公开(公告)号：US20160135288A1

公开(公告)日：2016-05-12

申请号：US14580756

申请日：2014-12-23

Applicant: ALCATEL-LUCENT CANADA, INC.

Inventor： PAUL J. BROWN ,  ALEX L. CHAN

IPC: H05K1/02 ,  H05K1/11 ,  G06F17/50 ,  H05K3/46

CPC classification number: H05K1/0251 ,  G06F17/5077 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/09454 ,  H05K2201/09781 ,  H05K2203/0207

Abstract: Disclosed is a printed circuit board (PCB) having backdrill reliability anchors comprising nonfunctional pads to provide mechanical reinforcement for signal pads on backdrilled plated through hole (PTH) vias, as well as associated method and machine readable storage medium.

Abstract translation: 公开了一种印刷电路板（PCB），其具有包括非功能焊盘的反向钻孔可靠性锚，以提供用于背部钻孔电镀通孔（PTH）通孔上的信号焊盘的机械加强，以及相关联的方法和机器可读存储介质。

公开(公告)号：US20150048906A1

公开(公告)日：2015-02-19

申请号：US14531058

申请日：2014-11-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO ,  Satoshi ISHINO ,  Jun SASAKI

IPC: H01P3/08 ,  H01P11/00 ,  H01P3/02

CPC classification number: H01P3/08 ,  H01P3/02 ,  H01P3/085 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/147 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727 ,  Y10T29/49123

Abstract: A high-frequency signal line includes a first base layer having flexibility, a linear signal line provided on the first base layer and including a first line portion having a first width and a second line portion having a second width greater than the first width, and a first reinforcing conductor provided on the first base layer along the first line portion.

Abstract translation: 高频信号线包括具有柔性的第一基底层，设置在第一基底层上的线性信号线，并且包括具有第一宽度的第一线部分和具有大于第一宽度的第二宽度的第二线部分，以及 沿第一线部分设置在第一基底层上的第一加强导体。

公开(公告)号：US08671565B1

公开(公告)日：2014-03-18

申请号：US12800757

申请日：2010-05-21

Applicant: Bob Shih-Wei Kuo

Inventor： Bob Shih-Wei Kuo

IPC: H01R43/00 ,  H05K13/00

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/107 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09454 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2072 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

Abstract translation: 捕获垫结构包括下介电层，嵌入在下介电层内的捕获垫，捕获垫包括多个线性段。 为了形成捕获垫，聚焦的激光束线性地移动以在介电层中形成线性通道。 这些通道填充有导电材料以形成捕获垫。

公开(公告)号：US08476537B2

公开(公告)日：2013-07-02

申请号：US12675678

申请日：2007-08-31

Applicant: Taras Kushta

Inventor： Taras Kushta

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/09781

Abstract: A multi-layer substrate includes a planar transmission line structure and a signal via, which are connected by a multi-tier transition. The multi-tier transition includes a signal via pad configured to serve for a full-value connection of the signal via and the planar transmission line; and a dummy pad connected to the signal via, formed in an area of a clearance hole in a conductor layer disposed between a signal terminal of the signal via and the planar transmission line, and isolated from the conductor layer.

Abstract translation: 多层基板包括通过多层转换连接的平面传输线结构和信号通孔。 多层转换包括经配置以用于信号通孔和平面传输线的全值连接的信号通孔; 以及连接到信号通孔的虚拟焊盘，形成在布置在信号通孔的信号端子和平面传输线之间并与导体层隔离的导体层中的间隙孔的区域中。

公开(公告)号：US08453322B2

公开(公告)日：2013-06-04

申请号：US12539172

申请日：2009-08-11

Applicant: Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor ,  Ruben Zepeda

Inventor： Raj Kumar ,  Monte Dreyer ,  Michael J. Taylor ,  Ruben Zepeda

IPC: H01K3/10

CPC classification number: H05K3/4614 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/061 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Methods of manufacturing at least a portion of a printed circuit board. The circuit board is formed to include a plurality of sub-assemblies, each of the sub-assemblies including a plurality of circuit layers and having at least one countersink and at least one hole, the countersink having a first diameter and a first depth from a first side of at least one of the sub-assemblies and into the at least one sub-assembly, the hole having a second diameter smaller than the first diameter and a second depth longer than the first depth from the first side of the at least one sub-assembly and into the at least one sub-assembly at the countersink; a metal metalized within the hole and the countersink; a lamination adhesive interposed between one and a corresponding one of the sub-assemblies and having at least one via formed therethrough; and a counter paste filled within the via.

Abstract translation: 制造印刷电路板的至少一部分的方法。 电路板形成为包括多个子组件，每个子组件包括多个电路层并且具有至少一个埋头孔和至少一个孔，该埋头孔具有第一直径和从第一深度 至少一个子组件的第一侧并且进入至少一个子组件，该孔具有小于第一直径的第二直径和比该至少一个子组件的第一侧的第一深度长的第二深度 子组件并进入至少一个子组件在锪孔处; 孔内金属化和埋头孔; 插入在一个和相应的一个子组件之间并且具有通过其形成的至少一个通孔的层压粘合剂; 以及填充在通孔内的计数器糊状物。

