公开(公告)号：US20170268835A1

公开(公告)日：2017-09-21

申请号：US15075525

申请日：2016-03-21

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN

IPC分类号： F28F21/08 ,  F28D15/04 ,  F28D15/02 ,  F28F3/04

CPC分类号： F28F21/081 ,  F28D15/02 ,  F28D15/0233 ,  F28D15/025 ,  F28D15/046 ,  F28D2015/0216 ,  F28F3/048 ,  F28F13/04 ,  F28F21/084 ,  F28F21/085 ,  F28F21/089 ,  F28F2245/04

摘要： In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

公开(公告)号：US20170268828A1

公开(公告)日：2017-09-21

申请号：US15212719

申请日：2016-07-18

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN

IPC分类号： F28D15/02

CPC分类号： F28D15/02 ,  F28D15/0233 ,  F28F3/02 ,  F28F3/12 ,  H01L23/427 ,  H01L23/473

摘要： A liquid-cooling heat dissipating apparatus includes a heat dissipating structure and a cover. The heat dissipating structure includes a vapor chamber, a heat exchanger and a heat dissipating component. The vapor chamber has a hollow slot. The heat exchanger is installed to the vapor chamber and has plural heat exchange plates and a through hole. The through holes of the upper and lower heat exchange plates communicate with each other to form a fluid channel. The heat dissipating component includes a substrate and plural fins, and the heat dissipating component seals the hollow slot by the substrate. The cover covers the vapor chamber and forms a liquid cavity, and the heat exchanger and each fin are formed in the liquid cavity, and the cover has a water inlet and a water outlet communicating with the liquid cavity.

公开(公告)号：USD1026838S1

公开(公告)日：2024-05-14

申请号：US29836398

申请日：2022-04-26

申请人： TAIWAN MICROLOOPS CORP.

设计人： Chun-Hung Lin

摘要： FIG. 1 is a perspective view of a heat dissipation module showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a reference view showing the heat dissipation module.
The broken lines in the drawings illustrate pod ions of the heat dissipation module that form no part of the claimed design.

公开(公告)号：US11892240B2

公开(公告)日：2024-02-06

申请号：US17826121

申请日：2022-05-26

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung Lin

IPC分类号： F28D15/02 ,  F28D15/04

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  F28D15/046

摘要： A combination structure of a vapor chamber and a heat pipe includes a half-shell seat element, a half-shell cover element, a wick structure, and a working fluid. The half-shell seat element includes a vapor chamber half-shell seat and multiple heat pipe half-shell seats. Each heat pipe half-shell seat is extended from the vapor chamber half-shell seat. The vapor chamber half-shell seat includes a vapor chamber cavity. Each heat pipe half-shell seat includes a heat pipe cavity. Each heat pipe cavity communicates with the vapor chamber cavity. The half-shell cover element is sealedly connected with the half-shell seat element. The wick structure is continuously laid on the vapor chamber half-shell seat and each heat pipe half-shell seat, and is formed in the vapor chamber cavity and each heat pipe cavity. The working fluid is disposed in the vapor chamber cavity.

公开(公告)号：US20230324130A1

公开(公告)日：2023-10-12

申请号：US17744402

申请日：2022-05-13

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN

IPC分类号： F28D15/02 ,  F28D15/04 ,  H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/046 ,  F28D15/0233 ,  H05K7/20336

摘要： A heat dissipation module includes a housing, a first capillary structure, and at least two heat pipe assemblies. The outer periphery of the housing has multiple sidewalls. At least two sidewalls have an opening and an inner rim formed inside the opening. The first capillary structure covers the interior of the housing and is disposed along each inner rim. Each heat pipe assembly includes a cover plate, multiple heat pipes and a second capillary structure. Each cover plate has multiple through holes and an inner sidewall. Each heat pipe has an open end connected and sealed with each corresponding through hole. Each second capillary structure covers each inner sidewall and the interior of the heat pipes. Each cover plate covers each corresponding opening, such that each second capillary structure is attached closely to the first capillary structure.

公开(公告)号：US20230123190A1

公开(公告)日：2023-04-20

申请号：US17503260

申请日：2021-10-15

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN ,  Han-Lin CHEN

IPC分类号： F28D15/04

摘要： A vapor chamber includes an upper plate and a lower plate covering each other to form a hollow internal space, an evaporation portion and a condensation portion jointly formed by the upper plate and the lower plate, and a transmission portion communicating with the evaporation portion and the condensation portion. The transmission portion comprises multiple spoiler rods disposed therein to support between the lower plate and the upper plate. The spoiler rods at least include multiple first rods adjacent to an end of the evaporation portion and multiple second rods adjacent to an end of the condensation portion. A distance between any two of the first rods is less than a distance between any two of the second rods.

公开(公告)号：US20220346274A1

公开(公告)日：2022-10-27

申请号：US17240521

申请日：2021-04-26

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN

IPC分类号： H05K7/20 ,  F28D15/04

摘要： The disclosure provides a heat dissipation structure and a manufacturing method thereof. The heat dissipation structure includes a heat pipe and multiple heat dissipation fins. The heat pipe has an outer annular wall with multiple conic annular grooves. A slant inner annular wall is disposed in each conic annular groove. Each heat dissipation fin has a through hole and a conic annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner. Each conic annular wall is embedded in each conic annular groove to be adapted to sheathe each slant inner annular wall in a compressive manner. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.

公开(公告)号：US20220104392A1

公开(公告)日：2022-03-31

申请号：US17060064

申请日：2020-09-30

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung LIN

IPC分类号： H05K7/20

摘要： A heat dissipating module includes a heat dissipating assembly, a centrifugal fan, an airflow guiding hood and an auxiliary fan. The heat dissipating assembly includes a heat dissipating board and fins disposed thereon. Heat dissipating channels are formed between the fins. The centrifugal fan is disposed at a side of the heat dissipating channels. The airflow guiding hood covers the heat dissipating assembly and the centrifugal fan and is provided with a first airflow opening over the centrifugal fan, a second airflow opening over the fins and a third airflow opening at another side of the heat dissipating channels. The auxiliary fan is disposed between the fins and the second airflow opening.

公开(公告)号：US11125507B2

公开(公告)日：2021-09-21

申请号：US16690723

申请日：2019-11-21

申请人： TAIWAN MICROLOOPS CORP.

发明人： Chun-Hung Lin ,  Chun-Teng Chiu ,  Yi-Chung Chen ,  Chih-Wei Wang

IPC分类号： F28D15/00 ,  F28D15/02 ,  F28D1/053

摘要： A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.

公开(公告)号：US11044833B2

公开(公告)日：2021-06-22

申请号：US16655114

申请日：2019-10-16

申请人： TAIWAN MICROLOOPS CORP.

发明人： Yen-Chia Huang ,  Chun-Hung Lin

IPC分类号： H05K7/20

摘要： A water-cooled pressurized distributive heat dissipation system used for dissipating heat of servers in the rack is provided. The servers are fixed in the rack in a ranging direction. The system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pump and a water block in a corresponding one of the servers. The branch pump of each branch module connects between the distributing duct and the water block. The converging duct connects to the water blocks in the ranging direction.