公开(公告)号：US20100116990A1

公开(公告)日：2010-05-13

申请号：US12267526

申请日：2008-11-07

申请人： Kun Xu ,  Feng Q. Liu ,  Yuchun Wang ,  Abraham Ravid ,  Wen-Chiang Tu

发明人： Kun Xu ,  Feng Q. Liu ,  Yuchun Wang ,  Abraham Ravid ,  Wen-Chiang Tu

IPC分类号： G01J5/02 ,  G01T1/24

CPC分类号： G01B11/0683 ,  B24B37/005 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/144 ,  H01L45/1683

摘要： Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.

摘要翻译： 使用在红外范围内的强度光谱来描述确定半导体衬底上的GST层的厚度和相位的方法。 特别地，公开了在某些频率下使用某些传输的技术，用于在用于CMP工艺的在线或独立计量/监测系统中更快的厚度和相位确定。

公开(公告)号：US07670468B2

公开(公告)日：2010-03-02

申请号：US11228035

申请日：2005-09-15

申请人： Feng Q. Liu ,  Rashid Mavliev

发明人： Feng Q. Liu ,  Rashid Mavliev

IPC分类号： C25C7/00

CPC分类号： B23H5/08

摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing includes a fluid inlet that is positioned to cause fluid, entering the housing through the inlet, to sweep the entire passage. In another embodiment, a method for electrochemically processing includes flowing a processing fluid through a passage retaining a conductive element. The flow sweeps the entire passage of the housing. A first electrical bias is applied to the conductive element in contact with the substrate relative an electrode electrically coupled to the substrate by the processing fluid. After the substrate is separated from the conductive element, flow of processing fluid is continued through the passage past the conductive element.

摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。 该球适于在加工过程中从壳体部分延伸以接触基底。 壳体包括流体入口，其被定位成引起流体，通过入口进入壳体，以扫掠整个通道。 在另一个实施例中，一种用于电化学处理的方法包括使处理流体流过保持导电元件的通道。 流动扫过壳体的整个通道。 第一电偏压被施加到与衬底接触的导电元件，相对于通过处理流体电耦合到衬底的电极。 在将衬底与导电元件分离之后，处理流体的流动继续通过通过导电元件的通道。