摘要:
An integrally formed chip lid and heat sink of the present invention comprises a chip lid portion, and a heat sink portion formed from said chip lid. The integrally formed chip lid portion and heat sink portion are manufactured as a single part, such that there is no interface between the chip lid portion and the heat sink portion.
摘要:
One embodiment of the invention includes a method for preventing a plurality of electronic devices from being pulled out of an equipment rack simultaneously. The method includes determining with an electronic sensor module whether an electronic device of a plurality of electronic devices coupled to the equipment rack is being slid out of the equipment rack. Provided the electronic device is being slid out of the equipment rack, an electronic locking module prevents any remaining electronic device of the plurality of electronic devices from being slid out of the equipment rack. A determination is made as to whether the electronic device has been slid back into the equipment rack. Provided the electronic device has been slid back into the equipment rack, the prevention is deactivated.