-
公开(公告)号:US20200098761A1
公开(公告)日:2020-03-26
申请号:US16139816
申请日:2018-09-24
Applicant: Micron Technology, Inc.
Inventor: Cornel Bozdog , Abhilasha Bhardwaj , Byeung Chul Kim , Michael E. Koltonski , Gurtej S. Sandhu , Matthew Thorum
IPC: H01L27/108 , H01L23/522 , H01L23/528
Abstract: Integrated circuitry comprising an array comprises a plurality of conductive vias. Individual of the vias comprise an upper horizontal perimeter comprising opposing end portions. One of the opposing end portions comprises opposing straight sidewalls. The other of the opposing end portions comprises opposing curved sidewalls that join with the opposing straight sidewalls of the one opposing end portion. Other embodiments, including methods, are disclosed.