公开(公告)号：US11546818B2

公开(公告)日：2023-01-03

申请号：US17036180

申请日：2020-09-29

申请人： KYOCERA Corporation

发明人： Masato Fujishiro ,  Henry Chang

IPC分类号： H04W36/08 ,  H04W36/38 ,  H04W48/20 ,  H04W48/16 ,  H04W36/22 ,  H04W36/30 ,  H04W48/02 ,  H04W36/00 ,  H04W48/06

摘要： A cell reselection control method according to an embodiment comprises transmitting, by a base station configured to manage a cell having a first coverage and a second coverage as a portion enhanced more than the first coverage, to a radio terminal under the cell, a reselection instruction that instructs to reselect a neighboring cell different from the cell, and reselecting, by the radio terminal, the neighboring cell according to the reselection instruction when the radio terminal is in the second coverage.

公开(公告)号：US11541462B2

公开(公告)日：2023-01-03

申请号：US16641113

申请日：2018-09-06

申请人： KYOCERA Corporation ,  Zhanlong Zhang

发明人： Zhanlong Zhang

IPC分类号： B23B27/16 ,  B23C5/20 ,  B23C5/06

摘要： A cutting insert has: an upper surface; a lower surface; a side surface, having a first surface and a second surface disposed opposite each other between the upper surface and the lower surface; and a first cutting edge. The lower surface has a plurality of slots extending from a side of the first surface to a side of the second surface. In addition, when viewed from a side of the lower surface, if the angle between a ridge line on which the upper surface and the first surface intersect and an imaginary extension line of the plurality of slots is defined as θ1, and the angle between a ridge line on which the lower surface and the first surface intersect and the imaginary extension line is defined as θ2, then θ2>θ1.

公开(公告)号：US20220415714A1

公开(公告)日：2022-12-29

申请号：US17620799

申请日：2020-06-25

申请人： KYOCERA Corporation

发明人： Kentaro MURAKAWA ,  Katsuaki MASAKI

IPC分类号： H01L21/78

摘要： Included are: an underlying substrate including a first surface; a semiconductor element layer dividable into a plurality of element portions, the semiconductor element layer being located on the first surface of the underlying substrate; and a support substrate including a second surface on which the semiconductor element layer is located, the second surface facing the first surface, the semiconductor element layer being located on the second surface. The support substrate and the semiconductor element layer include a weak portion used to divide the semiconductor element layer into the plurality of element portions.

公开(公告)号：US20220410571A1

公开(公告)日：2022-12-29

申请号：US17773025

申请日：2020-10-30

申请人： KYOCERA CORPORATION ,  KYOCERA DOCUMENT SOLUTIONS INC.

发明人： Masaru IWABUCHI ,  Hiroyuki TOMIOKA

IPC分类号： B41J2/14

摘要： A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.

公开(公告)号：US20220406641A1

公开(公告)日：2022-12-22

申请号：US17620842

申请日：2020-06-25

申请人： KYOCERA Corporation

发明人： Keiichiro WATANABE

IPC分类号： H01L21/683 ,  H01L21/78

摘要： A method for manufacturing a semiconductor element according to the present disclosure includes an element layer forming step of forming a semiconductor element layer on a first surface of a ground substrate; a first supporting substrate preparing step of positioning a first supporting substrate that has a third surface and has a bonding material located on the third surface so that the third surface faces the first surface; a pressing step of causing the bonding material to enter a gap between the ground substrate and the semiconductor element layer; and a peeling step of peeling off the first supporting substrate, the bonding material, and the semiconductor element layer from the ground substrate.

