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41.
公开(公告)号:US20240272482A1
公开(公告)日:2024-08-15
申请号:US18643399
申请日:2024-04-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin LEE , Jaewoo KIM , Seungyong SHIN , Hyukjun JANG
IPC: G02F1/1335 , G02F1/13357 , H05K1/18
CPC classification number: G02F1/133612 , G02F1/133608 , H05K1/182 , G02F1/133603 , H05K2201/09072 , H05K2201/10106 , H05K2201/10189
Abstract: A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.
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42.
公开(公告)号:US20230251525A1
公开(公告)日:2023-08-10
申请号:US18112270
申请日:2023-02-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin LEE , Jaewoo KIM , Seungyong SHIN , Hyukjun JANG
IPC: G02F1/1335 , H05K1/18 , G02F1/13357
CPC classification number: G02F1/133612 , H05K1/182 , G02F1/133608 , H05K2201/09072 , H05K2201/10106 , H05K2201/10189 , G02F1/133603
Abstract: A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.
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公开(公告)号:US20230088646A1
公开(公告)日:2023-03-23
申请号:US18058510
申请日:2022-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin LEE , Hyoseok NA , Hanyeop LEE , Hyunseok CHOI
Abstract: An electronic device may include a transceiver, a communication circuit, at least one antenna circuit, a processor, and a memory. The transceiver may include at least one transmission (Tx) chain and at least one reception (Rx) chain. The communication circuit may include a plurality of front ends electrically connected to the transceiver. The at least one antenna circuit may be connected to the plurality of front ends, respectively. The processor may be operatively connected to the communication circuit. The processor is configured to change the power and/or circuit driving of the at least one reception (Rx) chain on the basis of the strength of an output signal of the at least one transmission chain.
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公开(公告)号:US20230044131A1
公开(公告)日:2023-02-09
申请号:US17671818
申请日:2022-02-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kwangwuk PARK , Youngmin LEE , Inyoung LEE , Sungdong CHO
IPC: H01L23/58 , H01L25/065 , H01L23/522
Abstract: A semiconductor chip, a semiconductor package including the same, and a method of fabricating the same, the semiconductor chip including a substrate that includes a device region and an edge region; a device layer and a wiring layer that are sequentially stacked on the substrate; a subsidiary pattern on the wiring layer on the edge region; a first capping layer that covers a sidewall of the subsidiary pattern, a top surface of the wiring layer, and a sidewall of the wiring layer, the first capping layer including an upper outer sidewall and a lower outer sidewall, the lower outer sidewall being offset from the upper outer sidewall; and a buried dielectric pattern in contact with the lower outer sidewall of the first capping layer and spaced apart from the upper outer sidewall of the first capping layer.
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公开(公告)号:US20230005853A1
公开(公告)日:2023-01-05
申请号:US17674974
申请日:2022-02-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kunsang PARK , Kyuha LEE , Youngmin LEE , Seokho KIM , Inyoung LEE , Seokhwan JEONG , Sungdong CHO
IPC: H01L23/00 , H01L25/065 , H01L21/66
Abstract: A semiconductor package includes a first structure having a first insulating layer and a first bonding pad penetrating the first insulating layer, and a second structure on the first structure and having a second insulating layer bonded to the first insulating layer, a bonding pad structure penetrating the second insulating layer and bonded to the first bonding pad, and a test pad structure penetrating the second insulating layer and including a test pad in an opening penetrating the second insulating layer and having a protrusion with a flat surface, and a bonding layer filling the opening and covering the test pad and the flat surface, the protrusion of the test pad extending from a surface in contact with the bonding layer, and the flat surface of the protrusion being within the opening and spaced apart from an interface between the bonding layer and the first insulating layer.
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公开(公告)号:US20220321162A1
公开(公告)日:2022-10-06
申请号:US17709854
申请日:2022-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngmin LEE , Woojin KIM , Hyoseok NA
Abstract: Disclosed is an electronic device including a plurality of antennas, a plurality of radio frequency circuits, a first transceiver, a second transceiver, a switching circuit configured to connect the plurality of radio frequency circuits to the first transceiver or the second transceiver, a processor, and a memory. The electronic device may be configured to switch a receiving path by connecting at least one of a plurality of receiving paths to another transceiver based on reception performance of the plurality of receiving paths.
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47.
公开(公告)号:US20210359771A1
公开(公告)日:2021-11-18
申请号:US17278003
申请日:2019-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chulseung PYO , Dongil YANG , Hyunseok CHOI , Jooseung KIM , Youngmin LEE , Jongin LEE , Hyoseok NA
Abstract: Disclosed is an electronic device that includes a transmission amplifier; an antenna; a circulator disposed between the transmission amplifier and the antenna; a communication module which is connected to the circulator and which is for checking a signal received through the antenna; and a processor. The processor may be set to check the signal through the communication module and adjust the frequency characteristics of the antenna based at least in part on a determination that the signal is a signal reflected from the antenna.
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48.
公开(公告)号:US20210302789A1
公开(公告)日:2021-09-30
申请号:US17210025
申请日:2021-03-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyungsuk KIM , Jongbin KIM , Youngmin LEE , Dukjin JEON , Byoungjin CHO , Sukju CHOI
IPC: G02F1/1335 , G02F1/13357
Abstract: A backlight unit includes a printed circuit board; a light source disposed on the printed circuit board and configured to emit light towards an upper side of the backlight unit; a reflective lens disposed on an upper side of the light source; and a reflective tape attached to the printed circuit board so as to surround the light source. At least a part of the reflective tape has a color different from a color of the light emitted by the light source.
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公开(公告)号:US20200220506A1
公开(公告)日:2020-07-09
申请号:US16733996
申请日:2020-01-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyunseok CHOI , Jooseung KIM , Youngmin LEE , Hyoseok NA
Abstract: Disclosed is an electronic device including a power amplifier (PA) configured to amplify a transmission signal, a matching circuit configured to be connected with the PA and to form a load impedance, a filter configured to be connected with the matching circuit, and a control circuit configured to control a state of at least one of a bias of the PA, the matching circuit, and the filter. The control circuit may identify a network to which the electronic device is connected among a first network and a second network and may operate the matching circuit in one of a first state, a second state, and a third state based on the identified network.
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50.
公开(公告)号:US20200186400A1
公开(公告)日:2020-06-11
申请号:US16710391
申请日:2019-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngmin LEE , Yongjun AN , Yuseon LEE
Abstract: An electronic device according to a disclosed embodiment includes a first antenna, a second antenna, a first communication circuit configured to communicate in a first frequency band with the first antenna at a first data rate, a second communication circuit configured to communicate in a second frequency band with the second antenna at a second data rate, a first coupler electrically connected between the first antenna and the first communication circuit, and at least one communication circuit configured to control to identify, during at least part of a period of simultaneously transmitting a first transmit signal with the first antenna and a second transmit signal with the second antenna, an amplitude of a first receive signal including at least part of the second transmit signal detected by the first coupler, disable an operation of attenuating the at least part of the second transmit signal included in the first receive signal based on the amplitude of the first receive signal falling in a first designated range, and enable the operation of attenuating the at least part of the second transmit signal included in the first receive signal based on the amplitude of the first receive signal falling in a second designated range.
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