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    WATERPROOF SWITCH ACTUATABLE BY A FLUID SUCH AS AIR AND USABLE IN PARTICULAR FOR ACTIVATING AN INHALATOR APPARATUS, SUCH AS AN ELECTRONIC CIGARETTE
    2.
    发明申请
    WATERPROOF SWITCH ACTUATABLE BY A FLUID SUCH AS AIR AND USABLE IN PARTICULAR FOR ACTIVATING AN INHALATOR APPARATUS, SUCH AS AN ELECTRONIC CIGARETTE 有权

    公开(公告)号：US20210114867A1

    公开(公告)日：2021-04-22

    申请号：US17072813

    申请日：2020-10-16

    Applicant: STMicroelectronics S.r.l.

    Inventor： Enri DUQI ,  Fabrizio CERINI ,  Lorenzo BALDO

    IPC: B81B7/02 ,  A24F40/51 ,  B81B7/00

    Abstract: A MEMS switch is actuatable by a fluid, and includes a piezoelectric pressure sensor that detects the movement of a fluid generating a negative pressure. The piezoelectric pressure sensor is formed by a chip of semiconductor material having a through cavity and a sensitive membrane, which extends over the through cavity and has a first and a second surface. The piezoelectric pressure sensor is mounted on a face of a board having a through hole so that the through cavity overlies and is in fluid connection with the through hole. The board has a fixing structure, which enables securing in an opening of a partition wall separating a first and a second space from each other. The board is arranged so that the first surface of the sensitive membrane faces the first space, and the second surface of the sensitive membrane faces the second space.

    SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN STACKED DIES AND CORRESPONDING MANUFACTURING PROCESS
    5.
    发明申请
    SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN STACKED DIES AND CORRESPONDING MANUFACTURING PROCESS 有权

    公开(公告)号：US20210147222A1

    公开(公告)日：2021-05-20

    申请号：US17161367

    申请日：2021-01-28

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Lorenzo BALDO ,  Domenico GIUSTI

    IPC: B81C1/00 ,  B81B7/00

    Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

    MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF
    8.
    发明申请
    MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF 有权

    公开(公告)号：US20220185661A1

    公开(公告)日：2022-06-16

    申请号：US17684317

    申请日：2022-03-01

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Marco DEL SARTO ,  Lorenzo BALDO

    IPC: B81C1/00 ,  B81B3/00 ,  B81C99/00

    Abstract: A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF
    10.
    发明申请
    MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：US20190210868A1

    公开(公告)日：2019-07-11

    申请号：US15866380

    申请日：2018-01-09

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

    IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00

    Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

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