摘要:
An electronic device includes a casing and a centrifugal blower. The casing includes a bottom cover and a top cover. A sidewall extends from the bottom cover towards the top cover. The centrifugal blower is surrounded by the sidewall and includes a supporting member mounted to the bottom cover, and an impeller rotatablely supported by the supporting member. The impeller includes a hub and a plurality of blades extending outwardly from the hub. Outer portions of the blades extend beyond the supporting member along a radial direction of the hub. Inner portions of the blades have a height gradually increasing along an outward direction. The outer portions have a height equal to a maximum height of the inner portions. Bottom faces of the outer portions of the blades are located below a top surface of a base plate of the supporting member.
摘要:
A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.
摘要:
A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.
摘要:
A heat sink includes a plurality of fins parallel to each other, and one heat pipe extending through these fins. A flow channel is formed between each pair of neighboring fins for channeling an airflow generated by an electric fan. A guiding member having a curved shape is arranged around the through hole for guiding the airflow flowing to the heat pipe. A space formed and surrounded by the guiding member is a tapered space, which narrows gradually along the direction of the airflow so as to guide the airflow flowing to the heat pipe.
摘要:
A heat sink (10) includes a plurality of fins (12). Each of the fins includes a main body (122) and at least one bulge (126) disposed on the main body. The main bodies of two adjacent fins cooperatively define an air passage (121) therebetween, for allowing an airflow to pass therethough. The bulge has a varying projection height so as to form a streamline guide surface (127) thereon.
摘要:
A thermal module (10) for dissipating heat from a heat-generating electronic component (20) includes a base plate (11), a heat-dissipating fan (16) mounted to one side of the base plate, at least a heat pipe (12) mounted to another side opposite to the one side of the base plate, and a fin assembly (14) mounted to an air outlet of the heat-dissipating fan. The heat pipe includes a bending portion (124). The fin assembly includes a portion (142) corresponding to the bending portion of the heat pipe. The fins of the portion of the fin assembly are arranged along an extension direction of the bending portion of the heat pipe.
摘要:
A heat spreader (10) and a method for manufacturing the heat spreader are disclosed. The heat spreader includes a metal casing (12) and a wick structure (16) lines an inner surface of the metal casing. The metal casing defines therein a chamber (14) and includes an evaporating section (126) and a condensing section (127). The wick structure is in the form of metal foam and occupies a portion of the chamber. In one embodiment, the wick structure has a pore size gradually increasing from the evaporating section towards the condensing section of the metal casing. The heat spreader is manufactured by electrodepositing a layer of metal coating (70) on an outer surface of a metal foam framework (20). The metal coating becomes the metal casing and the metal foam framework becomes the wick structure.
摘要:
A pulsating heat transfer apparatus includes a number of separate heat receiving portions (100, 200, 300), at least one heat dissipating portion (400), and a plurality of capillary pipes (500). Each heat receiving portion has a flat surface for contacting with a heat source, and defines therein at least one first capillary passage. Each heat dissipating portion defines therein at least one second capillary passage. The first capillary passages, the at least one second capillary passage, together with the capillary pipes form a close-looped, serpentine flow channel having capillary effect. Vapor slugs (600) and liquid slugs (700) are distributed in the flow channel. Heat is capable of being transferred from the heat receiving portions to the at least one heat dissipating portion by pulsation of the vapor slugs and liquid slugs.
摘要:
A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the second end portion for attaching to a circuit board (50). The first locking part includes a pin (21), a pair of C-shaped spring portions (22), and a compressible mounting portion (23). The spring portions and the mounting portion are for cooperatively sandwiching the heat sink therebetween. The second locking part includes a taper head (30) and a neck (31). The second locking part engages with the circuit board in the neck. The first locking part offsets from the second locking part in a vertical direction. The heat sink of which the mounting holes offset from the mounting holes of the circuit board is therefore fitable to the circuit board.
摘要:
An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.