Touch and light sensing using integrated micro circuitry

    公开(公告)号:US12197665B2

    公开(公告)日:2025-01-14

    申请号:US17933820

    申请日:2022-09-20

    Applicant: Apple Inc.

    Abstract: An electronic device can include integrated micro circuitry configurable for optical sensing and touch and/or proximity sensing. An integrated touch screen can include light emitting diodes or organic light emitting diodes and chiplets. In some examples, the LEDs/OLEDs and chiplets can be disposed in a visible area of the integrated touch screen. In some examples, some or all of the chiplets can be disposed outside of the visible area of the integrated touch screen. In some examples, the chiplets can include display driving circuitry and touch sensing circuitry, and can optionally perform optical sensing using the touch sensing circuitry. In some examples, the chiplets can include separate touch chiplets configured to perform touch sensing (and/or optical sensing) and display chiplets configured to perform display functionality (and optionally provide some switching functionality).

    Lens holder to compensate for optical focal shift by thermo-mechanical expansion

    公开(公告)号:US12197110B2

    公开(公告)日:2025-01-14

    申请号:US16830117

    申请日:2020-03-25

    Applicant: Apple Inc.

    Abstract: A camera module includes a lens assembly, a lens holder, and an image sensor assembly. The lens assembly includes a lens barrel and multiple lens elements embedded within the lens barrel. A change of temperature causes an optical focal shift that is determined according to an optical thermal shift rate associated with an optical design of the lens assembly. The lens holder has a lens holder CTE to compensate for the optical focal shift by thermo-mechanical expansion. The change of temperature causes a length expansion of the lens holder determined at least in part according to the lens holder CTE. The image sensor assembly includes an image sensor and a substrate coupled to the image sensor, the image sensor to capture light passing through the multiple lens elements and convert the captured light into image signals. The lens holder is attached to the lens barrel and the substrate using adhesives.

    Wideband Millimeter Wave Via Transition

    公开(公告)号:US20250016923A1

    公开(公告)日:2025-01-09

    申请号:US18774455

    申请日:2024-07-16

    Applicant: Apple Inc.

    Abstract: Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.

    Systems With Networked Electronic Devices and Shared Resources

    公开(公告)号:US20250016809A1

    公开(公告)日:2025-01-09

    申请号:US18896551

    申请日:2024-09-25

    Applicant: Apple Inc.

    Abstract: A system may include electronic devices such as a head-mounted electronic device, a cellular telephone, a wristwatch device, a computer, and other devices. During operation of the system, one or more of the electronic devices may gather information on the positions of the electronic devices. Information may also be gathered on the positions of objects and obstructions. This position information and/or other information such as information on which sensor resources are available in each of the devices may be used to determine which of the sensors of the electronic devices in the room should be shared. Shared sensors may gather information that is communicated wirelessly to other devices for use by those devices.

    FORCE-ACTIVATED STYLUS
    535.
    发明申请

    公开(公告)号:US20250016491A1

    公开(公告)日:2025-01-09

    申请号:US18898429

    申请日:2024-09-26

    Applicant: Apple Inc.

    Abstract: An stylus includes a housing that defines a force input surface opposite a touch input surface. A spring member in the housing includes a first arm that biases a touch sensor toward the touch input surface. The spring member also includes a second arm that biases a first force electrode toward the housing and allows the first force electrode to move toward a second force electrode when a force is applied to the force input surface. A non-binary amount of the force is determinable using a change in a mutual capacitance between the first force electrode and the second force electrode. The mutual capacitance between the first force electrode and the second force electrode may be measured upon detecting a touch using the touch sensor.

    POWER AMPLIFIER WITH PROGRAMMABLE BANDWIDTH

    公开(公告)号:US20250015767A1

    公开(公告)日:2025-01-09

    申请号:US18218478

    申请日:2023-07-05

    Applicant: Apple Inc.

    Inventor: Ahmed G Radwan

    Abstract: This disclosure is directed to a power amplifier including a programmable impedance matching circuit. The programmable impedance matching circuit may include a programmable primary inductor and a secondary inductor. The programmable primary inductor may adjust a center frequency (e.g., resonant frequency) for providing amplified signals by the power amplifier to improve (e.g., expand) a frequency bandwidth of the power amplifier. As such, the power amplifier may have improved frequency bandwidth compared to other power amplifiers.

    BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES

    公开(公告)号:US20250015027A1

    公开(公告)日:2025-01-09

    申请号:US18348925

    申请日:2023-07-07

    Applicant: Apple Inc.

    Abstract: Various embodiments of an integrated circuit (IC) die package are disclosed. An IC die package includes an IC die, an interposer structure electrically connected to the IC die, a first bonding structure, and a second bonding structure. The first bonding structure includes a first dielectric layer disposed on the IC die and also includes a first conductive pad having an embedded portion disposed in the first dielectric layer and an anchor portion extending over a top surface of the first dielectric layer. The second bonding structure includes a second dielectric layer disposed on the interposer structure, a second conductive pad disposed in the second dielectric layer, and an anchor layer surrounding the anchor portion.

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