公开(公告)号：US20200325888A1

公开(公告)日：2020-10-15

申请号：US16847521

申请日：2020-04-13

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Domenico GIUSTI ,  Lorenzo BALDO ,  Enri DUQI

IPC: F04B43/04 ,  H01L41/09 ,  H01L41/047 ,  H01L27/20 ,  H01L41/31

Abstract: A micropump device is formed in a monolithic semiconductor body integrating a plurality of actuator elements arranged side-by-side. Each actuator element has a first chamber extending at a distance from a first face of the monolithic body; a membrane arranged between the first face and the first chamber; a piezoelectric element extending on the first face over the membrane; a second chamber, arranged between the first chamber and a second face of the monolithic body; a fluidic inlet path fluidically connecting the second chamber with the outside of the monolithic body; and a fluid outlet opening extending in a transverse direction in the monolithic body from the second face as far as the second chamber, through the first chamber. The monolithic formation of the actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

公开(公告)号：US20200236470A1

公开(公告)日：2020-07-23

申请号：US16749579

申请日：2020-01-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Fabrizio CERINI ,  Enri DUQI ,  Silvia ADORNO ,  Lorenzo BALDO

IPC: H04R19/02 ,  B81B3/00 ,  B81C1/00 ,  H04R17/00 ,  H04R19/00 ,  H04R31/00 ,  H04R1/02

Abstract: An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.

公开(公告)号：US20170284882A1

公开(公告)日：2017-10-05

申请号：US15276617

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate region made of conductive material, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate region, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.