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公开(公告)号：US12261103B2
公开(公告)日：2025-03-25
申请号：US17647144
申请日：2022-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yonghwan Kwon
IPC: H01L23/48 , H01L23/31 , H01L23/498 , H01L25/10 , H01L23/00
Abstract: A semiconductor package includes a semiconductor chip on a first redistribution substrate, a molding layer that covers the semiconductor chip, and a second redistribution substrate on the molding layer and that includes a dielectric layer, a redistribution pattern, and a conductive pad. The dielectric layer includes a lower opening that exposes the conductive pad, and an upper opening connected to the lower opening and that is wider than the lower opening. The semiconductor package also comprises a redistribution pad on the conductive pad and that covers a sidewall of the lower opening and a bottom surface of the upper opening. A top surface of the dielectric layer is located at a higher level than a top surface of the redistribution pad. The top surface of the redistribution pad is located on the bottom surface of the upper opening.
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公开(公告)号：US12261093B2
公开(公告)日：2025-03-25
申请号：US17883726
申请日：2022-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongho Kim , Jongbo Shim , Hwanpil Park , Jangwoo Lee
IPC: H01L23/31 , H01L23/00 , H01L25/065
Abstract: A semiconductor package is disclosed. The disclosed semiconductor package includes a substrate having bonding pads at an upper surface thereof, a lower semiconductor chip, at least one upper semiconductor chip disposed on the lower semiconductor chip, and a dam structure having a closed loop shape surrounding the lower semiconductor chip. The dam structure includes narrow and wide dams disposed between the lower semiconductor chip and the bonding pads. The wide dam has a greater inner width than the narrow dam. The semiconductor packages further includes an underfill disposed inside the dam structure and being filled between the substrate and the lower semiconductor chip.
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公开(公告)号：US12261021B2
公开(公告)日：2025-03-25
申请号：US17719680
申请日：2022-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyun Bae Kim , Ji Hwan Kim , Hyong Seo Yoon , Sang Ki Nam , Hyun Jae Lee , Myung Geun Jeong
IPC: H01J37/32
Abstract: A substrate treatment apparatus including a chamber; a lower electrode in the chamber, wherein the substrate is on the lower electrode; an upper electrode in the chamber, and above the lower electrode; a pulse signal generator configured to generate a pulse signal; and a bias power supply configured to generate bias power having a pulsed non-sinusoidal waveform using the pulse signal, and supply the generated bias power to the lower electrode, wherein the bias power supply includes a DC power generator configured to receive the pulse signal and generate a direct-current (DC) voltage subjected to feedforward compensation based on the pulse signal; and a modulator configured to generate a power signal having a non-sinusoidal waveform using the DC voltage, and filter the power signal using the pulse signal to generate the bias power having the pulsed non-sinusoidal waveform.
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公开(公告)号：US12260923B2
公开(公告)日：2025-03-25
申请号：US17820280
申请日：2022-08-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunee Lee , Jongyeol Park
Abstract: A nonvolatile memory device includes a memory cell array, an address decoder, a leakage detector and a control circuit. The memory cell array includes a plurality of mats corresponding to different bit-lines. The leakage detector is commonly coupled to the plurality of mats at a sensing node in the address decoder. The control circuit performs a first leakage detection operation on M mats selected from the mats to determine a leakage of at least a portion of word-lines of the M mats in an N multi-mat mode, in response to the leakage of at least the portion of word-lines of the M mats being detected based on a result of the first leakage detection operation, inhibits at least one mat of the M mats, and performs a second leakage detection operation on at least one target mat from among the M mats except the inhibited mat.
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公开(公告)号：US12260874B2
公开(公告)日：2025-03-25
申请号：US18058104
申请日：2022-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chou-Chang Yang , Ching-Hua Lee , Rakshith Sharma Srinivasa , Yashas Malur Saidutta , Yilin Shen , Hongxia Jin
IPC: G10L21/0232 , G10L15/02 , G10L15/06 , G10L21/0216 , G10L25/18
Abstract: A method includes obtaining, using at least one processing device, noisy speech signals and extracting, using the at least one processing device, acoustic features from the noisy speech signals. The method also includes receiving, using the at least one processing device, a predicted speech mask from a speech mask prediction model based on a first acoustic feature subset and receiving, using the at least one processing device, a predicted noise mask from a noise mask prediction model based on a second acoustic feature subset. The method further includes providing, using the at least one processing device, predicted speech features determined using the predicted speech mask and predicted noise features determined using the predicted noise mask to a filtering mask prediction model. In addition, the method includes generating, using the at least one processing device, a clean speech signal using a predicted filtering mask output by the filtering mask prediction model.
