公开(公告)号：US20150187484A1

公开(公告)日：2015-07-02

申请号：US14284209

申请日：2014-05-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Jin JEONG ,  Yong Un CHOI

IPC: H01F27/28 ,  H01F27/24

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F2017/048

Abstract: There is provided a chip electronic component comprising: a magnetic body including an insulating substrate; an internal coil part formed on at least one surface of the insulating substrate; and an external electrode formed on at least one end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes an outermost coil pattern portion, an innermost coil pattern portion and a central coil pattern portion, widths of the outermost and innermost coil pattern portions being greater than a width of the central coil pattern portion.

Abstract translation: 提供了一种芯片电子部件，包括：包括绝缘基板的磁体; 形成在所述绝缘基板的至少一个表面上的内部线圈部; 以及外部电极，其形成在所述磁性体的至少一个端面上并且连接到所述内部线圈部，所述内部线圈部包括最外侧线圈图案部，最内侧线圈图案部和中央线圈图案部， 最外侧和最内侧的线圈图形部分大于中央线圈图案部分的宽度。