for forming an insulating film on semiconductor substrate surface and apparatus for carrying out the method
    42.
    发明授权
    Method for forming an insulating film on semiconductor substrate surface and apparatus for carrying out the method 失效
    在半导体衬底表面上形成绝缘膜的方法和用于实施该方法的装置

    公开(公告)号:US06265327B1

    公开(公告)日:2001-07-24

    申请号:US09098352

    申请日:1998-06-17

    IPC分类号: H01L2131

    摘要: Disclosed are a method and apparatus for forming an insulating film on the surface of a semiconductor substrate capable of improving the quality and electrical properties of the insulating film with no employment of high-temperature heating and with good controllability. After the surface of a silicon substrate is cleaned, a silicon dioxide film having a thickness of 1-20 nm is formed on the substrate surface. The silicon substrate is exposed to plasma generated by electron impact, while the silicon substrate is maintained at a temperature of 0° C. to 700° C. Thus, nitrogen atoms are incorporated into the silicon dioxide film, obtaining a modified insulating film having good electrical properties.

    摘要翻译: 公开了一种在半导体衬底的表面上形成绝缘膜的方法和装置,该方法和装置能够提高绝缘膜的质量和电气性能,而不需要采用高温加热和良好的可控性。 在清洁硅衬底的表面之后,在衬底表面上形成厚度为1-20nm的二氧化硅膜。 将硅衬底暴露于通过电子轰击产生的等离子体,同时将硅衬底保持在0℃至700℃的温度。因此,将氮原子并入二氧化硅膜中,获得具有良好的改性绝缘膜 电性能。