COHERENT RECEIVER ARRAY
    63.
    发明申请

    公开(公告)号:US20190310071A1

    公开(公告)日:2019-10-10

    申请号:US16441576

    申请日:2019-06-14

    Abstract: Optical coherent receiver arrays are described. The optical coherent receiver arrays include an integrated array of photodetectors separated by integrated mirrors which may cause interference of received free space optical and local oscillator signals. The mirrors may serve as splitters, helping to align the received signal and local oscillator to cause interference. The photodetectors of the optical coherent receiver array may be electrically coupled in various manners to read out the signals. The optical coherent receiver array may be implemented in an optical coherence tomography (OCT) imaging system in some embodiments.

    Silicon photonics multicarrier optical transceiver

    公开(公告)号:US10389448B1

    公开(公告)日:2019-08-20

    申请号:US15971889

    申请日:2018-05-04

    Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a silicon photonics multicarrier optical transceiver wherein both the transmitter and receiver are integrated on a single silicon chip and which generates a plurality of carriers through the effect of an on-chip modulator, amplifies the optical power of the carriers through the effect of an off-chip amplifier, and generates M orthogonal sets of carriers through the effect of an on-chip basis former.

    Substrate cavity
    68.
    发明授权

    公开(公告)号:US10209539B1

    公开(公告)日:2019-02-19

    申请号:US15858051

    申请日:2017-12-29

    Abstract: A method for making an apparatus, a system, and apparatus, the apparatus and system each comprising a substrate with a top side, wherein the substrate has a set of cavities in the top side of the substrate, wherein the substrate has a set of conductive elements on the top side of the substrate arranged to electrically couple with a set of conductive elements of a photonic integrated circuit (PIC), wherein each cavity of the set of cavities when coupled to the PIC creates a surface tension when exposed to an underfill to cause the underfill to flow around each cavity.

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