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63 条记录 (耗时 0.029 秒)

    HEAT DISSIPATION MODULE
    51.
    发明申请
    HEAT DISSIPATION MODULE 审中-公开
    散热模块

    公开(公告)号：US20080135210A1

    公开(公告)日：2008-06-12

    申请号：US11675844

    申请日：2007-02-16

    申请人： Frank Wang ,  Chih-Kai Yang

    发明人： Frank Wang ,  Chih-Kai Yang

    IPC分类号： F28F1/00 ,  H05K7/20

    CPC分类号： F28D15/0233 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat dissipation module including a housing, a fan module, a cooling fin set, and a heat pipe is provided. The housing has a fan accommodation area, a first heat dissipation area, a second heat dissipation area, and a heat conducting area. The fan module is disposed in the fan accommodation area, and the cooling fin set is disposed in the first heat dissipation area. The heat pipe has a heat absorbing portion, a curved portion, and a heat dissipation portion, and the curved portion connects the heat absorbing portion and the heat dissipation portion. The curved portion is in thermal contact with the second dissipation area, and the heat dissipation portion is in thermal contact with the cooling fin set. Thus, the efficiency of heat dissipation of the heat pipe is improved.

    摘要翻译： 提供了一种散热模块，包括外壳，风扇模块，散热片组和热管。 壳体具有风扇容纳区域，第一散热区域，第二散热区域和导热区域。 风扇模块设置在风扇容纳区域中，并且散热片组设置在第一散热区域中。 热管具有吸热部分，弯曲部分和散热部分，并且弯曲部分连接吸热部分和散热部分。 弯曲部分与第二散热区域热接触，并且散热部分与散热片组件热接触。 因此，热管的散热效率提高。

    Injector with a coating head
    52.
    发明申请
    Injector with a coating head 审中-公开
    注射器带涂层头

    公开(公告)号：US20070240639A1

    公开(公告)日：2007-10-18

    申请号：US11405640

    申请日：2006-04-18

    申请人： Frank Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

    发明人： Frank Wang ,  Yi-Lun Cheng ,  Jui-Chan Fan ,  Chun-Yi Chang ,  Chun-Lung Lin ,  Chih-Kai Yang

    IPC分类号： B05C3/02 ,  B05C1/00

    CPC分类号： B05C17/00516 ,  B05C5/02 ,  H01L21/4882

    摘要： An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.

    摘要翻译： 提供一种具有涂覆头的注射器，用于将散热膏均匀地涂覆在待涂覆的表面上，其包括主体，活塞和涂覆头，其中活塞被压制以迫使散热器膏从 通过涂布头将散热膏模制成适于均匀涂布被覆表面的形状，并且也被定量。 此外，在涂层头部的开口部设置有刮削面，从钢板上刮掉多余的散热膏，并且在使用钢板来辅助该散热片的情况下使散热膏的表面平滑化 定量散热片的操作。

    Heat sink conduction apparatus
    53.
    发明授权
    Heat sink conduction apparatus 有权
    散热片传导装置

    公开(公告)号：US07277293B2

    公开(公告)日：2007-10-02

    申请号：US11103308

    申请日：2005-04-11

    申请人： Chih-Kai Yang ,  Frank Wang ,  Yi-Lun Cheng

    发明人： Chih-Kai Yang ,  Frank Wang ,  Yi-Lun Cheng

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal pad, where is connected with the heat source component, has at least one buckle pillar and one screw pillar. The clip includes a pair of spring plates and a pair of beams; each of the spring plate corresponding to each of the buckle pillar has a buckle and corresponding to each of the screw pillar has a screwed hole. The thermal pad supported a clip by the buckle pillar and the screw pillar, via the connection of the clip with the buckle pillar and the screw pillar, the heat source component can be fixed and make the surface of the heat source component to connect with the thermal pad in heat conductive manner.