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Patent Agency Ranking
506.发明授权公开(公告)号：US12260401B2
公开(公告)日：2025-03-25
申请号：US18198962
申请日：2023-05-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youna Lee , Seongmin Je , Sungjin Park , Minkyung Shin
Abstract: An electronic device including a processor that generates first identification data including a unique value corresponding to an external device, transmits an authentication request including information on a blockchain application and the first identification data to the external device, receives, a random value generated from the external device if authentication is successful, transmits a signature request including the random value and information on a transaction to the external device, generates a first hash value for the transaction, receives a second hash value for the transaction, which is generated based on verification of the random value, and signature data obtained by performing digital signature to the transaction with a private key stored in the external device, and determines whether to transmit the transaction to the blockchain network, based on the first hash value and the second hash value.
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公开(公告)号：US12260347B2
公开(公告)日：2025-03-25
申请号：US18197717
申请日：2023-05-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Qinling Zheng , Nima Elyasi , Vikas Sinha , Changho Choi
Abstract: A method for predicting a time-to-failure of a target storage device may include training a machine learning scheme with a time-series dataset, and applying the telemetry data from the target storage device to the machine learning scheme which may output a time-window based time-to-failure prediction. A method for training a machine learning scheme for predicting a time-to-failure of a storage device may include applying a data quality improvement framework to a time-series dataset of operational and failure data from multiple storage devices, and training the scheme with the pre-processed dataset. A method for training a machine learning scheme for predicting a time-to-failure of a storage device may include training the scheme with a first portion of a time-series dataset of operational and failure data from multiple storage devices, testing the machine learning scheme with a second portion of the time-series dataset, and evaluating the machine learning scheme.
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公开(公告)号：US12260325B2
公开(公告)日：2025-03-25
申请号：US16924297
申请日：2020-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Uiseok Song
Abstract: A processor-implemented neural network model reconfiguration method is provided. The method calculates required resource information of each of a plurality of layers of a neural network model, determines whether a layer of the plurality of layers is a reconfiguration target layer based on the required resource information and hardware information, determines reconfiguration layers, with respect to the reconfiguration target layer, based on required resource information of the reconfiguration target layer and the hardware information, selects one of the reconfiguration target layer and the determined reconfiguration layers based on performance information of the reconfiguration target layer and performance information of each of the determined reconfiguration layers, and implements one of the determined reconfigured layers in the neural network model based on the selecting of the determined reconfiguration layers.
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公开(公告)号：US12260146B2
公开(公告)日：2025-03-25
申请号：US18368307
申请日：2023-09-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungoh Kim , Choelmin Park , Jaeyung Yeo , Chungwan Hong
Abstract: Provided is a wearable device that includes: a first display provided on a first surface of the wearable device configured to face a face of a user wearing the wearable device, and a second display provided on a second surface of the wearable device configured to face an external environment of the wearable device when the wearable device is worn by the user. The wearable device may be configured to display a first execution screen of a first application on the first display, while the wearable device is worn by the user, determine a display type for information to be displayed on the second display, while displaying the first execution screen on the first display, and display information related to the first execution screen on the second display based on the display type.
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公开(公告)号：US12260058B2
公开(公告)日：2025-03-25
申请号：US17948422
申请日：2022-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Changbyung Park , Myeongsil Park
Abstract: According to certain embodiments, an electronic device comprises: a display; a coil array layer disposed under the display; a magnetic layer disposed under the coil array layer; a conductive layer disposed under the magnetic layer; a conductive plate disposed under the conductive layer; a bracket disposed under the conductive plate; and a magnetic component disposed on the bracket and under the conductive plate, wherein the conductive layer has a first opening, and the first opening and the magnetic component at least partially overlap each other.
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