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    METHODS OF FABRICATING A SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHODS OF FABRICATING A SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20180240669A1

    公开(公告)日：2018-08-23

    申请号：US15959506

    申请日：2018-04-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaewoo KIM

    IPC: H01L21/033 ,  H01L21/311 ,  H01L21/768

    CPC classification number: H01L21/0337 ,  H01L21/31144 ,  H01L21/76816

    Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a hard mask film on a lower film and forming first spacers on the hard mask film. The first spacers may define an exposure region of the hard mask film, and the exposure region may include a patterning portion and a non-patterning portion. The methods may also include forming a mold film on the first spacers and forming a blocking pattern in the mold film. The blocking pattern may vertically overlap the non-patterning portion. The methods may further include exposing the first spacers by removing the mold film after forming the blocking pattern.

    METHODS OF FABRICATING A SEMICONDUCTOR DEVICE
    2.
    发明申请
    METHODS OF FABRICATING A SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号：US20170069494A1

    公开(公告)日：2017-03-09

    申请号：US15246092

    申请日：2016-08-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jaewoo KIM

    IPC: H01L21/033 ,  H01L21/768 ,  H01L21/311

    CPC classification number: H01L21/0337 ,  H01L21/31144 ,  H01L21/76816

    Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a hard mask film on a lower film and forming first spacers on the hard mask film. The first spacers may define an exposure region of the hard mask film, and the exposure region may include a patterning portion and a non-patterning portion. The methods may also include forming a mold film on the first spacers and forming a blocking pattern in the mold film. The blocking pattern may vertically overlap the non-patterning portion. The methods may further include exposing the first spacers by removing the mold film after forming the blocking pattern.

    Abstract translation: 提供制造半导体器件的方法。 所述方法可以包括在下膜上形成硬掩模膜并在硬掩模膜上形成第一间隔物。 第一间隔物可以限定硬掩模膜的曝光区域，并且曝光区域可以包括图案形成部分和非图案形成部分。 所述方法还可以包括在第一间隔物上形成模具膜并在模具膜中形成阻挡图案。 阻挡图案可以垂直地与非图案化部分重叠。 所述方法可以进一步包括在形成阻挡图案之后通过移除模具膜来暴露第一间隔物。

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
    6.
    发明公开
    DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME 审中-公开

    公开(公告)号：US20230197908A1

    公开(公告)日：2023-06-22

    申请号：US18112810

    申请日：2023-02-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyukjun JANG ,  Jaewoo KIM

    IPC: H01L33/48 ,  H01L33/50 ,  H01L33/64 ,  G02F1/13357

    CPC classification number: H01L33/486 ,  H01L33/505 ,  H01L33/642 ,  G02F1/133603

    Abstract: A display device according to an example embodiment comprises: a light source package comprising light sources disposed on the mounting surface of a printed circuit board and a display panel and configured to irradiate light toward the display panel. The light source package comprises: a light conversion member configured to convert the wavelength of the light emitted from the light sources; a transparent member configured to transmit the light emitted from the light sources, and to support the light conversion member; a first package substantially surrounding the light sources and the transparent member; and a second package covering the outside of the first package, wherein the thermal conductivity of the second package is greater than the thermal conductivity of the first package.

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