公开(公告)号：US20220405833A1

公开(公告)日：2022-12-22

申请号：US17755150

申请日：2020-10-22

申请人： KYOCERA CORPORATION

发明人： Takashi FURUKAWA ,  Kenta OKINO

IPC分类号： G06Q30/08 ,  G06Q20/38 ,  G06Q20/40 ,  G06Q50/06

摘要： A transaction assistance system for assisting a predetermined transaction at a transaction target time includes a controller for determining, from among two or more facilities, a candidate for a transaction facility performing a transaction in a predetermined transaction market, a transmitter transmitting, to a management server belonging to a management entity managing the two or more facilities, transaction facility information specifying the candidate for the transaction facility, and a receiver receiving, from the management server, transaction established facility information specifying a transaction established facility in which the predetermined transaction is established in the predetermined transaction market. The transmitter transmits, to a verification server belonging to a verification entity verifying a result of the predetermined transaction, transaction established facility information specifying the transaction established facility.

公开(公告)号：US20220404286A1

公开(公告)日：2022-12-22

申请号：US17765410

申请日：2020-09-30

申请人： KYOCERA Corporation

发明人： Masaya WATANABE

IPC分类号： G01N21/80 ,  G01N33/50

摘要： A method and a device allow measurement of the pH value of a solution. The method includes illuminating a solution containing a pH indicator and a pH changer with light emitted from a light emitting element, receiving light transmitted through the solution with a light receiving element, measuring absorbance with monochromatic light selectively from the received transmitted light, and calculating a pH value corresponding to the measured absorbance based on a predefined absorbance table. The device includes an illuminator that illuminates a solution containing a pH indicator and a pH changer with light emitted from a light emitting element, a light receiver that receives light transmitted through the solution, a measurer that measures absorbance with light with a wavelength of monochromatic light selectively from the received transmitted light, and a calculator that calculates a pH value corresponding to the absorbance measured by the measurer based on a predefined absorbance table.

公开(公告)号：US20220402268A1

公开(公告)日：2022-12-22

申请号：US17755225

申请日：2020-10-28

申请人： KYOCERA CORPORATION

发明人： Atsushi ARAKI

IPC分类号： B41J2/14

摘要： A liquid droplet discharge head includes a reservoir having a slit portion through which a flexible substrate is extracted outward. A closing member is disposed in the slit portion, and a sealing resin is disposed on the closing member.

公开(公告)号：US20220398389A1

公开(公告)日：2022-12-15

申请号：US17771041

申请日：2020-10-21

申请人： KYOCERA Corporation

发明人： Takeshi HASEGAWA

IPC分类号： G06K7/10 ,  H05K1/16 ,  H05K1/02 ,  H01Q7/00 ,  G06K19/07

摘要： An RFID tag substrate includes an insulating substrate that has a mounting region in which a semiconductor device is disposed, the mounting region being included in a first surface of the insulating substrate, and a coil that is positioned at an outer edge portion of the insulating substrate. The coil includes a plurality of first coil conductors and a plurality of second coil conductors that are wound such that the first coil conductors and the second coil conductors each have the same number of turns and such that a direction in which the first coil conductors are wound and a direction in which the second coil conductors are wound are opposite to each other. The first coil conductors and the second coil conductors are alternately arranged in a thickness direction of the insulating substrate and connected in series to one another.

公开(公告)号：US20220396081A1

公开(公告)日：2022-12-15

申请号：US17778401

申请日：2020-11-19

申请人： KYOCERA CORPORATION

发明人： Narito KAJI ,  Yosuke IWAMOTO ,  Ryohei MATSUBARA

IPC分类号： B41J2/335 ,  B41J2/345

摘要： A thermal head includes a head base, a wiring board, a plurality of recessed portions, a contact portion, a plurality of drive ICs, a plurality of wire members, and a resin member. The head base includes a substrate. The wiring board is located adjacent to the head base. The plurality of recessed portions are located adjacent to the head base. The contact portion is located between the recessed portions adjacent to each other, and the substrate and the wiring board are in contact with each other at the contact portion. The plurality of drive ICs are located on the first surface of the wiring board so as to face one by one the plurality of recessed portions. The plurality of wire members are located across the recessed portions and electrically connect the substrate and the drive ICs. The resin member seals the plurality of wire members and the plurality of drive ICs.