公开(公告)号：US11292257B2

公开(公告)日：2022-04-05

申请号：US16704122

申请日：2019-12-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/045

Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

公开(公告)号：US11097537B2

公开(公告)日：2021-08-24

申请号：US16485214

申请日：2017-04-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Anthony M Fuller

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.

公开(公告)号：US20210252858A1

公开(公告)日：2021-08-19

申请号：US16958607

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen ,  Randy Hoffman

IPC: B41J2/14 ,  B41J2/16

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

公开(公告)号：US11059291B2

公开(公告)日：2021-07-13

申请号：US16629366

申请日：2017-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam Choy ,  Michael W Cumbie ,  Chien-Hua Chen ,  Jeffrey R Pollard

IPC: B41J2/14 ,  B41J2/21 ,  B41J2/175 ,  B41J2/16

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an army of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an army of enclosed cross-channels. Each enclosed cross-channel of the army of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

公开(公告)号：US11020967B2

公开(公告)日：2021-06-01

申请号：US16595015

申请日：2019-10-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/14 ,  B41J2/155 ,  B41J2/16

Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.

公开(公告)号：US10946648B2

公开(公告)日：2021-03-16

申请号：US16495456

申请日：2017-05-08

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Si-lam J Choy

IPC: B41J2/14 ,  B41J2/18 ,  B41J2/045 ,  B41J2/175

Abstract: A fluid ejection device includes a fluid ejection die to eject drops of fluid and a body to support the fluid ejection die, with the fluid ejection die including a fluid ejection chamber, a drop ejecting element within the fluid ejection chamber, and a fluid feed hole communicated with the fluid ejection chamber, and with the body including a fluid feed slot communicated with the fluid feed hole of the fluid ejection die. The fluid ejection device includes a micro-recirculation system to recirculate fluid within the fluid ejection die through the fluid ejection chamber, and a macro-recirculation system to recirculate fluid within the body through the fluid feed slot across the fluid feed hole of the fluid ejection die.

公开(公告)号：US20200238695A1

公开(公告)日：2020-07-30

申请号：US16483101

申请日：2017-04-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  James R Przybyla

IPC: B41J2/14 ,  B41J2/175

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.

公开(公告)号：US10723128B2

公开(公告)日：2020-07-28

申请号：US16318517

申请日：2016-11-01

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

Abstract: Examples include a fluid ejection die. Examples comprise an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. A fluid input hole is fluidly connected to the ejection chamber. A fluid output channel is also fluidly connected to the ejection chamber, and a fluid output hole is fluidly connected to the fluid output channel. Examples further comprise a fluid pump disposed in the fluid output channel to pump fluid from the ejection chamber out of the fluid output hole.

公开(公告)号：US20200223226A1

公开(公告)日：2020-07-16

申请号：US16629142

申请日：2017-07-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W Cumbie ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.

公开(公告)号：US20200031126A1

公开(公告)日：2020-01-30

申请号：US16595015

申请日：2019-10-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/155

Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.