Methods and apparatuses for fabricating thin film transistors
    41.
    发明申请
    Methods and apparatuses for fabricating thin film transistors 审中-公开
    用于制造薄膜晶体管的方法和装置

    公开(公告)号:US20060111243A1

    公开(公告)日:2006-05-25

    申请号:US11143155

    申请日:2005-06-02

    IPC分类号: H01L39/14

    CPC分类号: H01L29/4908 H01L29/66765

    摘要: Methods and apparatuses for fabricating thin film transistors. An apparatus comprises a first chamber and a second chamber. A substrate comprising a metal gate formed thereon is brought into the first chamber to form a passivation layer on the metal gate. The substrate is then transported to the second chamber to form a gate insulating layer and a semiconductor layer on the passivation layer. Accordingly, the second chamber experiences no metal contamination resulting from the metal gate.

    摘要翻译: 用于制造薄膜晶体管的方法和装置。 一种装置包括第一室和第二室。 将其上形成有金属栅的衬底带入第一室中,以在金属栅上形成钝化层。 然后将衬底输送到第二室,以在钝化层上形成栅极绝缘层和半导体层。 因此,第二室没有经历金属栅极产生的金属污染。

    Electrode structure of a transistor, and pixel structure and display apparatus comprising the same
    42.
    发明授权
    Electrode structure of a transistor, and pixel structure and display apparatus comprising the same 有权
    晶体管的电极结构,以及包括该晶体管的像素结构和显示装置

    公开(公告)号:US09536963B2

    公开(公告)日:2017-01-03

    申请号:US11683131

    申请日:2007-03-07

    摘要: An electrode structure of a transistor, and a pixel structure and a display apparatus comprising the electrode structure of the transistor are disclosed. The electrode structure of the transistor comprises a first electrode and a second electrode. The first electrode has at least two first portions and at least one second portion. The first portions are substantially parallel with each other and each has a first width. The second portion has a second width, and connects the substantially parallel first portions to define a space with an opening. The first width is substantially greater than the second width.

    摘要翻译: 公开了晶体管的电极结构以及包括晶体管的电极结构的像素结构和显示装置。 晶体管的电极结构包括第一电极和第二电极。 第一电极具有至少两个第一部分和至少一个第二部分。 第一部分基本上彼此平行并且每个具有第一宽度。 第二部分具有第二宽度,并且连接大致平行的第一部分以限定具有开口的空间。 第一宽度基本上大于第二宽度。

    Dual-gate transistor and pixel structure using the same
    43.
    发明授权
    Dual-gate transistor and pixel structure using the same 有权
    双栅晶体管和像素结构使用相同

    公开(公告)号:US08378423B2

    公开(公告)日:2013-02-19

    申请号:US13071422

    申请日:2011-03-24

    IPC分类号: H01L29/66

    摘要: A dual-gate transistor includes a first gate formed on a substrate, a first dielectric layer covering the first gate and the substrate, a semiconductor layer formed on the first dielectric layer, first and second electrodes formed on the semiconductor layer and spaced with an interval in order to separate each other, a second dielectric layer covering the first and second electrodes, and a second gate formed on the second dielectric layer, in which at least one of the first and second gates is non-overlapped with the second electrode.

    摘要翻译: 双栅极晶体管包括形成在衬底上的第一栅极,覆盖第一栅极和衬底的第一电介质层,形成在第一电介质层上的半导体层,形成在半导体层上并以间隔隔开的第一和第二电极 为了彼此分离,覆盖第一和第二电极的第二电介质层和形成在第二电介质层上的第二栅极,其中第一和第二栅极中的至少一个与第二电极不重叠。

    DUAL-GATE TRANSISTOR AND PIXEL STRUCTURE USING THE SAME
    44.
    发明申请
    DUAL-GATE TRANSISTOR AND PIXEL STRUCTURE USING THE SAME 有权
    双门晶体管和像素结构使用相同

    公开(公告)号:US20110168998A1

    公开(公告)日:2011-07-14

    申请号:US13071422

    申请日:2011-03-24

    IPC分类号: H01L29/78

    摘要: A dual-gate transistor includes a first gate formed on a substrate, a first dielectric layer covering the first gate and the substrate, a semiconductor layer formed on the first dielectric layer, first and second electrodes formed on the semiconductor layer and spaced with an interval in order to separate each other, a second dielectric layer covering the first and second electrodes, and a second gate formed on the second dielectric layer, in which at least one of the first and second gates is non-overlapped with the second electrode.

