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公开(公告)号：US20220388070A1
公开(公告)日：2022-12-08
申请号：US17774800
申请日：2019-12-05
Applicant: Hewlett-Packard Development Company, L.P.
Abstract: Examples of methods for predicting porosity are described herein. In some examples, a method includes predicting a height map. In some examples, the height map is of material for metal printing. In some examples, the method includes predicting a porosity of a precursor object. In some examples, predicting the porosity of the precursor object is based on the predicted height map.
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公开(公告)号：US11340597B2
公开(公告)日：2022-05-24
申请号：US16978227
申请日：2018-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Jun Zeng , Juan Carlos Catana , Sam A. Stodder
IPC: G05B19/418 , B33Y50/00 , B29C64/386 , G06Q10/06
Abstract: 3-D printing batch analysis is disclosed. A disclosed example apparatus includes a processor to generate a plurality of batches, wherein each of the batches represent an arrangement of a plurality of parts to be printed in a volume, discretize the batches into slices, and determine risk values of the slices based on the respective geometric primitives. The processor is to also determine aggregate risk values corresponding to the batches based on the risk values of the slices of the respective batches, and select a batch of the plurality of batches based on the aggregate risk values. The example apparatus also includes a printer to print the selected batch in the volume.
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公开(公告)号：US11335074B2
公开(公告)日：2022-05-17
申请号：US16345853
申请日：2016-12-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Ning Ge , Steven J. Simske , Chandrakant Patel , Jun Zeng , Paul J. Benning , Lihua Zhao
IPC: G05B19/4099 , G06T19/20 , B29C64/147 , G06T17/05 , B29C64/386
Abstract: According to an example, an apparatus may include a memory that may store instructions to cause a processor to generate, for each part to be fabricated in a build envelope of a 3D fabricating device, first level descriptions and second level descriptions for the part. The processor may determine, using the first level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing certain thermal decoupling spaces between the parts. In response to a determination that the arrangement using the first level descriptions for the parts has not been determined, the processor may determine, using the second level descriptions, whether there is an arrangement that results in the parts jointly fitting within the build envelope while providing the certain thermal decoupling spaces.
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公开(公告)号：US20220088879A1
公开(公告)日：2022-03-24
申请号：US17420029
申请日：2019-01-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Sunil Kothari , Tod Heiles , Juan Carlos Catana Salazar , Jun Zeng , Gary J. Dispoto
IPC: B29C64/393 , B29C64/188 , B29C64/165 , G06N3/08 , B33Y50/02 , B33Y40/20
Abstract: Systems and methods of predicting temperature during a build of a three-dimensional (3D) part include determining a temperature profile at a plurality of layers of a part based on geometric characteristics of the 3D part as defined by a 3D part file, and adjusting a process parameter of the build based on the determined temperature.
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公开(公告)号：US20220088878A1
公开(公告)日：2022-03-24
申请号：US17415188
申请日：2019-06-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Jun Zeng , Carlos Alberto Lopez Collier de la Marliere , He Luan
IPC: B29C64/393 , B33Y50/02 , G06F30/27 , B22F12/90 , B22F10/85
Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.
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Patent Agency Ranking
公开(公告)号：US11135775B2
公开(公告)日：2021-10-05
申请号：US16076363
申请日：2017-01-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Ning Ge , Steven J. Simske , Jun Zeng
IPC: B29C64/35 , B33Y30/00 , B33Y40/00 , B29C64/165 , B41J2/165
Abstract: According to an example, an apparatus may include a printhead to deliver a printing liquid from firing chambers through a plurality of bores arranged along a surface of the printhead. The apparatus may also include a cleaning system to apply a pressurized cleaning fluid onto the surface of the printhead while preventing application of the pressurized cleaning fluid into the firing chambers through the plurality of bores.
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公开(公告)号：US20210247735A1
公开(公告)日：2021-08-12
申请号：US17056191
申请日：2018-10-29
Applicant: Hewlett-Packard Development Company, L.P.
IPC: G05B19/4099 , G06N3/08 , G06T3/40 , B33Y30/00 , B33Y50/02 , B29C64/393
Abstract: Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
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公开(公告)号：US11043042B2
公开(公告)日：2021-06-22
申请号：US16072277
申请日：2016-05-16
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Ana Patricia Del Angel , Jun Zeng , Sebastia Cortes i Herms , Scott White
Abstract: According to an example, a processing device may slice a 3D model along a first direction to generate a plurality of layers in parallel planes defined across a second direction and a third direction, in which each of the plurality of layers is composed of respective polygons representing portions of the 3D model. The plurality of layers may be partitioned into a plurality of stacked boxes containing the respective polygons and for each stacked box of the plurality of stacked boxes, the polygons in the stacked box may be assembled into a superset polygon and the superset polygon may be partitioned into bounding shapes. A shape profile of the 3D object may be generated using the bounding shapes.
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公开(公告)号：US20210150343A1
公开(公告)日：2021-05-20
申请号：US17047303
申请日：2018-08-10
Applicant: Hewlett-Packard Development Company, L.P.
Abstract: A system includes a machine readable storage medium storing instructions and a processor. The processor is to execute instructions to receive contone agent maps of a three-dimensional (3D) part and sensed thermal maps from the 3D printing of the 3D part on a 3D printer. The processor is to execute instructions to generate layer sequences including the contone agent maps and the sensed thermal map for each layer of the 3D part. The processor is to execute instructions to select training samples from the layer sequences having temperature intensity variations within each layer or between neighboring layers. The processor is to execute instructions to train a neural network using the training samples to generate a model to predict thermal behavior in the 3D printer.
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公开(公告)号：US20210039320A1
公开(公告)日：2021-02-11
申请号：US16978281
申请日：2018-04-27
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： David Tucker , Nicholas Saunders , Jun Zeng
IPC: B29C64/386 , B33Y50/00 , G06F30/12 , G05B19/4099
Abstract: A parts packing method is used to optimize build bed part placement for additive manufacturing. The method includes a user interface to parts packing software, enabling a process engineer to select parts from a pool of parts, group parts to have uniform orientation, and specify a range of angles and rotation of the parts. Additionally, the user interface accepts input related to process variations among different printers as well as drift over time of a single printer. The user interface feeds the data into the parts packing program to optimize build bed part placement.
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