公开(公告)号：US20180268876A1

公开(公告)日：2018-09-20

申请号：US15985118

申请日：2018-05-21

Applicant: Micron Technology, Inc.

Inventor： Vijayakrishna J. Vankayala

IPC: G11C5/06 ,  G11C8/10 ,  H01L25/065

Abstract: Apparatuses and methods for transmitting die state information between a plurality of dies are described. An example apparatus includes: a plurality of dies, wherein each die of the plurality of dies includes a first through electrode and a second through electrode; a first path including the first electrodes of the plurality of dies in series; and a second path including the first electrodes of the plurality of dies in series. The first path transmits first internal state information related to a first state of at least one die of the plurality of dies. The second path transmits second internal state information related to a second state of at least one die of the plurality of dies.