Manufacturing method for multiple MEMS sound transducers

    公开(公告)号:US11375317B2

    公开(公告)日:2022-06-28

    申请号:US16745959

    申请日:2020-01-17

    申请人: USOUND GMBH

    摘要: A manufacturing method for multiple MEMS sound transducers includes manufacturing a reconstructed wafer, separating multiple chips from the wafer, and encapsulating the chips in a molding material. A piezoelectric element of the particular chips is exposed to become deflectable along a stroke axis. The reconstructed wafer is connected to multiple diaphragms associated with the particular chips, wherein the diaphragms are each connected to the associated piezoelectric element so that the diaphragms are each deflectable together with the at least one associated piezoelectric element along the stroke axis. MEMS sound transducers, each of which including at least one of the chips and one of the diaphragms, are isolated. A MEMS sound transducer, which has been manufactured using the aforementioned manufacturing method, is also disclosed.

    Sound transducer arrangement having a MEMS unit

    公开(公告)号:US11128942B2

    公开(公告)日:2021-09-21

    申请号:US16625345

    申请日:2018-06-08

    申请人: USound GmbH

    IPC分类号: H04R1/04 H04R17/02 H04R31/00

    摘要: A sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum includes an acoustic unit, which includes a vibratable diaphragm and a MEMS unit coupled to the diaphragm for generating and/or detecting a deflection of the diaphragm. The sound transducer arrangement includes a MEMS structure, which includes a support unit on which the MEMS unit and the acoustic unit are arranged. The support unit includes a metallic lead frame and a plastic body, with which the lead frame is partially circumferentially fused.

    Sound Transducer Arrangement Having a MEMS Unit

    公开(公告)号:US20210067853A1

    公开(公告)日:2021-03-04

    申请号:US16625345

    申请日:2018-06-08

    申请人: USound GmbH

    IPC分类号: H04R1/04 H04R17/02 H04R31/00

    摘要: A sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum includes an acoustic unit, which includes a vibratable diaphragm and a MEMS unit coupled to the diaphragm for generating and/or detecting a deflection of the diaphragm. The sound transducer arrangement includes a MEMS structure, which includes a support unit on which the MEMS unit and the acoustic unit are arranged. The support unit includes a metallic lead frame and a plastic body, with which the lead frame is partially circumferentially fused.

    METHOD OF MANUFACTURING A MEMS PRINTED CIRCUIT BOARD MODULE AND/OR SOUND TRANSDUCER ASSEMBLY

    公开(公告)号:US20200045425A1

    公开(公告)日:2020-02-06

    申请号:US16587723

    申请日:2019-09-30

    申请人: USOUND GmbH

    摘要: A method of manufacturing a MEMS printed circuit board module and/or a sound transducer assembly includes the step of forming a multi-layer printed circuit board by connecting a metallic conductive layer to a plurality of printed circuit board support layers that are laminated together. The method includes the step of forming a multi-layer piezoelectric structure that includes an anchoring area. The method includes the step of turning the anchoring area of the multi-layer piezoelectric structure toward the multi-layer printed circuit board. The method includes the step of laminating the multi-layer printed circuit board directly and firmly to the anchoring area of the multi-layer piezoelectric structure.

    Method for Operating a Piezoelectric Speaker

    公开(公告)号:US20190268689A1

    公开(公告)日:2019-08-29

    申请号:US16286870

    申请日:2019-02-27

    申请人: USOUND GMBH

    摘要: A method for operating a piezoelectric speaker for generating sound waves in the audible wavelength spectrum and/or in the ultrasonic range includes at least partially charging a piezo actuator of the piezoelectric speaker with electrical energy of an energy unit and then at least partially discharging the piezo actuator. The method also includes determining at least one present electrical piezo actuator voltage of the piezo actuator. A future input voltage for the piezo actuator is compared with the present electrical piezo actuator voltage prior to charging and/or discharging, and a future differential voltage is derived therefrom. Furthermore, an embodiment of the method can include returning a part of the energy needed to charge the piezo actuator to the energy unit during discharging.

    EYEWEAR WITH PARAMETRIC AUDIO UNIT

    公开(公告)号:US20220179243A1

    公开(公告)日:2022-06-09

    申请号:US17540320

    申请日:2021-12-02

    申请人: USound GmbH

    摘要: Eyewear for outputting audio information to the wearer include an eyewear temple, which has at least one loudspeaker. The eyewear temple is configured for placement on an ear of the wearer and spaced apart from an ear opening of the wearer's ear so that the sound waves generated by the loudspeaker are transmitted over the surroundings to the spaced ear opening. The loudspeaker is an ultrasonic loudspeaker. The eyewear has a parametric audio unit that includes the ultrasonic loudspeaker and configured to generate an audible sound beam directed at the ear.

    TEST DEVICE FOR TESTING A MICROPHONE

    公开(公告)号:US20210377682A1

    公开(公告)日:2021-12-02

    申请号:US17326521

    申请日:2021-05-21

    申请人: USound GmbH

    IPC分类号: H04R29/00 H04R19/04

    摘要: A test device for testing a microphone has at least one test loudspeaker for generating at least one test tone into at least one test cavity. The test device has a compartment for accommodating the microphone to be tested in acoustic communication with the test cavity. The test device has at least one reference microphone for ascertaining a reference signal of the test tone emitted from the test loudspeaker. The test device has a reference cavity separated from the test cavity and acoustically coupled with the reference microphone and the test cavity. The test loudspeaker is arranged between the reference microphone and the test loudspeaker.