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公开(公告)号：US09899339B2
公开(公告)日：2018-02-20
申请号：US13668901
申请日：2012-11-05
Applicant: Texas Instruments Incorporated
Inventor： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
IPC: H01L21/60 , H01L23/64 , H01L23/00 , H01L23/522 , H01L23/532
CPC classification number: H01L23/64 , H01L23/5223 , H01L23/5227 , H01L23/5228 , H01L23/5328 , H01L24/24 , H01L24/29 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/24011 , H01L2224/2405 , H01L2224/24265 , H01L2224/245 , H01L2224/2919 , H01L2224/73217 , H01L2224/8121 , H01L2224/81815 , H01L2224/82102 , H01L2224/822 , H01L2224/8221 , H01L2224/82399 , H01L2224/8284 , H01L2224/83192 , H01L2224/8321 , H01L2224/83862 , H01L2224/92 , H01L2224/92144 , H01L2924/15747 , H01L2924/181 , H01L2924/19104 , H01L2924/01029 , H01L2924/01047 , H01L2924/00015 , H01L2924/00012 , H01L2924/0665 , H01L2224/27 , H01L2224/8312 , H01L2924/00
Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.
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公开(公告)号：US08847349B2
公开(公告)日：2014-09-30
申请号：US13723874
申请日：2012-12-21
Applicant: Texas Instruments Incorporated
Inventor： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Screenivasan K. Koduri
CPC classification number: H01L24/17 , H01L23/28 , H01L23/5226 , H01L24/32 , H01L24/48 , H01L24/49 , H01L28/00 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/16 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.
Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。
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公开(公告)号：US20220115308A1
公开(公告)日：2022-04-14
申请号：US17518554
申请日：2021-11-03
Applicant: Texas Instruments Incorporated
Inventor： Jonathan Almeria Noquil , Satyendra Singh Chauhan , Lance Cole Wright , Osvaldo Jorge Lopez
IPC: H01L23/495 , H01L23/00 , H01L25/07 , H01L25/00 , H01L25/16
Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.
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公开(公告)号：US20210090980A1
公开(公告)日：2021-03-25
申请号：US16581971
申请日：2019-09-25
Applicant: Texas Instruments Incorporated
Inventor： Jonathan Almeria Noquil , Satyendra Singh Chauhan , Lance Cole Wright , Osvaldo Jorge Lopez
IPC: H01L23/495 , H01L23/00 , H01L25/07 , H01L25/00 , H01L25/16
Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.
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公开(公告)号：US11658130B2
公开(公告)日：2023-05-23
申请号：US17138981
申请日：2020-12-31
Applicant: Texas Instruments Incorporated
Inventor： Tianyi Luo , Jonathan Almeria Noquil , Satyendra Singh Chauhan , Osvaldo Jorge Lopez , Lance Cole Wright
IPC: H01L23/00 , H01L23/31 , H01L23/495 , H01L21/56 , H01L21/48
CPC classification number: H01L23/562 , H01L21/4825 , H01L21/565 , H01L23/3107 , H01L23/4952 , H01L23/49513 , H01L23/49562 , H01L23/49575
Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.
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Patent Agency Ranking
公开(公告)号：US11177197B2
公开(公告)日：2021-11-16
申请号：US16581971
申请日：2019-09-25
Applicant: Texas Instruments Incorporated
Inventor： Jonathan Almeria Noquil , Satyendra Singh Chauhan , Lance Cole Wright , Osvaldo Jorge Lopez
Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.
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公开(公告)号：US20140361402A1
公开(公告)日：2014-12-11
申请号：US14468370
申请日：2014-08-26
Applicant: Texas Instruments Incorporated
Inventor： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
IPC: H01L23/00 , H01L23/522 , H01L23/28
CPC classification number: H01L24/17 , H01L23/28 , H01L23/5226 , H01L24/32 , H01L24/48 , H01L24/49 , H01L28/00 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/16 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.
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公开(公告)号：US20140175599A1
公开(公告)日：2014-06-26
申请号：US13723874
申请日：2012-12-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Matthew David Romig , Lance Cole Wright , Leslie Edward Stark , Frank Stepniak , Sreenivasan K. Koduri
IPC: H01L49/02
CPC classification number: H01L24/17 , H01L23/28 , H01L23/5226 , H01L24/32 , H01L24/48 , H01L24/49 , H01L28/00 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/49175 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H05K1/16 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.
Abstract translation: 一种集成电路（IC）封装，其包括IC芯片和与IC芯片电连接的导电油墨印刷电路层。
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公开(公告)号：US11908780B2
公开(公告)日：2024-02-20
申请号：US17518554
申请日：2021-11-03
Applicant: Texas Instruments Incorporated
Inventor： Jonathan Almeria Noquil , Satyendra Singh Chauhan , Lance Cole Wright , Osvaldo Jorge Lopez
CPC classification number: H01L23/49575 , H01L23/49513 , H01L23/49562 , H01L24/32 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/074 , H01L25/16 , H01L25/50 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L24/97 , H01L2224/32245 , H01L2224/40145 , H01L2224/40177 , H01L2224/4118 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48247 , H01L2224/73221 , H01L2224/73263 , H01L2224/83815 , H01L2224/84815 , H01L2224/92246 , H01L2924/13091 , H01L2924/1426 , H01L2924/2064
Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.
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公开(公告)号：US20220208692A1
公开(公告)日：2022-06-30
申请号：US17138981
申请日：2020-12-31
Applicant: Texas Instruments Incorporated
Inventor： Tianyi Luo , Jonathan Almeria Noquil , Satyendra Singh Chauhan , Osvaldo Jorge Lopez , Lance Cole Wright
IPC: H01L23/00 , H01L23/31 , H01L23/495 , H01L21/48 , H01L21/56
Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.
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