摘要:
A nonvolatile semiconductor integrated circuit having a cell array consisting of a plurality of memory strings each having first to N-th (N=2, 3, 4, . . . ) memory cell transistors of a NAND structure includes a plurality of first string select transistors connected in series to the first memory cell transistor, and a plurality of second string select transistors connected in series to the N-th memory cell transistor. One of the string select transistors serially connected to the first and N-th memory cell transistors has a control terminal connected to a ground connecting point, thus to have a ground select function as well as a string select function.
摘要:
A mask ROM having a defect repairing function stores address signals corresponding to a defective memory cell and then, selectively activates either a redundancy row decoder or a row decoder according to whether the address signals stored are identical to address signals supplied externally. The mask ROM includes first and second memory cell arrays formed by grouping in a word line direction a plurality of read only memory cells arranged in rows and columns; first and second row decoders for combining row address signals supplied externally so as to selectively drive the word lines of the first and second memory cell arrays; and a row decoder selector for storing therein address signals according to a row block including a defective memory cell, of the first memory cell array so as to inactivate the first row decoder and activate the second row decoder when the external row address signals are equal to the address signals stored in the row decoder selector.
摘要:
A plural test mode selection circuit in a semiconductor device capable of extending the number of option modes, e.g., up to 16 option modes by adding a high voltage sensing circuit 15 to any one of a plurality of input pads and by arranging a master decoder 25 and a slave decoder 20 each coupled to a plurality of buffer circuits 11-14, as well as a mode selector 30 and a plurality of address/control pads 5-9, and then an output of a high voltage sensing circuit 15 and respective outputs of the master decoder 25 and a slave decoder 20 are combined together at a mode selector 30, so that a plurality of test modes selection is possible therefrom. In addition, the invention also has an advantage capable of testing a chip even after it has been made into a package because of utilizing the address/control pad used in a general read/write operation.