METHOD AND COMPOSITION FOR SEALING A SUBSURFACE FORMATION

    公开(公告)号:US20200063018A1

    公开(公告)日:2020-02-27

    申请号:US16667263

    申请日:2019-10-29

    Abstract: A method for plugging and sealing subsurface formations using alkaline nanosilica dispersion and a delayed activation chemistry is disclosed. In accordance with one embodiment of the present disclosure, the method includes introducing a mixture with a first pH into the subsurface formation. The mixture comprises an aqueous solution, an alkaline nanosilica dispersion and a water-insoluble hydrolyzable compound. The method further includes allowing the water-insoluble hydrolyzable compound to hydrolyze in the subsurface formation to form an acid at 70° C. or greater, thereby acidizing the mixture to a reduced second pH and causing the alkaline nanosilica dispersion to gel into a solid and seal the subsurface formation. A composition for sealing a subsurface formation is also disclosed. The composition includes an aqueous mixture including water, an alkaline nanosilica dispersion, and a water-insoluble hydrolyzable compound.

    PREVENTING WATER PRODUCTION IN SUBTERRANEAN FORMATIONS

    公开(公告)号:US20240425744A1

    公开(公告)日:2024-12-26

    申请号:US18341451

    申请日:2023-06-26

    Abstract: A method and system for controlling unwanted water production from a water-producing zone in a subterranean formation are provided. An exemplary method includes flowing an alkaline suspension of nanosilica particles into a wellbore such that it contacts the water-producing zone, and flowing a formate salt solution into the wellbore such that it contacts the alkaline suspension in the water-producing zone producing a composition. The wellbore is shut in a duration of time sufficient for the composition to form a gel that is impermeable to fluid flow.

Patent Agency Ranking