    摘要翻译： 公开了散热器导电装置。 散热器导电装置用于电子装置的散热器组件中以与热源组件进行热传导。 该装置包括热垫和夹子。 散热垫的与热源部件连接的一侧具有至少一个带扣柱和一个螺柱。 夹子包括一对弹簧板和一对梁; 每个与每个带扣相对应的弹簧板具有带扣，并且对应于每个螺柱具有螺纹孔。 散热垫通过带扣柱和螺柱支撑夹子，通过夹子与带扣柱和螺柱的连接，可以固定热源部件，使热源部件的表面与 散热垫采用导热方式。

    Chipset coupling apparatus
    54.
    发明授权
    Chipset coupling apparatus 有权
    芯片组耦合装置

    公开(公告)号：US07265990B2

    公开(公告)日：2007-09-04

    申请号：US11130283

    申请日：2005-05-17

    申请人： Frank Wang ,  Chih-Kai Yang

    发明人： Frank Wang ,  Chih-Kai Yang

    IPC分类号： H05K1/14

    CPC分类号： H05K7/1053

    摘要： A chipset coupling apparatus mounted onto a chipset-coupling seat of a printed circuit board includes a compression plate, which has an opening to allow a cooling section of a chipset to extend there through. The compression plate has anchor members on two opposite sides to latch on the chipset coupling seat. The compression plate can press the pin board of the chipset and enable the anchor members and the chipset coupling seat to form a latch relationship, so that a heat sink may be removed from the chipset, without removing the chipset at the same time, to avoid damage of the pins on the chipset.

    摘要翻译： 安装在印刷电路板的芯片组耦合座上的芯片组耦合装置包括压缩板，该压缩板具有允许芯片组的冷却部分在其上延伸的开口。 压缩板在两个相对的侧面上具有锚固构件，以锁定在芯片组联接座上。 压缩板可以按压芯片组的销板并使锚定构件和芯片组联接座形成闩锁关系，从而可以从芯片组移除散热器，而不必同时移除芯片组，以避免 芯片组引脚损坏。

    Controlling optical power and extincation ratio of a semiconductor laser
    55.
    发明申请
    Controlling optical power and extincation ratio of a semiconductor laser 审中-公开
    控制半导体激光器的光功率和退火比

    公开(公告)号：US20070116076A1

    公开(公告)日：2007-05-24

    申请号：US11284755

    申请日：2005-11-21

    申请人： Frank Wang ,  Chien-Chang Liu ,  HengJu Cheng ,  Lee Xu

    发明人： Frank Wang ,  Chien-Chang Liu ,  HengJu Cheng ,  Lee Xu

    IPC分类号： H01S3/00

    CPC分类号： H01S5/0683 ,  G02B6/4204 ,  H01S5/02212 ,  H01S5/02284 ,  H01S5/0617 ,  H01S5/06832 ,  H04B10/564

    摘要： Disclosed herein are methods, apparatus, and systems to achieve substantially constant optical power and/or extinction ratio for a semiconductor laser. In one aspect, a microcontroller of an optical transmitter may adjust an electrical current that is provided to a semiconductor laser based at least in part on a comparison of a first measured optical power of light emitted by the semiconductor laser and a predetermined target optical power. The microcontroller may then determine an electrical current that is capable of giving the semiconductor laser a substantially constant extinction ratio by evaluating an equation with the first measured optical power and a second optical power measured after the controller adjusts the electrical current.

    摘要翻译： 本文公开了实现半导体激光器的基本恒定的光功率和/或消光比的方法，装置和系统。 在一个方面，光发射机的微控制器至少部分地基于半导体激光器发射的光的第一测量光功率和预定目标光功率的比较来调节提供给半导体激光器的电流。 微控制器然后可以通过利用第一测量光功率和在控制器调节电流之后测量的第二光功率来评估能够给予半导体激光器基本恒定的消光比的电流。

    Fastening structure
    56.
    发明申请
    Fastening structure 失效
    紧固结构

    公开(公告)号：US20070086169A1

    公开(公告)日：2007-04-19

    申请号：US11255039

    申请日：2005-10-19

    申请人： Frank Wang ,  Chih-Kai Yang

    发明人： Frank Wang ,  Chih-Kai Yang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A fastening structure for securing a heatsink module is provided. The structure includes at least a first fastening piece attached to the circuit board and having a first fastening member; a heat spreader having its attached side connected to the heatsink module, hence able to swing vertically, and a pair of first positioning members protrudingly provided on the thermal spread; a second fastening piece having a second fastening member to connect to the first fastening member and a fulcrum to suppress the heat spreader, the second fastening piece having suitable elasticity for the second fastening member to swing vertically and axially around the fulcrum; and a suppressing member having a pair of second positioning members to engage the first positioning members and having a portion press against the top of fulcrum to ensure the state of engagement between the first fastening piece and the second fastening piece.

