Portable electronic device incorporating centrifugal blower
    61.
    发明授权
    Portable electronic device incorporating centrifugal blower 失效
    带离心风机的便携式电子设备

    公开(公告)号:US07864525B2

    公开(公告)日:2011-01-04

    申请号:US12396479

    申请日:2009-03-03

    IPC分类号: H05K7/20

    CPC分类号: G06F1/203

    摘要: An electronic device includes a casing and a centrifugal blower. The casing includes a bottom cover and a top cover. A sidewall extends from the bottom cover towards the top cover. The centrifugal blower is surrounded by the sidewall and includes a supporting member mounted to the bottom cover, and an impeller rotatablely supported by the supporting member. The impeller includes a hub and a plurality of blades extending outwardly from the hub. Outer portions of the blades extend beyond the supporting member along a radial direction of the hub. Inner portions of the blades have a height gradually increasing along an outward direction. The outer portions have a height equal to a maximum height of the inner portions. Bottom faces of the outer portions of the blades are located below a top surface of a base plate of the supporting member.

    摘要翻译: 电子设备包括壳体和离心式鼓风机。 壳体包括底盖和顶盖。 侧壁从底盖向顶盖延伸。 离心鼓风机由侧壁包围,并且包括安装到底盖的支撑构件和由支撑构件可旋转地支撑的叶轮。 叶轮包括轮毂和从轮毂向外延伸的多个叶片。 叶片的外部部分沿轮毂的径向方向延伸超出支撑构件。 叶片的内部部分沿着向外的方向具有逐渐增加的高度。 外部部分的高度等于内部的最大高度。 叶片的外部的底面位于支撑构件的基板的顶面的下方。

    Heat spreader with vapor chamber defined therein and method of manufacturing the same
    62.
    发明授权
    Heat spreader with vapor chamber defined therein and method of manufacturing the same 有权
    其中限定有蒸气室的散热器及其制造方法

    公开(公告)号:US07651601B2

    公开(公告)日:2010-01-26

    申请号:US11306699

    申请日:2006-01-09

    IPC分类号: C25D7/00

    CPC分类号: C25D5/022 C25D1/08 C25D5/028

    摘要: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.

    摘要翻译: 公开了散热器(10)和散热器的制造方法。 散热器包括金属外壳(12)和芯体结构(16)在金属外壳的内表面上排列。 金属壳体在其中限定有腔室(14),并且包括蒸发部分(126)和冷凝部分(127)。 芯结构是金属泡沫的形式,占据了腔室的一部分。 在一个实施例中,芯结构具有从蒸发部朝向金属外壳的冷凝部分逐渐增加的孔径。 散热器通过在金属泡沫框架(20)的外表面上电沉积金属涂层(70)来制造。 金属涂层成为金属外壳,金属泡沫框架成为芯体结构。

    Heat dissipation device
    63.
    发明授权
    Heat dissipation device 失效
    散热装置

    公开(公告)号:US07606036B2

    公开(公告)日:2009-10-20

    申请号:US11308916

    申请日:2006-05-25

    IPC分类号: H05K7/20 H01L23/34 F28D15/00

    摘要: A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.

    摘要翻译: 散热装置包括热连接块(10),热连接到块体上的热管(30)和热连接到热管的翅片单元(90)。 该块包括弯曲形状的底表面(124),允许其热附接到发热部件(80)以吸收热量,以及与底表面相对的顶表面(122)。 热管包括在一端的蒸发部分(32)和另一端的冷凝部分(34)。 蒸发段可以热连接到块的顶表面。 冷凝部分可以热连接到翅片单元。

    Heat sink
    64.
    发明授权
    Heat sink 有权
    散热器

    公开(公告)号:US07304847B2

    公开(公告)日:2007-12-04

    申请号:US11308728

    申请日:2006-04-26

    IPC分类号: H05K7/20

    摘要: A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.

    摘要翻译: 散热器包括彼此平行的多个翅片,以及延伸穿过这些翅片的一个热管。 在每对相邻翅片之间形成流路,用于引导由电风扇产生的气流。 具有弯曲形状的引导构件布置在通孔周围,用于引导流到热管的气流。 由引导构件形成并围绕的空间是沿气流方向逐渐变窄的锥形空间,以引导流向热管的气流。

    HEAT SINK
    65.
    发明申请
    HEAT SINK 审中-公开
    散热器

    公开(公告)号:US20070089869A1

    公开(公告)日:2007-04-26

    申请号:US11309067

    申请日:2006-06-15

    IPC分类号: F28D1/02

    摘要: A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.

    摘要翻译: 散热片(10)包括多个翅片(12)。 每个翅片包括设置在主体上的主体(122)和至少一个凸起(126)。 两个相邻翅片的主体协同地在其间限定一个空气通道(121),以允许气流通过。 凸起具有不同的突起高度,以便在其上形成流线引导表面(127)。

    THERMAL MODULE
    66.
    发明申请
    THERMAL MODULE 有权
    热模块

    公开(公告)号:US20070029071A1

    公开(公告)日:2007-02-08

    申请号:US11307619

    申请日:2006-02-15

    IPC分类号: H05K7/20

    摘要: A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.

