摘要:
The invention is a circuit and method for controlling a high potential at a significant node by controlling the potential at a control input to an electrical device in electrical communication with the significant node. The potential of the control input is controlled by a control circuit. In a first embodiment the control circuit is a potential generator, and in a second embodiment the control circuit is a programmable circuit. The programmable circuit provides a potential at the control input that is directly proportional to a supply potential until a maximum potential is reached at which time the control input is maintained at the maximum potential.
摘要:
The present invention discloses an on chip decoupling capacitor structure having a first decoupling capacitor with one electrode formed in the conductively doped silicon substrate and a second electrode made of conductively doped polysilicon. The second electrode is a common electrode to a second decoupling capacitor overlying and thereby coupled in parallel to said first decoupling capacitor. The second capacitor's first electrode is the common electrode and its second electrode is made of conductively doped polysilicon. The electrodes made of the conductively doped polysilicon may be further enhanced by forming a silicided material, such as tungsten silicide, thereon. The decoupling capacitors' dielectric can be formed from high dielectric constant materials, such as TEOS, oxide, nitride or any combination thereof. The second decoupling capacitor could be fabricated over field oxide and used as a single capacitor having a first and second conductively doped polysilicon electrodes (either silicided or non-silicided) with a capacitor dielectric sandwiched in between.
摘要:
A semiconductor memory device includes a plurality of row lines, a plurality of column lines, and a common storage cell plate. The memory device also includes a cell plate generator which produces a reference voltage. The reference voltage is connected to the common storage cell plate. A row decoder connects a row line voltage to selected individual row lines. A stress mode detection circuit receives a row line stress voltage and generates a stress mode signal in response. The row decoder is responsive to the stress mode signal to simultaneously bias all of the row lines to the row line stress voltage. At least one equilibrate circuit is also connected to receive the stress mode signal and is responsive to the stress mode signal to bias the column lines to the reference voltage. The memory device is furthermore responsive to the stress mode signal to ground the reference voltage. The circuits described create a voltage stress differential between the column lines, the row lines, and the common storage cell plate. This voltage stress differential is greater than any voltage differential occurring between the row lines, the column lines, and the storage cell plate during normal memory access operations. The voltage stress differential is maintained for a relatively long period to induce failure of marginally defective dielectric layers within the semiconductor memory device.