METHOD AND CIRCUIT FOR OPERATING A PIEZOELECTRIC MEMS SOUND TRANSDUCER AND INTEGRATED CIRCUIT COMPRSING SUCH A CIRCUIT

    公开(公告)号:US20210266675A1

    公开(公告)日:2021-08-26

    申请号:US16332558

    申请日:2017-09-13

    申请人: USound GMBH

    IPC分类号: H04R17/00 H01L41/04 H04R3/00

    摘要: A method is provided for operating a piezoelectric MEMS sound transducer in the audible wavelength spectrum and/or in the ultrasonic range. The method includes storing electrical energy in an energy store and indirectly transferring this electrical energy via a transfer unit between the energy store and the piezoelectric MEMS sound transducer. In a first switching state, the transfer unit is first of all charged from the energy store. In a second switching state, the transfer unit is discharged and the piezoelectric MEMS sound transducer is charged. In a third switching state, the piezoelectric MEMS sound transducer is discharged and the transfer unit is charged. In a fourth switching state, the transfer unit is then discharged and the energy store is charged.

    AMPLIFIER UNIT FOR A SOUND CONVERTER, AND SOUND-GENERATING UNIT

    公开(公告)号:US20210227324A1

    公开(公告)日:2021-07-22

    申请号:US16494105

    申请日:2018-03-16

    申请人: USound GmbH

    IPC分类号: H04R3/12 H04R1/10 B81B3/00

    摘要: The invention relates to an amplifier unit for a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, comprising at least one audio amplifier for sound reproduction and/or sound recording. According to the invention, the amplifier unit is designed in such a way that the MEMS sound transducer provided therefor is simultaneously operable as a loudspeaker and as a microphone. Moreover, the invention relates to sound-generating unit comprising a MEMS sound transducer, which is operable as a microphone and as a loudspeaker, and an amplifier unit coupled to the sound transducer for sound reproduction and/or sound recording.

    MEMS circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement

    公开(公告)号:US10433063B2

    公开(公告)日:2019-10-01

    申请号:US15758070

    申请日:2016-09-05

    申请人: USOUND GMBH

    摘要: The invention relates to a MEMS printed circuit board module (1) for a sound transducer assembly (2) for generating and/or detecting surge waves in the audible wavelength spectrum with a printed circuit board (4) and a multi-layer piezoelectric structure (5), by means of which a membrane (6) provided for this purpose can be set into oscillation and/or oscillations of a membrane (6) can be detected. In accordance with the invention, the multi-layer piezoelectric structure (5) is directly connected to the printed circuit board (4). In addition, the invention relates to a sound transducer assembly (2) with such a MEMS printed circuit board module (1) along with a method for the manufacturing of the MEMS printed circuit board module (1) and the sound transducer assembly (2).

    Flexible MEMS printed circuit board unit and sound transducer assembly

    公开(公告)号:US10425741B2

    公开(公告)日:2019-09-24

    申请号:US15761943

    申请日:2016-09-29

    申请人: USOUND GMBH

    摘要: A sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum includes a membrane, a cavity and a MEMS printed circuit board unit. A MEMS printed circuit board unit for a sound transducer assembly for generating and/or detecting sound waves in the audible wavelength spectrum includes a multi-layer piezoelectric structure embedded in a printed circuit board. The printed circuit board includes a membrane, which the multi-layer piezoelectric structure can oscillate or detect oscillations thereof.

    LOUDSPEAKER ARRANGEMENT
    68.
    发明申请

    公开(公告)号:US20180332403A1

    公开(公告)日:2018-11-15

    申请号:US16016870

    申请日:2018-06-25

    申请人: USOUND GMBH

    IPC分类号: H04R19/02 H04R3/12 H04R1/22

    摘要: A loudspeaker arrangement for a plurality of MEMS loudspeakers for generating sound waves in the audible wavelength spectrum includes a housing, which has a sound conduction cavity and at least one sound outlet opening, and at least two MEMS loudspeakers, arranged in the interior of the housing opposite and spaced apart from each other by the sound conduction cavity. Each MEMS loudspeaker has a cavity in the region of their opposite faces. The loudspeaker arrangement includes a shielding wall for acoustically decoupling the two MEMS loudspeakers from each other. The shielding wall is arranged in the interior of the housing between the two MEMS loudspeakers such that the sound conduction cavity is subdivided into a first and a second a cavity region respectively associated with one of the two MEMS loudspeakers.

    MEMS loudspeaker arrangement comprising a sound generator and a sound amplifier

    公开(公告)号:US10097928B2

    公开(公告)日:2018-10-09

    申请号:US15507303

    申请日:2015-09-01

    申请人: USOUND GMBH

    摘要: A MEMS loudspeaker arrangement for generating sound waves in the audible wavelength spectrum includes a housing that defines a sound-conducting channel and a sound outlet arranged at the end of the sound-conducting channel. At least two MEMS loudspeakers are arranged in the interior of the housing so that they generate sound waves through the sound-conducting channel to the sound outlet. One of the MEMS loudspeakers is disposed downstream of the other in the direction of the sound outlet. A control unit is connected to control the MEMS loudspeakers so as to increase the maximum loudness of the MEMS loudspeaker arrangement. The first of the two MEMS loudspeakers is controlled to function as a sound generator for generating an initial wave, and the second MEMS loudspeaker is controlled to function as a sound amplifier for amplifying the initial wave.

    Loud speaker arrangement with circuit-board-integrated ASIC

    公开(公告)号:US10097927B2

    公开(公告)日:2018-10-09

    申请号:US15306203

    申请日:2015-04-24

    申请人: USound GmbH

    IPC分类号: H04R19/02 H04R3/00

    摘要: A loudspeaker array includes a MEMS loudspeaker with a diaphragm deflectable along a Z axis; a printed circuit board having a first cavity housing an ASIC electrically connected to the MEMS loudspeaker; and a sound-conducting channel disposed adjacent to the MEMS loudspeaker and having an acoustic outlet opening. The printed circuit board includes a second cavity having an opening, which is closed by the MEMS loudspeaker, so that the second cavity forms at least a part of a cavity of the MEMS loudspeaker. The sound-conducting channel extends at an angle to the Z axis of the MEMS loudspeaker. The acoustic outlet opening is arranged on a side face of the loudspeaker array.