    摘要翻译: 用于从发热电子部件(20)散热的热模块(10)包括基板(11),安装在基板的一侧的散热风扇(16),至少一个热管 12),其安装到与所述基板的一侧相对的另一侧,以及安装到所述散热风扇的空气出口的翅片组件(14)。 热管包括弯曲部分(124)。 翅片组件包括对应于热管的弯曲部分的部分(142)。 翅片组件的部分的翅片沿着热管的弯曲部分的延伸方向布置。

    HEAT SPREADER WITH VAPOR CHAMBER DEFINED THEREIN AND METHOD OF MANUFACTURING THE SAME
    67.
    发明申请
    HEAT SPREADER WITH VAPOR CHAMBER DEFINED THEREIN AND METHOD OF MANUFACTURING THE SAME 有权
    带有蒸汽室的热交换器及其制造方法

    公开(公告)号:US20070017814A1

    公开(公告)日:2007-01-25

    申请号:US11306699

    申请日:2006-01-09

    IPC分类号: C25D5/02

    CPC分类号: C25D5/022 C25D1/08 C25D5/028

    摘要: A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.

    摘要翻译: 公开了散热器(10)和散热器的制造方法。 散热器包括金属外壳(12)和芯体结构(16)在金属外壳的内表面上排列。 金属壳体在其中限定有腔室(14),并且包括蒸发部分(126)和冷凝部分(127)。 芯结构是金属泡沫的形式,占据了腔室的一部分。 在一个实施例中,芯结构具有从蒸发部朝向金属外壳的冷凝部分逐渐增加的孔径。 散热器通过在金属泡沫框架(20)的外表面上电沉积金属涂层(70)来制造。 金属涂层成为金属外壳,金属泡沫框架成为芯体结构。

    Pulsating heat transfer apparatus
    68.
    发明申请
    Pulsating heat transfer apparatus 审中-公开
    脉动传热装置

    公开(公告)号:US20060144567A1

    公开(公告)日:2006-07-06

    申请号:US11209929

    申请日:2005-08-23

    IPC分类号: H05K7/20

    摘要: A pulsating heat transfer apparatus includes a number of separate heat receiving portions (100, 200, 300), at least one heat dissipating portion (400), and a plurality of capillary pipes (500). Each heat receiving portion has a flat surface for contacting with a heat source, and defines therein at least one first capillary passage. Each heat dissipating portion defines therein at least one second capillary passage. The first capillary passages, the at least one second capillary passage, together with the capillary pipes form a close-looped, serpentine flow channel having capillary effect. Vapor slugs (600) and liquid slugs (700) are distributed in the flow channel. Heat is capable of being transferred from the heat receiving portions to the at least one heat dissipating portion by pulsation of the vapor slugs and liquid slugs.

    摘要翻译: 脉动传热装置包括多个单独的热接收部分(100,200,300),至少一个散热部分(400)和多个毛细管(500)。 每个热接收部分具有用于与热源接触的平坦表面,并且在其中限定至少一个第一毛细管通道。 每个散热部分在其中限定至少一个第二毛细管通道。 第一毛细管通道,至少一个第二毛细管通道与毛细管一起形成具有毛细管效应的闭环的蛇形流动通道。 蒸汽段(600)和液体块(700)分布在流动通道中。 热能够通过脉动的蒸汽块和液体块从热接收部分传递到至少一个散热部分。

    Clip for mounting heat sink to circuit board
    69.
    发明申请
    Clip for mounting heat sink to circuit board 失效
    用于将散热片安装到电路板的夹子

    公开(公告)号:US20050068742A1

    公开(公告)日:2005-03-31

    申请号:US10900767

    申请日:2004-07-27

    IPC分类号: H01L23/40 H01L23/467 H05K7/20

    摘要: A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the second end portion for attaching to a circuit board (50). The first locking part includes a pin (21), a pair of C-shaped spring portions (22), and a compressible mounting portion (23). The spring portions and the mounting portion are for cooperatively sandwiching the heat sink therebetween. The second locking part includes a taper head (30) and a neck (31). The second locking part engages with the circuit board in the neck. The first locking part offsets from the second locking part in a vertical direction. The heat sink of which the mounting holes offset from the mounting holes of the circuit board is therefore fitable to the circuit board.

    摘要翻译: 夹具(10)包括主体(12),其包括间隔开的第一和第二端部,从第一端部延伸以附接到散热器(80)的第一锁定部分(20)和第二锁定部分(30) 从所述第二端部延伸以附接到电路板(50)。 第一锁定部分包括销(21),一对C形弹簧部分(22)和可压缩安装部分(23)。 弹簧部分和安装部分用于协同地将散热片夹在其间。 第二锁定部分包括锥形头部(30)和颈部(31)。 第二锁定部分与颈部中的电路板接合。 第一锁定部件在垂直方向上与第二锁定部件偏移。 因此,安装孔偏离电路板的安装孔的散热器适合于电路板。

    Electronic device having heat dissipation device
    70.
    发明授权
    Electronic device having heat dissipation device 失效
    具有散热装置的电子装置

    公开(公告)号:US08686296B2

    公开(公告)日:2014-04-01

    申请号:US13340614

    申请日:2011-12-29

    IPC分类号: H05K1/00 F28F9/00

    摘要: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.

    摘要翻译: 示例性的散热装置包括支架,散热器和按压构件。 支架包括底板。 底板上有一个开口。 两个支撑部分由底板的下侧形成。 散热片延伸穿过支架的开口,散热片的底边搁置在支撑部分上。 按压构件安装在支架上并将散热器弹性地按压到支撑部分上。