公开(公告)号：US09534974B2

公开(公告)日：2017-01-03

申请号：US13757146

申请日：2013-02-01

Applicant: STMicroelectronics S.r.l.

Inventor： Michele Vaiana ,  Mario Chiricosta ,  Mario Maiore ,  Lorenzo Baldo ,  Paul Georges Marie Rose

IPC: G01K7/00 ,  G01L19/00 ,  G01K7/01 ,  G01L9/00 ,  G01L9/06

CPC classification number: G01L19/0092 ,  G01K7/01 ,  G01L9/0054 ,  G01L9/065

Abstract: A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane.

Abstract translation: 压力传感器包括由具有第一类型导电性的半导体材料制成的主体和具有限定悬浮膜的第一类型导电性的压敏结构。 在悬浮膜中形成具有第二类导电性（P）的一个或多个压电元件。 压敏元件与压敏结构形成各自的结二极管。 温度检测方法包括：在连接二极管公共的导通端子之间产生第一电流; 当提供所述第一电流时，检测所述公共导通端子之间的第一电压值; 并将检测到的第一电压值与二极管的温度值相关联。 这样计算的温度值可用于校正当压力传感器输出时产生的电压信号，该压力传感器用于感测施加的使悬浮膜变形的外部压力。

公开(公告)号：US20140319630A1

公开(公告)日：2014-10-30

申请号：US14265053

申请日：2014-04-29

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Matteo Perletti ,  Roberto Carminati ,  Lorenzo Baldo ,  Alessandro Morcelli

IPC: H04R19/00

CPC classification number: H04R19/005 ,  H01L29/84 ,  H04R1/04 ,  H04R19/04

Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

Abstract translation: MEMS传感器装置的组件设想：第一管芯，集成微机械检测结构并具有外部主面; 集成了可操作地耦合到微机械检测结构的电子电路，电和机械耦合到第一管芯并且具有相应的外部主面。 第一模具和第二模具的外部主面都被设置成与组件外部的环境直接接触，而不插入封装件。