Manufacturing method for multiple MEMS sound transducers

    公开(公告)号:US11375317B2

    公开(公告)日:2022-06-28

    申请号:US16745959

    申请日:2020-01-17

    申请人: USOUND GMBH

    摘要: A manufacturing method for multiple MEMS sound transducers includes manufacturing a reconstructed wafer, separating multiple chips from the wafer, and encapsulating the chips in a molding material. A piezoelectric element of the particular chips is exposed to become deflectable along a stroke axis. The reconstructed wafer is connected to multiple diaphragms associated with the particular chips, wherein the diaphragms are each connected to the associated piezoelectric element so that the diaphragms are each deflectable together with the at least one associated piezoelectric element along the stroke axis. MEMS sound transducers, each of which including at least one of the chips and one of the diaphragms, are isolated. A MEMS sound transducer, which has been manufactured using the aforementioned manufacturing method, is also disclosed.

    Sound transducer arrangement having a MEMS unit

    公开(公告)号:US11128942B2

    公开(公告)日:2021-09-21

    申请号:US16625345

    申请日:2018-06-08

    申请人: USound GmbH

    IPC分类号: H04R1/04 H04R17/02 H04R31/00

    摘要: A sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum includes an acoustic unit, which includes a vibratable diaphragm and a MEMS unit coupled to the diaphragm for generating and/or detecting a deflection of the diaphragm. The sound transducer arrangement includes a MEMS structure, which includes a support unit on which the MEMS unit and the acoustic unit are arranged. The support unit includes a metallic lead frame and a plastic body, with which the lead frame is partially circumferentially fused.

    Sound Transducer Arrangement Having a MEMS Unit

    公开(公告)号:US20210067853A1

    公开(公告)日:2021-03-04

    申请号:US16625345

    申请日:2018-06-08

    申请人: USound GmbH

    IPC分类号: H04R1/04 H04R17/02 H04R31/00

    摘要: A sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum includes an acoustic unit, which includes a vibratable diaphragm and a MEMS unit coupled to the diaphragm for generating and/or detecting a deflection of the diaphragm. The sound transducer arrangement includes a MEMS structure, which includes a support unit on which the MEMS unit and the acoustic unit are arranged. The support unit includes a metallic lead frame and a plastic body, with which the lead frame is partially circumferentially fused.

    SOUND TRANSDUCER ARRANGEMENT
    5.
    发明申请

    公开(公告)号:US20200351595A1

    公开(公告)日:2020-11-05

    申请号:US16758631

    申请日:2018-10-12

    申请人: USOUND GMBH

    IPC分类号: H04R19/04 H04R19/02

    摘要: A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a carrier: a diaphragm connected to and deflectable with respect thereto the carrier and a piezoelectric element spaced apart from the diaphragm along a reciprocation axis. The piezoelectric element includes a coupling element that extends along the reciprocation axis and connects to the diaphragm. The piezoelectric element and the coupling element form a cantilever. The MEMS sound transducer includes two cantilever arms are arranged one behind the other, in a top view.

    AUDIO SYSTEM HAVING BEAM-SHAPING SPEAKERS AND EYEWEAR HAVING SUCH AN AUDIO SYSTEM

    公开(公告)号:US20200329305A1

    公开(公告)日:2020-10-15

    申请号:US16916899

    申请日:2020-06-30

    申请人: USOUND GMBH

    摘要: An audio system worn near the user's ear has a carrier element and a speaker. The carrier element is configured for affixing the audio system to the head of the user and defines a hollow space having a primary opening oriented in the direction of the opening of the user's ear when worn and emitting first sound waves from the speaker. The hollow space includes a secondary opening disposed in a first hollow space region of the carrier element and oriented away from the ear toward the surrounding area when the carrier element is worn so that the speaker emits secondary sound waves through the secondary opening, and the secondary sound waves are offset in phase from the first sound waves such that the volume of the sound waves emitted by the audio system into the surrounding area can be reduced.

    METHOD OF MANUFACTURING A MEMS PRINTED CIRCUIT BOARD MODULE AND/OR SOUND TRANSDUCER ASSEMBLY

    公开(公告)号:US20200045425A1

    公开(公告)日:2020-02-06

    申请号:US16587723

    申请日:2019-09-30

    申请人: USOUND GmbH

    摘要: A method of manufacturing a MEMS printed circuit board module and/or a sound transducer assembly includes the step of forming a multi-layer printed circuit board by connecting a metallic conductive layer to a plurality of printed circuit board support layers that are laminated together. The method includes the step of forming a multi-layer piezoelectric structure that includes an anchoring area. The method includes the step of turning the anchoring area of the multi-layer piezoelectric structure toward the multi-layer printed circuit board. The method includes the step of laminating the multi-layer printed circuit board directly and firmly to the anchoring area of the multi-layer piezoelectric structure.

