-
公开(公告)号:US12176031B2
公开(公告)日:2024-12-24
申请号:US17723673
申请日:2022-04-19
Applicant: Micron Technology, Inc.
Inventor: Vijayakrishna J. Vankayala , Hari Giduturi , Jason M. Brown
IPC: G11C11/16 , G11C13/00 , H01L25/065
Abstract: A memory device includes a substrate with two or more memory die stacked in a three-dimensional stacked (3DS) configuration. The memory device includes a clock input configured to receive a clock from a host device. The memory device also includes a command input configured to receive command and address bits from the host device. The two or more memory die each include its own plurality of memory cells. Furthermore, each of the two or more memory die include a local control circuitry configured to receive or transmit a divided clock that is based on the clock.
-
公开(公告)号:US20240265965A1
公开(公告)日:2024-08-08
申请号:US18639690
申请日:2024-04-18
Applicant: Micron Technology, Inc.
Inventor: Vijayakrishna J. Vankayala , Hari Giduturi , Jeffrey E. Koelling , Mingdong Cui , Ramachandra Rao Jogu
CPC classification number: G11C13/0023 , G11C13/0004 , G11C2213/15 , H03K19/20
Abstract: The present disclosure includes apparatuses, methods, and systems for pre-decoder circuitry. An embodiment includes a memory array including a plurality of memory cells, decoder circuitry coupled to the memory array, wherein the decoder circuitry comprises a p-type transistor having a first gate, a first n-type transistor having a second gate, and a second n-type transistor having a third gate, and pre-decoder circuitry configured to provide a bias condition for the first gate, the second gate, and the third gate to provide a selection signal to one of the plurality of memory cells, wherein the bias condition comprises zero volts for the first gate, the second gate, and the third gate for a positive configuration for the memory cells and a negative voltage for the third gate and zero volts for the first gate and the second gate for a negative configuration for the memory cells.
-
公开(公告)号:US20240242746A1
公开(公告)日:2024-07-18
申请号:US18416770
申请日:2024-01-18
Applicant: Micron Technology, Inc.
Inventor: Vijayakrishna J. Vankayala
IPC: G11C7/10
CPC classification number: G11C7/1039 , G11C7/1012 , G11C7/1063 , G11C7/1066 , G11C7/109 , G11C7/1093
Abstract: Methods, systems, and devices for read operations for a memory array and register are described. In some examples, a memory device may include one or more memory arrays and one or more registers (e.g., one or more mode registers). The memory device may include circuitry that allows for a command to access a memory array and a command to access a register to be received consecutively (e.g., during consecutive sets of clock cycles). Because the commands may be received during consecutive sets of clock cycles, the corresponding data may also be output from the memory array and register during consecutive clock cycles.
-
公开(公告)号:US20240241671A1
公开(公告)日:2024-07-18
申请号:US18513438
申请日:2023-11-17
Applicant: Micron Technology, Inc.
Inventor: Kevin G. Werhane , Vijayakrishna J. Vankayala , Tyrel Z. Jensen
IPC: G06F3/06
CPC classification number: G06F3/0659 , G06F3/0604 , G06F3/0679
Abstract: Methods, apparatuses, and systems related to calibrating memory circuitry according to externally provided reference voltage are described. A memory device may include a calibration control logic that at least isolates an internal reference voltage from an internal buffer. The internal buffer may receive and process the externally provided reference voltage instead of command-address signals for calibration purposes.
-
公开(公告)号:US20240070093A1
公开(公告)日:2024-02-29
申请号:US17823443
申请日:2022-08-30
Applicant: Micron Technology, Inc.
Inventor: Hyun Yoo Lee , Kang-Yong Kim , Jason McBride Brown , Venkatraghavan Bringivijayaraghavan , Vijayakrishna J. Vankayala
CPC classification number: G06F13/1621 , G06F13/1689 , G06F13/4068
Abstract: Apparatuses and techniques for implementing an asymmetric read-write sequence for interconnected dies are described. The asymmetric read-write sequence refers to an asymmetric die-access sequence for read versus write operations. The “asymmetric” term refers to a difference in an order in which data is written to or read from interface and linked dies of the interconnected die architecture. The orders for the read and write operations can be chosen such that a delay associated with transferring data between the interconnected dies occurs as data passes between the interface die and a memory controller. With asymmetric read-write burst sequences, overall timing of the read and write operations of a memory device may be impacted less, if at all, by a timing delay associated with the interconnected die architecture.
