公开(公告)号：US20200066431A1

公开(公告)日：2020-02-27

申请号：US16538465

申请日：2019-08-12

Applicant: TDK CORPORATION

Inventor： Yuto SHIGA ,  Hajime KATO ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Noriaki HAMACHI ,  Makoto YOSHINO

IPC: H01F17/00 ,  H01F27/29 ,  H01F41/10 ,  H01F41/04 ,  H01F27/30

Abstract: An electronic component includes an element provided with a recess, a mounting conductor disposed in the recess, and an internal conductor disposed inside the element and connected to the mounting conductor. A first region includes a first surface. A second region includes a third surface connecting a second surface and the first surface. The second surface and the third surface overlap with the first surface as viewed in a direction in which the first surface and the second surface face each other. The internal conductor is connected to the second region away from a connection portion between the first surface and the third surface.

公开(公告)号：US20190043655A1

公开(公告)日：2019-02-07

申请号：US16046563

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Hajime KATO ,  Yuto SHIGA ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Yuya ISHIMA ,  Satoru OKAMOTO ,  Shunji AOKI

IPC: H01F27/28

Abstract: A laminated coil component includes an element body, a coil, and a pair of conductors. The pair of conductors is disposed on the element body. Each of the pair of conductors has an L shape when viewed from the third direction. Each of the pair of conductors includes a first conductor portion and a second conductor portion. The first conductor portion is disposed on one of first side faces. The second conductor portion is disposed on a pair of end faces. The coil includes a first coil portion and a second coil portion. The first coil portion includes a first straight portion and a pair of second straight portions. The pair of second straight portions is connected to both ends of the first straight portion. The second coil portion is curved as a whole.

公开(公告)号：US20190006084A1

公开(公告)日：2019-01-03

申请号：US16021983

申请日：2018-06-28

Applicant: TDK CORPORATION

Inventor： Yuto SHIGA ,  Hajime KATO ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Yuya ISHIMA ,  Satoru OKAMOTO ,  Shunji AOKI

IPC: H01F27/28 ,  H01F27/29

Abstract: A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.

公开(公告)号：US20180342341A1

公开(公告)日：2018-11-29

申请号：US15988101

申请日：2018-05-24

Applicant: TDK CORPORATION

Inventor： Shunji AOKI ,  Yuya ISHIMA ,  Hajime KATO ,  Yuto SHIGA ,  Kazuya TOBITA ,  Youichi KAZUTA ,  Satoru OKAMOTO

IPC: H01F17/00 ,  H01G4/30 ,  H01F27/29 ,  H01G4/12

Abstract: A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors.

公开(公告)号：US20180240591A1

公开(公告)日：2018-08-23

申请号：US15892784

申请日：2018-02-09

Applicant: TDK CORPORATION

Inventor： Yuya ISHIMA ,  Yasushi MATSUYAMA ,  Yuto SHIGA ,  Shunji AOKI ,  Shinichi KONDO

IPC: H01F41/04 ,  H01F27/28 ,  H01F27/32

CPC classification number: H01F41/04 ,  H01F17/0013 ,  H01F27/28 ,  H01F27/292 ,  H01F27/323

Abstract: An electronic component includes an element provided with a first recess, and a mounting conductor including a first conductor portion disposed in the first recess. The first conductor portion has a first face opposed to a bottom face of the first recess, a second face opposed to the first face, and a third face connecting the first face and the second face. The third face has a region overlapping with the second face as viewed from an opposing direction of the bottom face of the first recess and the first face.

公开(公告)号：US20170345553A1

公开(公告)日：2017-11-30

申请号：US15598606

申请日：2017-05-18

Applicant: TDK CORPORATION

Inventor： Masashi SHIMOYASU ,  Shinichi SATO ,  Seiichi NAKAGAWA ,  Mamoru KAWAUCHI ,  Shigetoshi KINOUCHI ,  Mitsuru ITO ,  Yuto SHIGA

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F27/324 ,  H01F2027/2809

Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.