公开(公告)号：US20080179744A1

公开(公告)日：2008-07-31

申请号：US11739515

申请日：2007-04-24

Applicant: Cheng-Po Yu

Inventor： Cheng-Po Yu

IPC: H01L23/48

CPC classification number: H05K1/116 ,  H01L21/6835 ,  H01L2221/68359 ,  H05K3/20 ,  H05K3/4644 ,  H05K3/4658 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  Y10T29/49124

Abstract: A circuit structure has a first dielectric layer, a first circuit pattern embedded in the first dielectric layer and having a first via pad, a first conductive via passing through the first dielectric layer and connecting to the first via pad, and an independent via pad disposed on a surface of the first dielectric layer away from the first via pad and connecting to one end of the first conductive via. The circuit structure further has a second dielectric layer disposed over the surface of the first dielectric layer where the independent via pad is disposed, a second conductive via passing through the second dielectric layer and connecting to the independent via pad, and a second circuit pattern embedded in the second dielectric layer, located at a surface thereof away from the independent via pad, and having a second via pad connected to the second conductive via.

Abstract translation: 电路结构具有第一电介质层，第一电路图案，其嵌入在第一电介质层中并且具有第一通孔焊盘，穿过第一电介质层并连接到第一通孔焊盘的第一导电通孔和设置在第一电介质层上的独立通孔焊盘 在第一电介质层的远离第一通孔焊盘的表面上并连接到第一导电通孔的一端。 电路结构还具有设置在第一电介质层的表面上的第二电介质层，其中设置独立通孔焊盘，通过第二介电层并连接到独立通孔焊盘的第二导电通孔和嵌入的第二电路图案 在第二电介质层中，位于其远离独立通孔焊盘的表面，并且具有连接到第二导电通孔的第二通孔焊盘。