    摘要翻译: 双栅极晶体管包括形成在衬底上的第一栅极,覆盖第一栅极和衬底的第一电介质层,形成在第一电介质层上的半导体层,形成在半导体层上并以间隔隔开的第一和第二电极 为了彼此分离,覆盖第一和第二电极的第二电介质层和形成在第二电介质层上的第二栅极,其中第一和第二栅极中的至少一个与第二电极不重叠。

    Thin Film Transistors and Fabrication Methods Thereof
    45.
    发明申请
    Thin Film Transistors and Fabrication Methods Thereof 审中-公开
    薄膜晶体管及其制作方法

    公开(公告)号:US20110101459A1

    公开(公告)日:2011-05-05

    申请号:US13005349

    申请日:2011-01-12

    IPC分类号: H01L27/12 H01L21/336

    摘要: Thin film transistors and fabrication methods thereof. A gate is formed overlying a portion of a substrate. A first vanadium oxide layer formed overlying the gate and the substrate. A gate-insulating layer is formed overlying the first vanadium oxide layer. A semiconductor layer is formed on a portion of the gate-insulating layer. A source and a drain are formed on a portion of the semiconductor layer.

    摘要翻译: 薄膜晶体管及其制造方法。 形成覆盖衬底的一部分的栅极。 形成在栅极和衬底上的第一氧化钒层。 形成覆盖第一氧化钒层的栅极绝缘层。 半导体层形成在栅极绝缘层的一部分上。 源极和漏极形成在半导体层的一部分上。

    Thin film transistor and method for fabricating same
    48.
    发明授权
    Thin film transistor and method for fabricating same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07777231B2

    公开(公告)日:2010-08-17

    申请号:US12432735

    申请日:2009-04-29

    IPC分类号: H01L21/02

    摘要: A method for forming a thin film transistor on a substrate is disclosed. A gate electrode and a gate insulation layer are disposed on a surface of the substrate. A deposition process is performed by utilizing hydrogen diluted silane to form a silicon-contained thin film on the gate insulation layer first. A hydrogen plasma etching process is thereafter performed. The deposition process and the etching process are repeated for at least one time to form an interface layer. Finally, an amorphous silicon layer, n+ doped Si layers, a source electrode, and a drain electrode are formed on the interface layer.

    摘要翻译: 公开了一种在衬底上形成薄膜晶体管的方法。 栅电极和栅极绝缘层设置在基板的表面上。 首先通过利用氢稀释的硅烷在栅极绝缘层上形成含硅薄膜来进行沉积工艺。 此后执行氢等离子体蚀刻工艺。 重复沉积工艺和蚀刻工艺至少一次以形成界面层。 最后,在界面层上形成非晶硅层,n +掺杂Si层,源电极和漏电极。

    THIN FILM TRANSISTOR AND METHOD FOR FABRICATING SAME
    49.
    发明申请
    THIN FILM TRANSISTOR AND METHOD FOR FABRICATING SAME 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20090212289A1

    公开(公告)日:2009-08-27

    申请号:US12432735

    申请日:2009-04-29

    IPC分类号: H01L29/786

    摘要: A method for forming a thin film transistor on a substrate is disclosed. A gate electrode and a gate insulation layer are disposed on a surface of the substrate. A deposition process is performed by utilizing hydrogen diluted silane to form a silicon-contained thin film on the gate insulation layer first. A hydrogen plasma etching process is thereafter performed. The deposition process and the etching process are repeated for at least one time to form an interface layer. Finally, an amorphous silicon layer, n+ doped Si layers, a source electrode, and a drain electrode are formed on the interface layer.

    摘要翻译: 公开了一种在衬底上形成薄膜晶体管的方法。 栅电极和栅极绝缘层设置在基板的表面上。 首先通过利用氢稀释的硅烷在栅极绝缘层上形成含硅薄膜来进行沉积工艺。 此后执行氢等离子体蚀刻工艺。 重复沉积工艺和蚀刻工艺至少一次以形成界面层。 最后,在界面层上形成非晶硅层,n +掺杂Si层,源电极和漏电极。

    Thin film transistor and method for fabricating same
    50.
    发明授权
    Thin film transistor and method for fabricating same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07541229B2

    公开(公告)日:2009-06-02

    申请号:US10904377

    申请日:2004-11-07

    IPC分类号: H01L21/00 H01L21/84

    摘要: A method for forming a thin film transistor on a substrate is disclosed. A gate electrode and a gate insulation layer are disposed on a surface of the substrate. A deposition process is performed by utilizing hydrogen diluted silane to form a silicon-contained thin film on the gate insulation layer first. A hydrogen plasma etching process is thereafter performed. The deposition process and the etching process are repeated for at least one time to form an interface layer. Finally, an amorphous silicon layer, n+ doped Si layers, a source electrode, and a drain electrode are formed on the interface layer.

    摘要翻译: 公开了一种在衬底上形成薄膜晶体管的方法。 栅电极和栅极绝缘层设置在基板的表面上。 首先通过利用氢稀释的硅烷在栅极绝缘层上形成含硅薄膜来进行沉积工艺。 此后执行氢等离子体蚀刻工艺。 重复沉积工艺和蚀刻工艺至少一次以形成界面层。 最后,在界面层上形成非晶硅层,n +掺杂Si层,源电极和漏电极。