公开(公告)号：US20140124939A1

公开(公告)日：2014-05-08

申请号：US13668901

申请日：2012-11-05

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Matthew David Romig ,  Lance Cole Wright ,  Leslie Edward Stark ,  Frank Stepniak ,  Sreenivasan K. Koduri

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/488

CPC classification number: H01L23/64 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L24/24 ,  H01L24/29 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24265 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/73217 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82102 ,  H01L2224/822 ,  H01L2224/8221 ,  H01L2224/82399 ,  H01L2224/8284 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/92144 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/27 ,  H01L2224/8312 ,  H01L2924/00

Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Abstract translation: 一种制造电子设备的方法，其具有安装在电子管芯的表面上的分立器件，其中所述分立器件和所述管芯通过热固化的导电油墨连接并被固化的密封剂覆盖，包括将所述分立器件放置在所述管芯上; 并且将分立装置和模具中的每一个的温度保持在约200℃以下。还公开了一种将分立装置电连接到基板的方法，该方法包括将装置放置在基板上，施加连接至少一个 将端子连接到基板上的至少一个触点并固化导电油墨。 还公开了具有具有电端子的分立电气装置的IC封装; 电气基板，其表面上具有接触焊盘; 以及将至少一个电端子与至少一个接触焊盘连接的固化的导电油墨。