Articles having an uneven surface and production process therefor
    61.
    发明授权
    Articles having an uneven surface and production process therefor 有权
    具有不均匀表面的制品及其制造方法

    公开(公告)号:US06555236B1

    公开(公告)日:2003-04-29

    申请号:US09786484

    申请日:2001-03-06

    IPC分类号: B32B904

    摘要: A process for producing an article having a fine uneven surface, coated with a film which has high heat resistance, does not crack and does not peel off from a substrate. The process for producing the article comprises disposing a film-forming solution between a substrate and a mold in the form of a film so as to make the solution closely contact with the substrate and the mold, said solution being prepared by carrying out the hydrolysis and dehydration polycondensation reaction of a stock solution containing a specific silane compound (A) having an unhydrolyzable organic group and a hydrolyzable group, a specific silane compound (B) having a hydrolyzable group and a catalyst, and heating to form an article having an uneven film having a surface shape which is the inversion of the surface shape of the mold on the surface of the substrate. The film-forming solution contains the above silane compounds (A) and (B) in the form of unhydrolysates in amounts of 0.5 to 40 wt % and 0.5 to 60 wt % based on the amount of the above silane compound (A) and the amount of the above silane compound (B) contained in the stock solution, respectively. A condensate formed by the dehydration condensation reaction of the film-forming solution has a molecular weight of 300 to 1,900.

    摘要翻译: 制造具有微细凹凸表面的制品的方法,其涂覆有耐热性高的膜,不会破裂并且不会从基材上剥离。 制造该制品的方法包括以薄膜形式在基材和模具之间设置成膜溶液,以使溶液与基材和模具紧密接触,所述溶液通过进行水解和 含有具有不可水解的有机基团的特定硅烷化合物(A)和可水解基团的储备溶液的脱水缩聚反应,具有可水解基团的特定硅烷化合物(B)和催化剂,并加热形成具有不均匀膜的物品 具有表面形状,该表面形状是基板表面上模具的表面形状的倒转。 成膜溶液含有上述硅烷化合物(A)的量为0.5〜40重量%,0.5〜60重量%的非水解产物的上述硅烷化合物(A)和(B) 上述硅烷化合物(B)的含量分别为原料溶液。 由成膜溶液的脱水缩合反应形成的冷凝物的分子量为300〜1,900。

    Optical device and adhesive composition used therefor
    63.
    发明授权
    Optical device and adhesive composition used therefor 失效
    用于其的光学装置和粘合剂组合物

    公开(公告)号:US06415093B1

    公开(公告)日:2002-07-02

    申请号:US09670693

    申请日:2000-09-28

    IPC分类号: G02B600

    摘要: An optical device having at least two optically transparent optical parts which are bonded together with an optically transparent adhesive layer. The adhesive layer is formed from a matrix containing silicon, titanium, zirconium, aluminum or germianium, and oxygen atoms. At least part of the atoms is bonded to other atom(s) through a polyvalent hydrocarbon group and directly bonded a monovalent hydrocarbon group. The refractive index value of the adhesive layer approximates to the refractive index values of the at least two optically transparent optical parts. An adhesive composition for bonding optical parts and a method of bonding optical parts are also proposed.

    摘要翻译: 一种光学装置,其具有至少两个光学透明的光学部件,其与光学透明的粘合剂层结合在一起。 粘合剂层由含有硅,钛,锆,铝或锗的基体和氧原子形成。 至少部分原子通过多价烃基与其它原子键合并直接键合一价烃基。 粘合剂层的折射率值近似于至少两个光学透明光学部件的折射率值。 还提出了用于粘合光学部件的粘合剂组合物和粘合光学部件的方法。

    Card processing apparatus
    64.
    发明授权
    Card processing apparatus 失效
    卡处理装置

    公开(公告)号:US5773805A

    公开(公告)日:1998-06-30

    申请号:US748899

    申请日:1996-11-14

    IPC分类号: G06K13/08 G06K7/06

    CPC分类号: G06K13/08

    摘要: An IC card issuing apparatus has a feeding mechanism which feed an IC card supplied form a card supply device along a feeding path. A head body of a head unit has an abutting portion and contact pins. When an IC card is fed along the feeding path, the leading end of the IC card abuts against the abutting portion of the head body and pushes it. By being pushed by the IC card, the head body moves from a standby position to a discharge position through a connect position. In the standby position and discharge position, the contact pins are spaced apart from connect terminals of the IC card, and in the connect position, the contact pins bring into contact with the connect terminals of the IC card.

    摘要翻译: IC卡发行装置具有馈送机构,其沿着馈送路径馈送从卡供给装置提供的IC卡。 头单元的头本体具有邻接部分和接触销。 当IC卡沿着馈送路径馈送时,IC卡的前端与头体的抵接部分抵接并推动IC卡。 通过被IC卡推动,头体从待机位置通过连接位置移动到排出位置。 在待机位置和放电位置,接触针与IC卡的连接端子间隔开,并且在连接位置,触针与IC卡的连接端子接触。