公开(公告)号：US20120256320A1

公开(公告)日：2012-10-11

申请号：US13525779

申请日：2012-06-18

Applicant: Kentaro Kaneko

Inventor： Kentaro Kaneko

IPC: H05K1/11 ,  H01L23/48

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48227 ,  H01L2224/81801 ,  H01L2224/85444 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K1/113 ,  H05K3/108 ,  H05K3/205 ,  H05K3/382 ,  H05K3/423 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/098 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A semiconductor device 100 has such a structure that a semiconductor chip 110 is flip-chip mounted on a wiring board 120. The wiring board 120 has a multilayer structure in which a plurality of wiring layers and a plurality of insulating layers are arranged, and a first electrode pad 130 is formed on a chip mounting side. A taper surface 132 of the first electrode pad 130 has a gradient in an orientation reduced in an upward direction toward a solder connecting side or a chip mounting side. Therefore, a holding force for a force applied to the solder connecting side or the chip mounting side is increased, and furthermore, the taper surface 132 adheres to a tapered internal wall of an insulating layer of a first layer so that a bonding strength to the insulating layer is increased.

Abstract translation: 半导体器件100具有半导体芯片110倒装芯片安装在布线板120上的结构。布线板120具有布置多个布线层和多​​个绝缘层的多层结构，并且 第一电极焊盘130形成在芯片安装侧。 第一电极焊盘130的锥形表面132具有沿向上朝向焊接连接侧或芯片安装侧减小的取向的梯度。 因此，施加到焊料连接侧或芯片安装侧的力的保持力增大，此外，锥形表面132粘附到第一层的绝缘层的锥形内壁，使得与 绝缘层增加。

公开(公告)号：US20120119853A1

公开(公告)日：2012-05-17

申请号：US13386009

申请日：2009-07-21

Applicant: Taras Kushta

Inventor： Taras Kushta

IPC: H01P1/203

CPC classification number: H01P1/20345 ,  H01P1/2056 ,  H01P7/04 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09618 ,  H05K2201/09718

Abstract: A resonant element is provided with a multilayer board, comprising a plurality of conductor layers isolated by a dielectric, a signal via conductor, penetrating through the multilayer board, and a plurality of ground vias, penetrating thought the multilayer board and disposed around the signal via conductor. The multilayer board comprises a first conductor layer, a second conductor layer, and a corrugated conductor layer disposed between the first and the second conductor layers. The corrugated conductor layer comprises a corrugated signal plate, connected to the signal via conductor, and a corrugated ground plate, connected to the plurality of ground vias, isolated from the corrugated signal plate by the dielectric.

Abstract translation: 谐振元件设置有多层板，其包括通过电介质隔离的多个导体层，穿过多层板的信号通路导体和多个接地通孔，贯穿于多层板并且围绕信号通过 导体。 多层板包括第一导体层，第二导体层和布置在第一和第二导体层之间的波纹状导体层。 波纹状导体层包括连接到信号通孔导体的瓦楞信号板和连接到多个通孔的波纹接地板，通过电介质隔离波纹信号板。

公开(公告)号：US08003896B2

公开(公告)日：2011-08-23

申请号：US11832673

申请日：2007-08-02

Applicant: Youhong Wu

Inventor： Youhong Wu

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.

Abstract translation: 多层印刷线路板具有芯基板，形成在芯基板上的第一层间绝缘层，形成在第一层间绝缘层中的第一填充通孔，形成在第一层间绝缘层上的第二层间绝缘层，以及 第二填充通孔形成在第二层间绝缘层中。 第一填充通孔具有第一直径的底部。 第二填充通孔具有第二直径小于第一直径的底部。

公开(公告)号：US07996806B2

公开(公告)日：2011-08-09

申请号：US12027146

申请日：2008-02-06

Applicant: David Kwong

Inventor： David Kwong

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  G06F17/5077 ,  H05K1/116 ,  H05K3/0005 ,  H05K3/429 ,  H05K2201/094 ,  H05K2201/09454

Abstract: Methods and apparatus are provided for designing and laying out multi-layer circuit substrates, such as multi-layer PCBs. Dynamic vias are provided on intermediate PCB layers. Each dynamic via has features that adjust based on the trace layout of the corresponding intermediate layer. In particular, each dynamic via has a second radius R2 if the via is not connected to any trace on the corresponding intermediate layer. If a trace is connected to a dynamic via, the via radius changes from the second radius R2 to a first radius R1, where R1 is greater than R2.

Abstract translation: 提供了用于设计和布置多层电路基板（例如多层PCB）的方法和装置。 在中间PCB层上提供动态通孔。 每个动态通道具有根据相应中间层的跟踪布局进行调整的功能。 特别地，如果通孔不连接到相应中间层上的任何迹线，则每个动态通孔具有第二半径R2。 如果迹线连接到动态通孔，则通孔半径从第二个半径R2变为第一个半径R1，其中R1大于R2。

公开(公告)号：US07750250B1

公开(公告)日：2010-07-06

申请号：US11615467

申请日：2006-12-22

Applicant: Bob Shih-Wei Kuo

Inventor： Bob Shih-Wei Kuo

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/107 ,  H05K3/4038 ,  H05K3/429 ,  H05K2201/09263 ,  H05K2201/09454 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2072 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49176 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

Abstract translation: 捕获垫结构包括下介电层，嵌入在下介电层内的捕获垫，捕获垫包括多个线性段。 为了形成捕获垫，聚焦的激光束线性地移动以在介电层中形成线性通道。 这些通道填充有导电材料以形成捕获垫。