Flexible substrate and manufacturing method thereof, flexible display panel and flexible display device

    公开(公告)号:US10134764B2

    公开(公告)日:2018-11-20

    申请号:US15322405

    申请日:2016-03-16

    Abstract: The invention provide a flexible substrate and manufacturing method thereof, flexible display panel and flexible display device, wherein the flexible substrate comprises a first film layer and a second film layer, and further comprises a first flexible layer and a second flexible layer; the first film layer and the second film layer are located between the first flexible layer and the second flexible layer; the first film layer and the first flexible layer are bonded with each other, and the second film layer and the second flexible layer are bonded with each other; when the flexible substrate bends towards a first side, the first film layer and the second film layer can contact each other and form electric connection as the first flexible layer and the second flexible layer bend; and when the flexible substrate bends towards a second side or does not bend, the first film layer and the second film layer can be separated from each other and disconnect the electric connection as the first flexible layer and the second flexible layer bend or do not bend. The present invention solves the problem that bending a flexible display panel may damage the internal components thereof.

    Display back plate and manufacturing method therefor, and display device
    67.
    发明授权
    Display back plate and manufacturing method therefor, and display device 有权
    显示背板及其制造方法和显示装置

    公开(公告)号:US09478769B2

    公开(公告)日:2016-10-25

    申请号:US14421389

    申请日:2014-03-19

    CPC classification number: H01L51/5253 H01L27/3246 H01L51/5259 H01L51/56

    Abstract: Embodiments of the present invention disclose a display back plate. The display back plate comprises: an array substrate; and a pixel define layer formed on the array substrate and for defining an organic light emitting unit. An accommodation space is provided in the pixel define layer and a water absorbent material is provided within the accommodation space; the accommodation space has an opening formed in an upper surface and/or a lower surface of the pixel define layer; and the accommodation space is separated from the organic light emitting unit such that the water absorbent material within the accommodation space is spaced away from the organic light emitting unit. Embodiments of the present invention enable absorption of water vapor inside the organic light emitting display device, to prevent the adverse affection of water vapor on performance of the organic light emitting display device, so as to prolong service life of the organic light emitting display device.

    Abstract translation: 本发明的实施例公开了一种显示器背板。 显示背板包括:阵列基板; 以及形成在阵列基板上并用于限定有机发光单元的像素限定层。 在像素限定层中设置容纳空间,并且在容纳空间内设置吸水材料; 容纳空间具有形成在像素限定层的上表面和/或下表面中的开口; 并且容纳空间与有机发光单元分离,使得容纳空间内的吸水材料与有机发光单元间隔开。 本发明的实施方式能够吸收有机发光显示装置内的水蒸气,以防止水蒸汽对有机发光显示装置的性能的不良影响,从而延长有机发光显示装置的使用寿命。

    Packaging structure for OLED having inorganic and organic films with moisture absorbent layers
    68.
    发明授权
    Packaging structure for OLED having inorganic and organic films with moisture absorbent layers 有权
    具有无机和有机膜的具有吸湿层的OLED的包装结构

    公开(公告)号:US09472784B2

    公开(公告)日:2016-10-18

    申请号:US14415481

    申请日:2014-05-23

    Inventor: Li Sun

    Abstract: The present invention provides a film packaging structure for an OLED, an OLED device, and a display apparatus. The film packaging structure for an OLED is an OLED film packaging structure, which includes a flexible film for packaging an OLED unit. The flexible film includes at least one layer of inorganic film, and at least one layer of organic film which is alternately stacked with the at least one layer of inorganic film. Each layer of organic film in the at least one layer of organic film is an integral film, and each layer of inorganic film in the at least one layer of inorganic film includes a plurality of non-connected inorganic film segments. The display apparatus includes the OLED device. The OLED film packaging structure, the OLED device and the display apparatus utilize inorganic films and organic films which are alternately stacked with the inorganic films.

    Abstract translation: 本发明提供了一种用于OLED,OLED器件和显示装置的膜封装结构。 用于OLED的膜包装结构是OLED膜封装结构,其包括用于封装OLED单元的柔性膜。 柔性膜包括至少一层无机膜和至少一层与至少一层无机膜交替层叠的有机膜。 所述至少一层有机膜中的每层有机膜为整体膜,所述至少一层无机膜中的每层无机膜包括多个未连接的无机膜段。 显示装置包括OLED装置。 OLED膜封装结构,OLED器件和显示装置利用与无机膜交替堆叠的无机膜和有机膜。

    ORGANIC LIGHT-EMITTING DIODE (OLED) SUBSTRATE AND DISPLAY DEVICE
    69.
    发明申请
    ORGANIC LIGHT-EMITTING DIODE (OLED) SUBSTRATE AND DISPLAY DEVICE 有权
    有机发光二极管(OLED)基板和显示器件

    公开(公告)号:US20150028310A1

    公开(公告)日:2015-01-29

    申请号:US14347390

    申请日:2013-08-06

    Inventor: Qing Dai Li Sun Ze Liu

    Abstract: An organic light-emitting diode (OLED) substrate, which includes a plurality of light-emitting sub-pixels and a pixel partition wall, wherein at least one layer among hole injection layers (HIL), hole transport layers (HTL) and organic light-emitting layers of at least two light-emitting sub-pixels has a different thickness; and upper surfaces of the HIL, the HTL and the organic light-emitting layer of any light-emitting sub-pixel are each parallel and level to an upper surface of one respective lyophilic film layer of the pixel partition wall. The OLED substrate can be used for improving the surface smoothness of each organic layer of the light-emitting sub-pixel. The embodiment of the present invention further provides a display device.

    Abstract translation: 一种有机发光二极管(OLED)基板,包括多个发光子像素和像素分隔壁,其中空穴注入层(HIL),空穴传输层(HTL)和有机光 至少两个发光子像素的发光层具有不同的厚度; HIL,HTL和任何发光子像素的有机发光层的上表面各自平行并且平行于像素分隔壁的一个相应的亲液膜层的上表面。 OLED基板可以用于提高发光子像素的每个有机层的表面平滑度。 本发明的实施例还提供一种显示装置。

    Encapsulating cover plate, fabrication method thereof, display panel and fabrication method thereof

    公开(公告)号:US12225752B2

    公开(公告)日:2025-02-11

    申请号:US17293636

    申请日:2020-05-27

    Inventor: Juanjuan You Li Sun

    Abstract: An encapsulating cover plate, a method for fabricating the same, a display panel and a method for fabricating the same are provided. The encapsulating cover plate includes a first base substrate; a first auxiliary electrode on the first base substrate; and a second auxiliary electrode on a side of the first auxiliary electrode away from the first base substrate, an orthographic projection of the second auxiliary electrode on the first base substrate being within an orthographic projection of the first auxiliary electrode on the first base substrate. A material of the first auxiliary electrode includes an organic conductive polymer, and a material of the second auxiliary electrode includes a conductive metal.

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