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    METHOD FOR MAKING HARMFUL COMPOUND HARMLESS AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT COMPOUND
    2.
    发明申请
    METHOD FOR MAKING HARMFUL COMPOUND HARMLESS AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT COMPOUND 有权
    制造有机化合物的方法和用于生产有机半导体元素化合物的方法

    公开(公告)号：US20110178319A1

    公开(公告)日：2011-07-21

    申请号：US13120377

    申请日：2009-11-02

    申请人： Koichiro Nakamura

    发明人： Koichiro Nakamura

    IPC分类号： C07F9/72

    CPC分类号： B01J31/184 ,  A62D3/176 ,  A62D3/30 ,  A62D2101/24 ,  A62D2101/43 ,  B01D2257/60 ,  B01J21/063 ,  B01J35/004 ,  B01J2231/40 ,  B01J2531/025 ,  B01J2531/845 ,  C07F9/72

    摘要： The present invention provides a method for making a harmful arsenic compound, antimony compound and selenium compound harmless by using an organic cobalt complex, in which the cost of the method can be improved. The present invention is a method for making a harmful compound harmless, including irradiating light to an organic cobalt complex containing cobalt as a central metal and a corrin ring as a ligand, a methyl group donor, a titanium oxide photocatalyst, and a harmful compound containing an arsenic atom, an antimony atom or a selenium atom to methylate the harmful compound. In the present invention, it is preferable that the harmful compound be trimethylated.

    摘要翻译： 本发明提供了通过使用有机钴络合物制造有害的砷化合物，锑化合物和硒化合物无害的方法，其中可以提高该方法的成本。 本发明是一种使有害化合物无害化的方法，包括向含有钴作为中心金属和作为配体的corrin环的有机钴络合物照射光，甲基供体，氧化钛光催化剂和含有 砷原子，锑原子或硒原子甲基化有害化合物。 在本发明中，优选将有害化合物进行三甲基化。

    SPECTROSCOPE
    3.
    发明申请
    SPECTROSCOPE 有权

    公开(公告)号：US20110058166A1

    公开(公告)日：2011-03-10

    申请号：US12667753

    申请日：2008-07-30

    申请人： Koichiro Nakamura ,  Yuzo Sasaki ,  Kazuo Fujiura ,  Shogo Yagi

    发明人： Koichiro Nakamura ,  Yuzo Sasaki ,  Kazuo Fujiura ,  Shogo Yagi

    IPC分类号： G01J3/447 ,  G01J3/28

    CPC分类号： G01J3/14 ,  G01J3/02 ,  G01J3/0205 ,  G01J3/0237 ,  G01J3/06 ,  G01J3/18 ,  G01J3/36 ,  G01J2003/064

    摘要： The present invention provides a small spectroscope that has a short response time. A spectroscope according to one embodiment of the present invention includes: a beam deflector that includes an electro-optic crystal, having an electro-optic effect, and paired electrodes used to apply an electric field inside the electro-optic crystal; spectroscopic means for dispersing light output by the beam deflector; and wavelength selection means for selecting light having an arbitrary wavelength from the light dispersed and output by the spectroscopic means.

    摘要翻译： 本发明提供一种响应时间短的小型分光镜。 根据本发明的一个实施例的分光镜包括：光束偏转器，其包括具有电光效应的电光晶体，以及用于在电光晶体内施加电场的成对电极; 分光装置，用于分散由光束偏转器输出的光; 以及波长选择装置，用于从由分光装置分散和输出的光中选择具有任意波长的光。

    Echelon diffraction grating and optical waveguide element
    7.
    发明授权
    Echelon diffraction grating and optical waveguide element 失效
    梯形衍射光栅和光波导元件

    公开(公告)号：US06721485B1

    公开(公告)日：2004-04-13

    申请号：US09806416

    申请日：2001-03-30

    申请人： Koichiro Nakamura ,  Masahiro Hori ,  Hiroaki Yamamoto

    发明人： Koichiro Nakamura ,  Masahiro Hori ,  Hiroaki Yamamoto

    IPC分类号： G02B600

    CPC分类号： G02B6/138 ,  G02B1/04 ,  G02B5/1814 ,  G02B5/1852 ,  C08L83/04

    摘要： An echelon diffraction grating which has excellent heat resistance and can be produced at a low cost and an optical waveguide which has high heat resistance, small absorption of a communication wavelength of a near infrared range, and satisfies reliability and a low loss at an optical communication range. The echelon diffraction grating comprises a substrate, and an organopolysiloxane film having a maximum thickness of 1 &mgr;m to 1 mm formed on the surface of the substrate and has a plurality of steps having a predetermined width of 1 to 500 &mgr;m and a predetermined height of 5 to 500 &mgr;m formed on the organopolysiloxane film, and the organopolysiloxane film contains dimethylsiloxane and phenyl(or substituted phenyl)siloxane as essential ingredients.