    Method for Operating a Piezoelectric Speaker

    公开(公告)号:US20190268689A1

    公开(公告)日:2019-08-29

    申请号:US16286870

    申请日:2019-02-27

    申请人: USOUND GMBH

    摘要: A method for operating a piezoelectric speaker for generating sound waves in the audible wavelength spectrum and/or in the ultrasonic range includes at least partially charging a piezo actuator of the piezoelectric speaker with electrical energy of an energy unit and then at least partially discharging the piezo actuator. The method also includes determining at least one present electrical piezo actuator voltage of the piezo actuator. A future input voltage for the piezo actuator is compared with the present electrical piezo actuator voltage prior to charging and/or discharging, and a future differential voltage is derived therefrom. Furthermore, an embodiment of the method can include returning a part of the energy needed to charge the piezo actuator to the energy unit during discharging.

    MEMS acoustic transducer, and acoustic transducer assembly having a stopper mechanism

    公开(公告)号:US10034097B2

    公开(公告)日:2018-07-24

    申请号:US15311129

    申请日:2015-05-13

    申请人: USound GmbH

    摘要: A MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength spectrum includes a membrane carrier, a membrane that is connected in its edge area to the membrane carrier, and may vibrate along a z-axis with respect to the membrane carrier, and a stopper mechanism, which limits the vibrations of the membrane in at least one direction. The stopper mechanism includes at least one reinforcing element, which is arranged on one side of the membrane, and an end stop opposite to the reinforcing element. In a neutral position of the membrane, the end stop is spaced at a distance from the membrane and against which the reinforcing element abuts at a maximum deflection. A sound transducer arrangement includes such a MEMS sound transducer.

    Loud Speaker Arrangement with Circuit-Board-Integrated ASIC
    10.
    发明申请
    Loud Speaker Arrangement with Circuit-Board-Integrated ASIC 审中-公开
    扬声器布置与电路板集成ASIC

    公开(公告)号:US20170048624A1

    公开(公告)日:2017-02-16

    申请号:US15306203

    申请日:2015-04-24

    申请人: USOUND GMBH

    IPC分类号: H04R19/02 H04R3/00

    摘要: The present invention relates to a loudspeaker array (1) comprising a printed circuit board (2); a MEMS loudspeaker (3), which is intended for generating sound waves in the audible wavelength range and which has a diaphragm (9) deflectable along a Z axis; a sound-conducting channel (21), which is adjacent to the MEMS loudspeaker (3) and which has an acoustic outlet opening (22); and an ASIC (4), which is electrically connected to the MEMS loudspeaker (3). Furthermore, the printed circuit board (2) comprises a first circuit board cavity (11), in which the ASIC (4) is disposed so as to be fully integrated into the printed circuit board (2). Furthermore, the printed circuit board (2) comprises a second circuit board cavity (13) having an opening (14), which is closed by means of the MEMS loudspeaker (3), so that the second circuit board cavity (13) forms at least one part of a cavity (15) of the MEMS loudspeaker (3). According to the invention, the sound-conducting channel (21) extends at an angle to the Z axis of the MEMS loudspeaker. Furthermore, the acoustic outlet opening (22) is arranged on a side face of the loudspeaker array (1).

    摘要翻译: 本发明涉及包括印刷电路板(2)的扬声器阵列(1)。 MEMS扬声器(3),其用于在可听波长范围内产生声波,并具有沿Z轴可偏转的隔膜(9); 与MEMS扬声器(3)相邻并且具有声音出口(22)的导声通道(21); 以及电连接到MEMS扬声器(3)的ASIC(4)。 此外,印刷电路板(2)包括第一电路板空腔(11),其中ASIC(4)设置成完全集成到印刷电路板(2)中。 此外,印刷电路板(2)包括具有通过MEMS扬声器(3)封闭的开口(14)的第二电路板空腔(13),使得第二电路板空腔(13)形成在 MEMS扬声器(3)的腔(15)的至少一部分。 根据本发明,导声通道(21)以与MEMS扬声器的Z轴成一定角度延伸。 此外,声音出口开口(22)布置在扬声器阵列(1)的侧面上。