-
公开(公告)号:US11755506B2
公开(公告)日:2023-09-12
申请号:US17807186
申请日:2022-06-16
Applicant: Micron Technology, Inc.
Inventor: Vijayakrishna J. Vankayala
IPC: G06F13/16 , G06F11/10 , H01L25/065
CPC classification number: G06F13/1668 , G06F11/1004 , G06F11/1076 , H01L25/0657 , H01L2225/0651 , H01L2225/06506 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2225/06586
Abstract: Separate inter-die connectors for data and error correction information and related apparatuses, methods, and computing systems are disclosed. An apparatus including a master die, a target die, inter-die data connectors, and inter-die error correction connectors. The target die includes data storage elements. The inter-die data connectors electrically couple the master die to the target die. The inter-die data connectors are configured to conduct write data bits from the master die to the target die. The write data bits are written to the data storage elements. The inter-die error correction connectors electrically couple the master die to the target die. The inter-die error correction connectors are configured to conduct error correction information corresponding to the write data bits from the master die to the target die. The target die includes error correction circuitry configured to generate new error correction information responsive to the write data bits received from the master die.
-
7.
公开(公告)号:US20230007872A1
公开(公告)日:2023-01-12
申请号:US17369055
申请日:2021-07-07
Applicant: Micron Technology, Inc.
Inventor: Kallol Mazumder , Navya Sri Sreeram , William C. Waldrop , Vijayakrishna J. Vankayala
IPC: G11C11/4076 , G11C11/4096 , G06F3/06
Abstract: Methods of operating a memory device are disclosed. A method may include asserting, at a semiconductor device, an internal signal in response to receipt of a command. The method may also include holding the internal signal in an asserted state for at least a predetermined time duration upon assertion of the internal signal. Further, the method may include generating an enable signal based on the internal signal and a clock signal. Associated devices and systems are also disclosed.
-
8.
公开(公告)号:US20210166742A1
公开(公告)日:2021-06-03
申请号:US16700212
申请日:2019-12-02
Applicant: Micron Technology, Inc.
Inventor: Vijayakrishna J. Vankayala
IPC: G11C7/22 , G11C7/10 , G11C7/06 , G11C11/408
Abstract: Methods of operating a memory device are disclosed. A method may include receiving, at a first die of a number of dies, a first number of bits including one or more command bits, one or more identification bits, and a first number of address bits associated with a command during a first clock cycle. The method may further include conveying, from the first die to at least one other die, at least some of the first number of bits. Further, the method may include receiving, at the first die, a second number of bits including a second number of address bits associated with the command during a second, subsequent clock cycle. Also, the method may include conveying, from the first die to the at least one other die, at least some of the second number of bits. Memory devices and electronic systems are also disclosed.
-
公开(公告)号:US11024349B2
公开(公告)日:2021-06-01
申请号:US16401057
申请日:2019-05-01
Applicant: Micron Technology, Inc.
Inventor: Jason M. Brown , Vijayakrishna J. Vankayala , Todd A. Dauenbaugh
IPC: G11C7/22
Abstract: A memory device includes a first data driver configured to send a first data according to a first clock signal; a first data port electrically coupled to the first data driver, the first data port configured to receive the first data; a second data driver configured to send a second data according to a second clock signal, wherein the second clock signal does not match the first clock signal; and a second data port electrically coupled to the second data driver, the second data port configured to receive the second data.
-
公开(公告)号:US20200219557A1
公开(公告)日:2020-07-09
申请号:US16825759
申请日:2020-03-20
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Vijayakrishna J. Vankayala
IPC: G11C11/406 , G06F1/10 , G06F3/06
Abstract: Devices and methods include organizing memory units of a memory device into a number of groups. The devices and methods also include self-refreshing each group of memory units on different corresponding sequential clock pulses of a self-refresh clock. Specifically, at least one of each group of memory units counts pulses of a self-refresh clock and invokes a self-refresh after every nth pulse of a cycle of pulses while not invoking a self-refresh on all other pulses of the cycle of pulses.
-
-
-
-
-
-
-
-
-