    摘要翻译： 具有优异的耐热性并且可以低成本地生产的梯形衍射光栅和具有高耐热性，较小吸收近红外范围的通信波长的光波导，并且在光通信中满足可靠性和低损耗的光波导 梯形衍射光栅包括基板和形成在基板表面上的最大厚度为1μm至1mm的有机聚硅氧烷膜，并且具有预定宽度为1至500μm的多个台阶和预定高度 在有机聚硅氧烷膜上形成5〜500μm，有机聚硅氧烷膜含有二甲基硅氧烷和苯基（或取代的苯基）硅氧烷作为必要成分。

    Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts
    8.
    发明授权
    Card-typed electronic apparatus having a flat card case housing a plurality of electronic parts 失效
    具有容纳多个电子部件的平板卡盒的卡式电子设备

    公开(公告)号：US06381143B1

    公开(公告)日：2002-04-30

    申请号：US09664401

    申请日：2000-09-18

    申请人： Koichiro Nakamura

    发明人： Koichiro Nakamura

    IPC分类号： H05K114

    CPC分类号： H05K5/026 ,  B29C65/08 ,  B29C66/131 ,  B29C66/30221 ,  B29C66/30223 ,  B29C66/54 ,  B29C66/71 ,  B29C66/73921 ,  B29C66/8322 ,  B29L2017/006 ,  H05K1/189 ,  Y10S439/945 ,  Y10S439/946 ,  B29K2055/02 ,  B29K2069/00

    摘要： A card-type electronic apparatus is provided with a flat card case and a circuit module housed in the card case. The circuit module is provided with a circuit substrate having a first surface and a second surface positioned on the side opposite to the first surface, at least one first electronic part mounted on the first surface of the circuit substrate and at least one second electronic part mounted on the second surface of the circuit substrate. Here, the first electronic part having the greatest height dimension on the first surface and the second electronic part having the greatest height dimension on the second surface are placed in an offset manner from each other without facing each other with the circuit substrate interpolated in between. Moreover, the circuit substrate is provided with a step portion for allowing the first electronic part having the greatest height dimension on the first surface and the second electronic part having the greatest height dimension on the second surface to be shifted in an approaching direction with each other along the thickness direction of the card case.

    摘要翻译： 卡式电子设备设置有容纳在卡盒中的平板卡盒和电路模块。 电路模块设置有电路基板，其具有位于与第一表面相对的一侧上的第一表面和第二表面，安装在电路基板的第一表面上的至少一个第一电子部件和安装在电路基板的第一表面上的至少一个第二电子部件 在电路基板的第二表面上。 这里，在第一表面具有最大高度尺寸的第一电子部件和在第二表面上具有最大高度尺寸的第二电子部件以彼此相互偏置的方式彼此相对地放置，同时电路基板插入其间。 此外，电路基板设置有阶梯部，用于允许第一表面具有最大高度尺寸的第一电子部件和在第二表面上具有最大高度尺寸的第二电子部件在彼此接近的方向上移动 沿着卡盒的厚度方向。

    Method for connecting electronic components with dummy patterns
    9.
    发明授权
    Method for connecting electronic components with dummy patterns 失效
    用虚拟图案连接电子元件的方法

    公开(公告)号：US4972580A

    公开(公告)日：1990-11-27

    申请号：US369623

    申请日：1989-06-21

    申请人： Koichiro Nakamura

    发明人： Koichiro Nakamura

    IPC分类号： H01R11/01 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36

    CPC分类号： H01R12/7076 ,  H05K3/361 ,  H01L2224/48091 ,  H05K1/117 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K3/323 ,  Y10T29/49144 ,  Y10T29/53178

    摘要： To electrically connect a plurality of connecting terminals of an electronic component, e.g., a liquid crystal display device (LCD) to a printed circuit board, a plurality of wiring patterns are first formed on the printed circuit board. These wiring patterns have similar shapes to those of the connecting terminals, and have a signal transmission function. Thereafter, a plurality of dummy patterns are formed outside both outermost wiring patterns on the printed circuit board. These dummy patterns have no signal transmission function. Finally, the connecting terminals of the electronic component are electrically connected via an anisotropically conductive sheet to both the wiring patterns and dummy patterns.

    摘要翻译： 为了将诸如液晶显示装置（LCD）的电子部件的多个连接端子电连接到印刷电路板，首先在印刷电路板上形成多个布线图案。 这些布线图形具有与连接端子相似的形状，并且具有信号传输功能。 此后，在印刷电路板上的最外面的布线图案的外部形成多个虚设图案。 这些虚拟图案没有信号传输功能。 最后，电子部件的连接端子通过各向异性导电片电连接到布线图案和虚拟图案。