    摘要翻译： 提供了用于固定散热器模块的紧固结构。 该结构包括至少一个附接到电路板并具有第一紧固构件的第一紧固件; 散热器的连接侧连接到散热器模块，因此能够垂直摆动;一对第一定位构件突出地设置在热扩散部上; 第二紧固件具有连接到第一紧固构件的第二紧固构件和用于抑制散热器的支点，第二紧固件具有适当的弹性，用于第二紧固构件围绕支点垂直和轴向地摆动; 以及抑制构件，具有一对第二定位构件，以与第一定位构件接合，并且将一部分压靠在支点的顶部，以确保第一紧固件和第二紧固件之间的接合状态。

    Chipset coupling apparatus
    58.
    发明申请
    Chipset coupling apparatus 有权
    芯片组耦合装置

    公开(公告)号：US20060264078A1

    公开(公告)日：2006-11-23

    申请号：US11130283

    申请日：2005-05-17

    申请人： Frank Wang ,  Chih-Kai Yang

    发明人： Frank Wang ,  Chih-Kai Yang

    IPC分类号： H01R13/44

    CPC分类号： H05K7/1053

    摘要： A chipset coupling apparatus mounted onto a chipset-coupling seat of a printed circuit board includes a compression plate, which has an opening to allow a cooling section of a chipset to extend there through. The compression plate has anchor members on two opposite sides to latch on the chipset coupling seat. The compression plate can press the pin board of the chipset and enable the anchor members and the chipset coupling seat to form a latch relationship, so that a heat sink may be removed from the chipset, without removing the chipset at the same time, to avoid damage of the pins on the chipset.

    摘要翻译： 安装在印刷电路板的芯片组耦合座上的芯片组耦合装置包括压缩板，该压缩板具有允许芯片组的冷却部分在其上延伸的开口。 压缩板在两个相对的侧面上具有锚固构件，以锁定在芯片组联接座上。 压缩板可以按压芯片组的销板并使锚定构件和芯片组联接座形成闩锁关系，从而可以从芯片组移除散热器，而不必同时移除芯片组，以避免 芯片组引脚损坏。

    Heat sink conduction apparatus
    59.
    发明申请
    Heat sink conduction apparatus 有权
    散热片传导装置

    公开(公告)号：US20060227509A1

    公开(公告)日：2006-10-12

    申请号：US11103308

    申请日：2005-04-11

    申请人： Chih-Kai Yang ,  Frank Wang ,  Yi-Lun Cheng

    发明人： Chih-Kai Yang ,  Frank Wang ,  Yi-Lun Cheng

    IPC分类号： H05K7/20

    CPC分类号： G06F1/203 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal pad, where is connected with the heat source component, has at least one buckle pillar and one screw pillar. The clip includes a pair of spring plates and a pair of beams; each of the spring plate corresponding to each of the buckle pillar has a buckle and corresponding to each of the screw pillar has a screwed hole. The thermal pad supported a clip by the buckle pillar and the screw pillar, via the connection of the clip with the buckle pillar and the screw pillar, the heat source component can be fixed and make the surface of the heat source component to connect with the thermal pad in heat conductive manner.

    摘要翻译： 公开了散热器导电装置。 散热器导电装置用于电子装置的散热器组件中以与热源组件进行热传导。 该装置包括热垫和夹子。 散热垫的与热源部件连接的一侧具有至少一个带扣柱和一个螺柱。 夹子包括一对弹簧板和一对梁; 每个与每个带扣相对应的弹簧板具有带扣，并且对应于每个螺柱具有螺纹孔。 散热垫通过带扣柱和螺柱支撑夹子，通过夹子与带扣柱和螺柱的连接，可以固定热源部件，使热源部件的表面与 散热垫采用导热方式。